STMicroelectronics Hosts Premier Industrial Summit in Shenzhen
STMicroelectronics Hosts Premier Industrial Summit in Shenzhen
Visitors will hear insightful keynotes and 28 technical presentations from ST, its customers and partners, and can explore over 150 demonstrations targeting three main market segments: Automation, Power & Energy, and Motor Control. Additionally, the event will feature 6 showstoppers developed in close collaboration with ST's customers and partners, presenting innovative technologies, solutions, and products in the areas of growing demand from the end markets, including Silicon Carbide (SiC) and Gallium Nitride (GaN), power supply for AI data center, High Power Thermal Management system, Automation Production Line, the Solar-Storage-Charging Integration demo, and various solutions from the Ecosystem Partners of ST.STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, will host the Industrial Summit 2024 on October 29 at the Futian Shangri-La Hotel, in Shenzhen, China.
意法半導體（紐交所：STM），作爲全球半導體領導者，爲跨電子應用領域的客戶提供服務，將於2024年10月29日在中國深圳福田香格里拉酒店舉辦工業峯會。
Recognizing the significant challenges posed by climate change, ST has consistently demonstrated its unwavering commitment to sustainability. The Company is dedicated to improving power density and efficiency through its cutting-edge solutions, leading the way towards reduced carbon emissions and a sustainable future.
鑑於氣候變化帶來的重大挑戰，意法公司始終展現出對可持續發展的不懈承諾。公司致力於通過其尖端解決方案提高功率密度和效率，引領降低碳排放和可持續未來的道路。
The Industrial Summit is a top-notch technology showcase that highlights the breadth and depth of ST's industrial products and solutions. Into its 6th edition, this year's event continues the overarching theme of "Powering Your Sustainable Innovation", with a focus on Smart Power and Smart Industrials for a sustainable future.
工業峯會是一個頂尖的技術展示會，突顯了意法工業產品和解決方案的廣度和深度。進入第六屆，今年的活動延續了「爲您的可持續創新提供動力」的主題，重點關注智能動力和智能工業，助力可持續未來。
Visitors will hear insightful keynotes and 28 technical presentations from ST, its customers and partners, and can explore over 150 demonstrations targeting three main market segments: Automation, Power & Energy, and Motor Control. Additionally, the event will feature 6 showstoppers developed in close collaboration with ST's customers and partners, presenting innovative technologies, solutions, and products in the areas of growing demand from the end markets, including Silicon Carbide (SiC) and Gallium Nitride (GaN), power supply for AI data center, High Power Thermal Management system, Automation Production Line, the Solar-Storage-Charging Integration demo, and various solutions from the Ecosystem Partners of ST.
訪客將聆聽意法、其客戶和合作夥伴的深度主題演講和28場技術演示，並可探索超過150個針對自動化、電力與能源、以及電機控制三大市場領域的展示。此外，活動還將展示與意法客戶和合作夥伴緊密合作開發的6個明星產品，展示在物聯網、人工智能數據中心、高功率熱管理系統、自動化生產線、太陽能-儲能充電集成演示等終端市場需求增長領域的創新技術、解決方案和產品，以及意法的生態方案夥伴提供的各種解決方案。
Showstopper and demo highlights
明星產品和演示亮點
ST's 25+ Years of SiC Leadership: ST brings value to its customers through mastery of the full silicon carbide (SiC) value chain, from R&D, substrate, epitaxy, and wafer fabrication to assembly and packaging of power discretes and modules. At this year's Industrial Summit, the SiC showstopper will demonstrate ST as a global SiC leader in market, innovation and manufacturing, with a broad portfolio of STPOWER MOSFETs and diodes adapted for key industrial and automotive applications. Visitors will get a comprehensive overview of the development and manufacturing of SiC devices, from powder to the end product.
