Will strengthen company's production system as primary facility for power module assembly
TOKYO--(BUSINESS WIRE)--Mitsubishi Electric Corporation (TOKYO: 6503) announced today that it will invest approximately 10 billion yen to construct a new facility for the assembly and inspection of power semiconductor modules at its Power Device Works in Fukuoka Prefecture, Japan. The plant, which was originally announced on March 14, 2023, is scheduled to begin operations in October 2026.
As the primary facility for assembling and inspecting power semiconductor modules, the plant will consolidate previously dispersed assembly and inspection production lines within the site to streamline production, from the incoming of components through manufacturing and final shipment. New systems will be implemented to automate the management of manufacturing processes and the transportation of products for improved productivity. In addition, the company's integrated system covering everything from design, development and production technology verification to manufacturing will be strengthened to enhance product development.
Mitsubishi Electric expects the new plant to support its rapid and stable supply of products to meet market needs in response to the anticipated increases in demand for power semiconductors. As a result, the company envisions contributing to the energy efficiency of power-electronics devices in various applications, as well as the Green Transformation (GX).
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Customer Inquiries
Semiconductor & Device Marketing Div.A
Mitsubishi Electric Corporation
Media Inquiries
Takeyoshi Komatsu
Public Relations Division
Mitsubishi Electric Corporation
Tel: +81-3-3218-2332
prd.gnews@nk.MitsubishiElectric.co.jp
