Reported Earlier, Micron Strengthens Semiconductor Ecosystem With $7B Singapore HBM Facility
Reported Earlier, Micron Strengthens Semiconductor Ecosystem With $7B Singapore HBM Facility
早些時候報道,美光在新加坡加大投資,建立70億的HBM設施,強化半導體生態系統。
Micron's HBM advanced packaging investment of approximately US $7 billion (SG$9.5 billion) through the end of the decade and beyond will initially create around 1,400 jobs, with site expansion plans to reach an estimated 3,000 jobs in the future. These new roles will include functions such as packaging development, assembly and test operations.
美光的HBM先進封裝投資約爲70億美元(新元95億),到本十年末及以後初步將創造約1400個就業崗位,未來隨着場地擴建計劃,預計將達到3000個職位。這些新職位將包括封裝開發、組裝和測試運營等職能。
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