意法超過25年的碳化硅（SiC）領導力：意法通過對碳化硅（SiC）全價值鏈的掌握爲客戶創造價值，從研發、襯底、外延生長、硅片製造-半導體、到功率器件和模塊的裝配和封裝。在今年的工業峯會上，碳化硅（SiC）明星產品將展示意法作爲全球碳化硅市場、創新和製造領域的領導者，擁有廣泛的STPOWER MOSFET和二極管組合，適用於關鍵的工業和汽車應用。訪客將全面了解碳化硅器件的開發和製造過程，從原料粉到最終產品。
ST's cutting-edge SiC MOSFET and diode portfolio, complemented by STGAP galvanic isolated drivers, delivers high efficiency, reliability, and performance in different packages. It will be demonstrated at the Summit through various reference designs for energy storage and power supply for AI servers, as well as other high-power applications.
意法半導體最先進的碳化硅金屬氧化物半導體場效應晶體管和二極管系列，配合STGAP光耦隔離驅動器，在不同封裝中提供高效率、可靠性和性能。在峯會上，將通過各種參考設計展示其在能量存儲和供電給人工智能服務器等高功率應用中的應用。
Next-Generation Data Center Infrastructure from Megawatt to Gigawatt: The AI and data communications sectors, currently responsible for 4% of global carbon emissions, are projected to reach 14% of emissions by 2040. Adopting heat recovery, liquid cooling, HVDC (High Voltage Direct Current), high-efficiency PSUs (Power Supply Unit), and new power-semiconductor technologies can further reduce power consumption.
從兆瓦到吉瓦的下一代數據中心基礎設施：目前佔全球碳排放的4%的人工智能和數據通信領域預計到2040年將達到14%的排放量。採用熱回收、液冷卻、HVDC（高壓直流）、高效率電源單元(PSU)和新的功率半導體技術可以進一步降低能耗。
Rapid advancements in power technology, including through new semiconductor materials like SiC and GaN (Gallium Nitride) driven by STGAP galvanic isolation gate drivers, will help further moderate the growth in energy demand from data centers. Highlighting ST's capabilities is a 5.5 kW power supply for AI data centers using SiC for greater efficiency and better power density. In addition, with STPOWER MDmesh M9/DM9 series super-junction power MOSFETs, ST sets a benchmark for the 600V/650V super-junction technology combining best-in-class performance with remarkable ease of use. Tailored for both hard- and soft-switching topologies, the MDmesh M9 and DM9 series are ideal for AI server data centers. Moreover, the STM32G4 microcontrollers bring intelligence and advanced control to our power solutions, allowing us to better manage power distribution and adapt to fluctuating loads in real-time.
通過SiC和氮化鎵等新型半導體材料的快速技術進步，結合STGAP光耦隔離門驅動器，將有助於進一步調節數據中心對能源需求的增長。意法半導體的5.5千瓦功率供應爲人工智能數據中心使用SiC提供了更高效率和更好的功率密度。此外，藉助STPOWER MDmesh M9/DM9系列超結電源金屬氧化物半導體場效應晶體管，意法半導體爲600V/650V超結技術設立了一個新的基準，結合卓越的性能和卓越的易用性。定製針對硬開關和軟開關拓撲的MDmesh M9和DM9系列非常適合用於人工智能服務器數據中心。此外，STM32G4微控制器爲我們的功率解決方案帶來智能和先進的控制功能，使我們能夠更好地管理電能分配並實時適應波動負載。
In addition, transitioning to HVDC infrastructure can further enhance data-center efficiency by reducing transmission losses and energy consumption. ST's SiC technology, paired with advanced packaging, enables HVDC systems to excel in high-temperature environments.
此外，過渡到高壓直流(HVDC)基礎設施可以通過減少傳輸損耗和能耗進一步提高數據中心的效率。意法半導體的碳化硅技術，搭配先進封裝，使HVDC系統在高溫環境下表現出色。
High-Power Thermal-Management Systems: The demand for high-power cooling solutions is rapidly increasing across various sectors, driven by significant growth in HVAC (Heating, Ventilation, Air Conditioning) systems, AI data centers infrastructure management, and grid-scale battery energy storage.
