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Cadence Design Systems | 8-K: Current report

Cadence Design Systems | 8-K: Current report

鏗騰電子 | 8-K:重大事件
美股SEC公告 ·  2024/09/06 04:17

牛牛AI助理已提取核心訊息

Cadence Design Systems has entered into an underwriting agreement on September 4, 2024, for a $2.5 billion senior notes offering. The offering comprises three tranches: $500 million of 4.200% notes due 2027, $1.0 billion of 4.300% notes due 2029, and $1.0 billion of 4.700% notes due 2034. The notes will be general unsecured senior obligations, ranking equal to existing and future senior indebtedness.The offering is expected to close on September 10, 2024, subject to customary conditions. The company has partnered with J.P. Morgan Securities, BofA Securities, and HSBC Securities as lead underwriters. The issuance is made under the company's Registration Statement on Form S-3, which became effective on September 3, 2024.Proceeds will be used to repay outstanding amounts under the company's three-year and two-year senior term loan facilities. The remaining funds will support general corporate purposes, including potential debt repayment, working capital, capital expenditures, and acquisitions.
Cadence Design Systems has entered into an underwriting agreement on September 4, 2024, for a $2.5 billion senior notes offering. The offering comprises three tranches: $500 million of 4.200% notes due 2027, $1.0 billion of 4.300% notes due 2029, and $1.0 billion of 4.700% notes due 2034. The notes will be general unsecured senior obligations, ranking equal to existing and future senior indebtedness.The offering is expected to close on September 10, 2024, subject to customary conditions. The company has partnered with J.P. Morgan Securities, BofA Securities, and HSBC Securities as lead underwriters. The issuance is made under the company's Registration Statement on Form S-3, which became effective on September 3, 2024.Proceeds will be used to repay outstanding amounts under the company's three-year and two-year senior term loan facilities. The remaining funds will support general corporate purposes, including potential debt repayment, working capital, capital expenditures, and acquisitions.
鏗騰電子於2024年9月4日達成了一項價格爲250000萬美元的高級票據承銷協議。該發行由三個部分組成:2027年到期的4.200%票據5億美元、2029年到期的4.300%票據10億美元,以及2034年到期的4.700%票據10億美元。這些票據將是一般無擔保的高級債務,與現有和未來的高級債務同等排名。該發行預計將於2024年9月10日完成,需符合常規條件。公司已與摩根大通證券、美銀證券和匯豐證券作爲主要承銷商進行合作。此次發行是依據公司於2024年9月3日生效的S-3表格註冊聲明進行的。所得款項將用於償還公司三年和兩年期的高級貸款設施下的未償還金額。剩餘資金將支持一般企業用途,包括潛在的債務償還、營運資金、資本支出和收購。
鏗騰電子於2024年9月4日達成了一項價格爲250000萬美元的高級票據承銷協議。該發行由三個部分組成:2027年到期的4.200%票據5億美元、2029年到期的4.300%票據10億美元,以及2034年到期的4.700%票據10億美元。這些票據將是一般無擔保的高級債務,與現有和未來的高級債務同等排名。該發行預計將於2024年9月10日完成,需符合常規條件。公司已與摩根大通證券、美銀證券和匯豐證券作爲主要承銷商進行合作。此次發行是依據公司於2024年9月3日生效的S-3表格註冊聲明進行的。所得款項將用於償還公司三年和兩年期的高級貸款設施下的未償還金額。剩餘資金將支持一般企業用途,包括潛在的債務償還、營運資金、資本支出和收購。

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