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STMicroelectronics Introduces First STM32-ready Wireless IoT Modules Leveraging Collaboration With Qualcomm

STMicroelectronics Introduces First STM32-ready Wireless IoT Modules Leveraging Collaboration With Qualcomm

意法半導體推出首個STM32就緒的無線物聯網模塊,藉助與高通的合作。
GlobeNewswire ·  16:00

P4666S -- Dec 11 2024 -- ST67W611 Qualcomm module_IMAGE

P4666S -- 2024年12月11日 -- ST67W611高通模塊_IMAGE

First ST Wi-Fi 6 network coprocessor modules
第一代Wi-Fi 6網絡協處理器模塊

STMicroelectronics introduces first STM32-ready wireless IoT modules leveraging collaboration with Qualcomm

意法半導體推出首個STM32準備好的無線物聯網模塊,藉助與高通的合作

WiFi6/Bluetooth 5.3/Thread ST67W611M1 modules accelerate development and boosts flexibility to deliver advanced consumer and industrial IoT solutions

WiFi6/藍牙5.3/Thread ST67W611M1模塊加速開發,提升靈活性,以提供先進的消費和工業物聯網解決方案

Geneva, Switzerland, December 11, 2024 – STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, has introduced the first product of its strategic collaboration with Qualcomm Technologies to simplify development of next-generation wireless solutions for industrial and consumer IoT applications. The collaboration aims to deliver initially IoT modules leveraging ST's powerful STM32 ecosystem and Qualcomm Technologies' leading wireless connectivity solutions.

瑞士日內瓦,2024年12月11日 – 意法半導體(紐交所:STM),一家全球領先的半導體公司,爲各類電子應用的客戶提供服務,推出了與高通科技戰略合作的首個產品,以簡化下一代無線解決方案在工業和消費物聯網應用中的開發。該合作旨在最初提供利用意法強大的STM32生態系統和高通科技領先的無線連接解決方案的物聯網模塊。

The first of these modules, the ST67W611M1, contains a Qualcomm QCC743 multiprotocol connectivity system-on-a-chip (SoC), pre-loaded with Wi-Fi6, Bluetooth 5.3 qualified, and Thread combo, made easy to integrate with any STM32 microcontroller (MCU) or microprocessor (MPU). The module will support Matter protocol over Wi-Fi for future-proof connectivity, making the STM32 portfolio seamlessly accessible to the Matter ecosystem. Aiding the system integration, the module also contains 4Mbyte Flash for code and data storage, and a 40MHz crystal. There is also an integrated PCB antenna or micro RF (uFL) connector for an external antenna.

第一個模塊ST67W611M1包含一個高通QCC743多協議連接系統芯片(SoC),預裝WIFI6、藍牙5.3認證和Thread組合,便於與任何STM32微控制器(MCU)或微處理器(MPU)集成。該模塊將支持WIFI上的Matter協議,以實現未來兼容性,使STM32產品組合可以無縫接入Matter生態系統。爲了輔助系統集成,該模塊還包含4M字節的Flash用於代碼和數據存儲,並採用40MHz晶體。還有一個集成的蘋果PCB天線或微型RF(uFL)連接器用於外部天線。

"Our collaboration delivers multiple advantages for the large community that leverage the STM32 family in their embedded systems," said Remi El-Ouazzane, President, Microcontrollers, Digital ICs and RF Products Group (MDRF) at STMicroelectronics. "Qualcomm's expertise in highly influential and widely used wireless connectivity technologies is now at product developers' fingertips and combines with the powerful software, tools, features and project acceleration offered by the STM32 development ecosystem."

「我們的合作爲大量利用STM32系列進行嵌入式系統的社區提供了多重優勢,」意法半導體微控制器、數字IC和RF產品集團(MDRF)總裁Remi El-Ouazzane說。「高通在極具影響力和廣泛使用的無線連接技術方面的專業知識現在觸手可及,同時結合了STM32開發生態系統提供的強大軟件、工具、功能和項目加速。」

"This is just the beginning of our mission, which we expect to deliver many further successes enabling new and advanced edge processing applications," said Rahul Patel, Group General Manager, Connectivity, Broadband and Networking Business Unit, Qualcomm Technologies, Inc. "We look forward to continuing our collaboration with STMicroelectronics to bring more unparalleled connected experiences with Wi-Fi, Bluetooth, AI, 5G and more."

「這只是我們使命的開端,我們期待實現更多成功,推動新型和先進的邊緣處理應用,」高通技術公司連接、寬帶和網絡業務單元的集團總經理Rahul Patel說。「我們期待與意法半導體繼續合作,帶來更多無與倫比的連接體驗,包括WIFI、藍牙、人工智能、5G等。」

Advanced hardware security is built in, with hardware cryptographic accelerators, as well as services including secure boot and secure debug, reaching PSA Certified Level 1 protection. The module is self-contained and pre-certified according to mandatory specifications, requiring no RF design expertise from the user to create a working solution. Highly integrated in a 32-lead LGA package, it is ready to place on the board and permits simple, low-cost PCB designs with as few as two layers.