高功率熱管理系統：隨着暖通空調系統、人工智能數據中心基礎設施管理和電網規模電池能量存儲市場的顯著增長，各個領域對高功率冷卻解決方案的需求迅速增加。
ST provides a comprehensive set of high-power cooling solutions to address differentiated power ranges and architectures. At this showstopper, ST will showcase its latest 10kW Commercial Compressor solution, which innovates using one single STM32G4 microcontroller (MCU) to control multiple functions, including three-phase PFC Vienna, FOC (Field Oriented Control) motor control, Nano Edge AI predictive maintenance, and KNX. This solution also delivers robust and reliable performance with ST's 1200V IGBTs and SiC diodes, plus STGAP galvanically isolated gate drivers. Also, two other solutions will be featured at this showstopper: the 7kW triple FOC and interleaved PFC, and 4kW Dual FOC and Interleaved PFC. These solutions ensure efficient and reliable performance to meet different customer specifications for heat pumps and commercial air conditioning, based on ST's SLLIMM Intelligent Power Modules, and Power Management and Analog ICs
ST提供一套全面的高功率冷卻解決方案，以滿足不同的功率範圍和架構需求。在這個展示中，ST將展示其最新的10kW商用壓縮機解決方案，通過使用一個單獨的STM32G4微控制器（MCU）來控制多個功能，包括三相PFC維也納、FOC（磁場定向控制）電機控制、Nano Edge人工智能預測性維護和KNX。該解決方案還通過使用ST的1200V IGBT和SiC二極管以及STGAP電氣隔離門極驅動器，提供強大可靠的性能。此外，另外兩個解決方案也將被展示：7kW三相FOC和交織PFC，以及4kW雙FOC和交織PFC。這些解決方案可以確保高效可靠的性能，以滿足熱泵和商用空調的不同客戶規格需求，基於ST的SLLIMm智能功率模塊以及功率管理和模擬ICs。
Automated Assembly Line System: This groundbreaking automated assembly line system is the first of its kind at ST and represents the largest demonstration at the Industrial Summit 2024. An unprecedented factory-automation system underscores ST's comprehensive ecosystem of partners and extensive system-level expertise in embedded systems. This demo features a complex automation system that integrates 3 robotic arms, which communicate precisely with an AGV (Automated Guided Vehicle) to transfer items running on an MTS (Maglev Track System) driven by 7 ST dual motor servo drive solutions. All these components are managed by an ST Programmable Logic Controller (PLC), navigating through a variety of standards such as Codesys, EtherCAT, Profinet, Sub-1G, IO-Link, and more. This demo is further enhanced in collaboration with Siemens automation solutions, enabling seamless integration like the PLC (Programmable Logic Controller) and HMI, which reflects accuracy, reliability and precision.
自動化裝配線系統：這款開創性的自動化裝配線系統是意法半導體的首創，代表了2024年工業峯會的最大展示。前所未有的工廠自動化系統突顯了ST在嵌入式系統的全面合作伙伴生態系統和廣泛的系統級專業知識。此演示展示了一個複雜的自動化系統，集成了3個機器人臂，與AGV（自動引導車）精準通信，將物品轉移到由7個ST雙電機伺服驅動解決方案驅動的MTS（磁懸浮軌道系統）。所有這些元件都由ST可編程邏輯控制器（PLC）管理，通過各種標準，如Codesys、EtherCAt、Profinet、Sub-1G、IO-Link等進行導航。此演示還與西門子自動化解決方案合作，實現了諸如PLC（可編程邏輯控制器）和HMI的無縫集成，體現了準確性、可靠性和精度。
This impressive system demonstrates all major ST technologies for automation systems, including STM32 MCUs for HMI (Human Machine Interface), STM32MP1/2 Microprocessor Units (MPUs) for PLC processing, and a wide variety of analog products like IPS (intelligent power switches) for control. The system also covers different connectivity technologies for both wired (such as IO-link) and wireless, where the ST ultra-low power MCUs can bring added value in battery life.
