Gelonghui November 14 | Xing Sen Technology (002436.SZ) said on the investor interactive platform that the company's FCBGA packaging board project has delivered sample orders in application areas including servers, AI chips, intelligent driving, switches, etc. Product sealing and reliability verification are continuing, and feedback has been received that no abnormalities in the substrate have been found in the sealing and testing results. Small-batch production order products are used in AI-related fields.
兴森科技(002436.SZ)：小批量量产订单产品应用于AI相关领域
Shenzhen fastprint circuit tech (002436.SZ): Small batch production order products are applied in AI-related fields.
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