On May 20, Gelonghui reported that InnoLaser (301021.SZ) recently stated during an investor relations event that the company's wafer-level glass (WLG) processing equipment can achieve automatic batch cutting and splitting functions, with precision reaching the micrometer level, and has been delivered in bulk to AAC TECH.
Inno Laser (301021.SZ): Wafer-level glass (WLG) processing equipment can achieve batch automatic cutting and splitting functions, and has been delivered in bulk to AAC TECH.
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