這個令人印象深刻的系統展示了意法半導體用於自動化系統的所有主要技術，包括用於HMI（人機界面）的STM32MCUs，用於PLC處理的STM32MP1/2微處理器單元（MPUs），以及各種用於控制的模擬產品，如IPS（智能功率開關）。該系統還涵蓋了不同的有線（如IO-link）和無線連接技術，意法半導體的超低功率MCUs在電池壽命方面可以帶來附加價值。
Lastly, ST technologies include Industrial sensors (such as ToF proximity sensors, MEMS and IR sensors, IMUs, accelerometers, vibrometers, pressure sensors), ST25R for RFID read/write and Industrial actuators for the robotic arms, and the massive 14 PMSM linear motors are well covered by ST gate drivers and motion control ICs, wide LV and HV MOSFETS, IPS, Power management IC, and all this requires good protection devices for both input (CLTxx) and output (SMAJxx). In total, more than 500 ST devices are utilized across various HMIs, PLC controllers, drivers, RFID readers, gateways, connectivity devices, sensors, servo motors, and other components.
最後，St技術包括工業傳感器（如ToF接近傳感器、MEMS和紅外傳感器、IMU、加速度計、振動計、壓力傳感器），用於RFID讀寫的ST25R，用於機器人臂的工業執行器，以及大規模的14 PMSm線性電機由St門極驅動器和運動控制ICs覆蓋，寬LV和HV MOSFETs，IPS，功率管理IC，所有這些都需要良好的保護裝置，包括輸入（CLTxx）和輸出（SMAJxx）。總共，超過500個St設備應用於各種HMI、PLC控制器、驅動器、RFID讀卡器、網關、連接設備、傳感器、伺服電機和其他元件。
Solutions from Ecosystem Partners: To tackle the diverse challenges of the highly fragmented industrial market, ST is collaborating with technology leaders, key industrial customers, and ecosystem partners to accelerate growth and meet local market needs. Beyond the major highlights above, additional demos showcasing collaborations between ST and its ecosystem partners will be featured, including the Carbon Management solutions from ST's customer Sungrow iCarbon, the Solar-Storage-Charging Integration Digital Energy Management solution from ST's distributor WT Microelectronics, and multiple innovations from Joint Labs between ST and some leading Chinese universities.
生態系統合作伙伴提供的解決方案：爲了應對高度分散的工業市場的各種挑戰，St正在與技術領導者、主要工業客戶和生態系統合作伙伴合作，加速增長並滿足當地市場需求。除了上述主要亮點外，還將展示St與其生態系統合作伙伴之間的合作關係，包括ST客戶Sungrow iCarbon提供的碳管理解決方案、ST經銷商Wt Microelectronics提供的太陽能-儲能-充電集成數字能源管理解決方案，以及St與一些領先的中國高校之間的聯合實驗室的多項創新。
Join us at the Industrial Summit 2024 in Shenzhen to experience all the attractions and demos from ST and its customers and partners. The entire day's proceedings will be livestreamed in both English and Mandarin. Additionally, a live photo album will be available here.
加入我們，2024年在深圳舉辦的工業峯會，體驗來自St及其客戶和合作夥伴的所有吸引力和演示。整個活動當天的所有進程將以英文和普通話進行直播。此外，現場照片集將在此提供。
About STMicroelectronics
At ST, we are over 50,000 creators and makers of semiconductor technologies mastering the semiconductor supply chain with state-of-the-art manufacturing facilities. An integrated device manufacturer, we work with more than 200,000 customers and thousands of partners to design and build products, solutions, and ecosystems that address their challenges and opportunities, and the need to support a more sustainable world. Our technologies enable smarter mobility, more efficient power and energy management, and the wide-scale deployment of the Internet of Things and connectivity. We are committed to achieving our goal to become carbon neutral on scope 1 and 2 and partially scope 3 by 2027. Further information can be found at .
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在St，我們有超過50,000名半導體技術的創造者和製造者，掌握先進製造設施的半導體供應鏈。作爲一家集成設備製造商，我們與超過200,000名客戶和數千名合作伙伴合作，設計和構建產品、解決方案和生態系統，以解決他們面臨的挑戰和機遇，並支持更可持續的世界。我們的技術實現更智能的移動性、更有效的電力和能源管理，以及物聯網和連接技術的大規模部署。我們致力於在2027年前實現成爲碳中立（在第1和第2範圍部分在第3範圍內）。更多信息，請訪問。
譯文內容由第三人軟體翻譯。