先進的硬件安防內置,其中包括硬件加密加速器,以及安全啓動和安全調試等服務,使其達到PSA認證一級保護。該模塊是自包含的,並根據強制性規格進行預認證,用戶無需具備RF設計專業知識即可創建可行解決方案。高度集成在32引腳LGA封裝中,準備放置在電路板上,並允許具有僅兩層的簡單、低成本蘋果PCB設計。

The ST67W611M1 leverages the STM32 ecosystem, which contains over 4,000 commercial part numbers, powerful STM32Cube tools and software, and enhancements that boost edge AI development. AI enhancements include the recently introduced STM32N6 MCUs, which contain ST's Neural-ART Accelerator, and the ST Edge AI Suite that provides an AI Model Zoo and STM32Cube.AI and NanoEdge AI optimization tools.

ST67W611M1利用STM32生態系統,該系統包含超過4000個商業零件號、強大的STM32Cube工具和軟件,以及增強推動邊緣人工智能開發的功能。人工智能增強包括最近推出的STM32N6微控制器,其中包含ST的Neural-ARt加速器,以及提供AI模型庫和STM32Cube.AI和NanoEdge AI優化工具的St Edge AI套件。

The modules are designed to be quickly and seamlessly integrated with any STM32 microcontroller or STM32 microprocessor, which offer flexible options for performance, price, and power across a broad spectrum. The MCUs available range from cost- and power-sensitive devices containing the Arm Cortex-M0+ core to devices containing high performing cores such as Cortex-M4 and Cortex-A7 in the STM32MP1/2 MPUs.

這些模塊設計用於快速無縫集成到任何STM32微控制器或STM32微處理器中,提供在廣泛範圍內的性能、價格和功率靈活性的選項。可用的微控制器範圍包括從包含Arm Cortex-M0+內核的低成本和低功耗設備,到包含高性能內核(如Cortex-M4和Cortex-A7)在STM32MP1/2 MPU中的設備。

Samples of the ST67W611M1 are available, with OEM availability in Q1 2025, with broader availability in Q2 2025. To request samples and pricing options please contact your local ST sales office.

ST67W611M1的樣品現已提供,OEM的可用性在2025年第一季度,更廣泛的可用性將在2025年第二季度。如需請求樣品和定價選項,請聯繫您當地的ST銷售辦公室。

For more information, please go to
You can also refer to the press release of October 2024: STMicroelectronics and Qualcomm enter strategic collaboration in wireless IoT

如需更多信息,請訪問
您還可以參考2024年10月的新聞稿:意法半導體與高通在無線物聯網領域建立戰略合作關係

STM32 is a registered and/or unregistered trademark of STMicroelectronics International NV or its affiliates in the EU and/or elsewhere. In particular, STM32 is registered in the US Patent and Trademark Office.

STM32是意法半導體國際NV或其在EU及其他地區的關聯公司註冊和/或未註冊的商標。特別是在美國專利商標局註冊了STM32。

Qualcomm and Snapdragon products mentioned within this press release are offered by Qualcomm Technologies, Inc. and/or its subsidiaries. Qualcomm and Snapdragon are trademarks or registered trademarks of Qualcomm Incorporated.

新聞稿中提到的高通和驍龍產品由高通技術公司及/或其子公司提供。高通和驍龍是高通公司的商標或註冊商標。

About STMicroelectronics
At ST, we are over 50,000 creators and makers of semiconductor technologies mastering the semiconductor supply chain with state-of-the-art manufacturing facilities. An integrated device manufacturer, we work with more than 200,000 customers and thousands of partners to design and build products, solutions, and ecosystems that address their challenges and opportunities, and the need to support a more sustainable world. Our technologies enable smarter mobility, more efficient power and energy management, and the wide-scale deployment of cloud-connected autonomous things. We are committed to achieving our goal to become carbon neutral on scope 1 and 2 and partially scope 3 by 2027. Further information can be found at .

關於意法半導體
在意法半導體,我們有超過50,000名半導體技術的創造者和製造者,掌握着半導體供應鏈,並擁有先進的製造設施。作爲一家集成器件製造商,我們與超過200,000名客戶和數千個合作伙伴合作,設計和構建解決方案和生態系統,以應對他們的挑戰和機遇,支持更加可持續的世界。我們的技術使得更智能的移動性、更加高效的電力和能源管理,以及雲連接的自主物體的廣泛部署成爲可能。我們致力於實現到2027年在範圍1和2部分範圍3上達到碳中和的目標。更多信息請查看。

For Press Information Contact:

媒體信息請聯繫:

INVESTOR RELATIONS
Jérôme Ramel
EVP Corporate Development & Integrated External Communication
Tel: +41.22.929.59.20
jerome.ramel@st.com

投資者關係
傑羅姆·拉梅爾
企業發展及綜合外部溝通副總裁
電話:+41.22.929.59.20
jerome.ramel@st.com

MEDIA RELATIONS
Alexis Breton
Corporate External Communications
Tel: +33.6.59.16.79.08
alexis.breton@st.com

媒體關係
亞歷克西斯·布雷頓
公司對外溝通
電話:+33.6.59.16.79.08
alexis.breton@st.com

Attachments

附件

  • P4666S -- Dec 11 2024 -- ST67W611 Qualcomm module_FINAL FOR PUBLICATION
  • P4666S -- Dec 11 2024 -- ST67W611 Qualcomm module_IMAGE
  • P4666S -- 2024年12月11日 -- ST67W611 高通模塊_最終出版
  • P4666S -- 2024年12月11日 -- ST67W611 高通模塊_圖像

譯文內容由第三人軟體翻譯。


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