Microsoft Launches Custom Silicon Advancements With New DPU and Data Center Security Chips
Microsoft Launches Custom Silicon Advancements With New DPU and Data Center Security Chips
This DPU addition is part of Microsoft's expanding custom silicon portfolio, which already includes proprietary CPUs such as Maia and Cobalt. The Azure Boost DPU is specifically designed to optimize network performance during high-intensity tasks like AI training. TMTPOST -- Microsoft has introduced its first in-house data processing unit (DPU), named the Azure Boost DPU, to enhance performance and efficiency in its cloud servers. Announced at the Microsoft Ignite event, the custom silicon is designed to handle intensive data workloads while consuming less power.
TMTPOSt -- 微軟推出了首個內部數據處理單元（DPU），名爲Azure Boost DPU，以增強其雲計算服務器的性能和效率。在微軟Ignite活動上宣佈，該定製硅芯片旨在處理密集數據工作負載，同時消耗更少的電力。
The Azure Boost DPU uses a lightweight data-flow operating system, enabling cloud storage tasks to operate with up to three times less power and four times the performance of traditional CPUs.
Azure Boost DPU使用輕量化數據流操作系統，使雲存儲任務的功耗降低至傳統CPU的三分之一，同時性能提高四倍。
"Azure Boost DPU integrates high-speed Ethernet and PCIe interfaces along with network and storage engines, data accelerators, and security features into a fully programmable system on chip," wrote Pradeep Sindu, CVP for silicon at Microsoft, in a blog post.
「Azure Boost DPU集成了高速Ethernet和PCIe接口，以及網絡和存儲引擎、數據加速器和安防功能於一體的完全可編程的系統芯片，」微軟硅芯片副總裁Pradeep Sindu在一篇發帖中寫道。
This DPU addition is part of Microsoft's expanding custom silicon portfolio, which already includes proprietary CPUs such as Maia and Cobalt. The Azure Boost DPU is specifically designed to optimize network performance during high-intensity tasks like AI training.
此DPU的增加是微軟不斷擴展的定製硅芯片組合的一部分，該組合已經包括專有CPU，如Maia和Cobalt。Azure Boost DPU專門旨在優化在高強度任務（如人工智能訓練）期間的網絡性能。
Microsoft's announcement follows AMD's introduction of its Pensando Salina 400 and Pensando Pollara 400 DPUs in October, signaling the rapid growth of the DPU market.
微軟的公告緊隨AMD在十月推出的Pensando Salina 400和Pensando Pollara 400 DPU，標誌着DPU市場的快速增長。
Meanwhile, Microsoft unveiled the Azure Integrated Hardware Security Module (HSM), a custom-developed security chip aimed at bolstering data center security. Scheduled for deployment in new servers starting in 2025, the Azure Integrated HSM enhances protection by keeping encryption and signing keys securely on the hardware, without compromising performance or latency.
與此同時，微軟發佈了Azure集成硬件安全模塊（HSM），這是一款定製開發的安全芯片，旨在增強idc概念的安全性。計劃於2025年在新服務器中部署，Azure集成HSM通過在硬件上安全地保存加密和簽名密鑰來增強保護，而不影響性能或延遲。
"As a server-local HSM, Azure Integrated HSM provides industry-leading in-use key protection without the latency issues of network-attached HSM calls," explained Mark Russinovich, CTO and technical fellow at Microsoft Azure.
「作爲服務器本地HSM，Azure集成HSM提供了行業領先的使用中密鑰保護，而沒有網絡附加HSM調用的延遲問題，」微軟Azure的首席技術官和技術研究員Mark Russinovich解釋道。
Microsoft's acquisition of Fungible in late 2023 set the stage for the development of the Azure Boost DPU. Fungible's specialization in data-centric silicon provided the foundation for designing a chip that consolidates essential functions into a unified package.
微軟在2023年底收購Fungible爲Azure Boost DPU的開發奠定了基礎。Fungible在數據中心硅方面的專業知識爲設計一個將關鍵功能整合到統一封裝中的芯片提供了基礎。
This initiative complements Microsoft's partnership with Intel Foundry, which is set to produce Microsoft's next-generation chips using its advanced 18A process node starting in 2024.
這一舉措補充了微軟與英特爾代工廠的合作，後者將在2024年開始生產微軟的下一代芯片，使用其先進的18A工藝節點。
譯文內容由第三人軟體翻譯。
