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Aehr Test Systems to Present at The LD Micro Main Event XVII Investor Conference in Los Angeles on October 29, 2024

Aehr Test Systems to Present at The LD Micro Main Event XVII Investor Conference in Los Angeles on October 29, 2024

aehr test systems將於2024年10月29日在洛杉磯舉行的LD Micro Main Event XVII投資者會議上進行演講。
newsfile ·  10/22 04:05

Fremont, California--(Newsfile Corp. - October 21, 2024) - Aehr Test Systems (NASDAQ: AEHR), a worldwide supplier of semiconductor test and burn-in equipment, today announced that President and CEO Gayn Erickson will be presenting at the 17th annual LD Micro Main Event Conference on Tuesday, October 29, 2024 at 2:30 pm PT at the Luxe Sunset Boulevard Hotel in Los Angeles, and will be meeting with investors throughout the day. You may register to watch the presentation here.

加利福尼亞弗利蒙特——(Newsfile Corp. - 2024年10月21日)- 半導體測試和老化設備供應商aehr test systems(納斯達克:AEHR)今日宣佈,總裁兼首席執行官蓋恩·埃裏克森(Gayn Erickson)將於2024年10月29日星期二下午2:30在洛杉磯的Luxe Sunset Boulevard Hotel參加第17屆年度LD Micro Main Event大會,並將全天與投資者會面。您可以在此處註冊觀看演示。

"I look forward to discussing with investors and shareholders our unique wafer level test and package part burn-in solutions for semiconductor production and the markets they serve, including our recent acquisition of Incal Technology and new high power packaged part reliability/burn-in test solutions that expand our addressable market within the rapidly growing artificial intelligence (AI) semiconductor market," said Mr. Erickson. "Aehr Test provides complete turn-key solutions for improving quality, reliability, and yield of semiconductors such as silicon carbide devices used in electric vehicles and charging infrastructure, gallium nitride devices for multiple power conversion applications, and silicon photonics devices used in data centers and 5G infrastructure and optical input/output (I/O) and co-packaged optics devices as well as AI processors in both wafer level and packaged part device forms. The adoption of wafer level test and packaged parts burn-in of these devices is a significant growth driver for Aehr Test."

「我期待與投資者和股東討論我們針對半導體生產的獨特晶片級測試和封裝部件老化解決方案,以及它們所服務的市場,包括我們最近收購的Incal Technology以及新的高功率封裝部件可靠性/老化測試解決方案,擴大了我們在快速增長的人工智能(AI)半導體市場中的可尋址市場,」埃裏克森先生說。「aehr test systems提供全面的完整解決方案,用於提高半導體(如碳化硅器件用於新能源車和充電基礎設施、氮化鎵器件用於多種功率轉換應用、硅光子器件用於數據中心和5g概念基礎設施以及光學輸入/輸出(I/O)和共封裝光學器件以及晶片級和封裝部件設備形式中的AI處理器)的質量、可靠性和產量。對這些器件進行晶片級測試和封裝部件老化是aehr test systems的重要增長動力。」

The 2024 LD Micro Main Event XVII will be held at the Luxe Sunset Boulevard Hotel in Los Angeles from October 28th to the 30th, and will host 150 companies for two days of presentations and one-on-one investor meetings.

2024年LD Micro Main Event XVII將於10月28日至30日在洛杉磯的Luxe Sunset Boulevard Hotel舉行,將邀請150家公司進行爲期兩天的演示和一對一投資者會議。

About LD Micro
LD Micro aims to be the most essential resource in the micro-cap world. Whether it is the Index, comprehensive data, or hosting the most significant events annually, LD's sole mission is to serve as an invaluable asset for all those interested in finding the next generation of great companies. To learn more about LD Micro, visit .

關於LD Micro
LD Micro的目標是成爲微型公司領域最重要的資源。無論是指數、全面數據,還是每年舉辦的最重要的活動,LD的唯一使命就是成爲所有對發現下一代優秀公司感興趣的人的寶貴資產。要了解更多關於LD Micro的信息,請訪問 。

About Aehr Test Systems
Headquartered in Fremont, California, Aehr Test Systems is a leading provider of test solutions for testing, burning-in, and stabilizing semiconductor devices in wafer level, singulated die, and package part form, and has installed thousands of systems worldwide. Increasing quality, reliability, safety, and security needs of semiconductors used across multiple applications, including electric vehicles, electric vehicle charging infrastructure, solar and wind power, computing, data and telecommunications infrastructure, and solid-state memory and storage, are driving additional test requirements, incremental capacity needs, and new opportunities for Aehr Test products and solutions. Aehr has developed and introduced several innovative products including the FOX-PTM families of test and burn-in systems and FOX WaferPakTM Aligner, FOX WaferPak Contactor, FOX DiePak Carrier and FOX DiePak Loader. The FOX-XP and FOX-NP systems are full wafer contact and singulated die/module test and burn-in systems that can test, burn-in, and stabilize a wide range of devices such as leading-edge silicon carbide-based and other power semiconductors, 2D and 3D sensors used in mobile phones, tablets, and other computing devices, memory semiconductors, processors, microcontrollers, systems-on-a-chip, and photonics and integrated optical devices. The FOX-CP system is a low-cost single-wafer compact test solution for logic, memory and photonic devices and the newest addition to the FOX-P product family. The FOX WaferPak Contactor contains a unique full wafer contactor capable of testing wafers up to 300mm that enables IC manufacturers to perform test, burn-in, and stabilization of full wafers on the FOX-P systems. The FOX DiePak Carrier allows testing, burning in, and stabilization of singulated bare die and modules up to 1024 devices in parallel per DiePak on the FOX-NP and FOX-XP systems up to nine DiePaks at a time. Acquired through its acquisition of Incal Technology, Inc., Aehr's new line of high-power packaged part reliability/burn-in test solutions for Artificial Intelligence (AI) semiconductor manufacturers, including its ultra-high-power Sonoma family of test solutions for AI accelerators, GPUs, and high-performance computing (HPC) processors, position Aehr within the rapidly growing AI market as a turn-key provider of reliability and testing that span from engineering to high volume production. For more information, please visit Aehr Test Systems' website at .

aehr@mkr-group.com
總部位於加利福尼亞弗裏蒙特,Aehr Test Systems是一家領先的測試解決方案提供商,專爲測試、老化和穩定半導體器件而設計,包括片級、獨立芯片和封裝部件形式,並已在全球安裝了數千台系統。半導體的質量、可靠性、安全和安全需求不斷增加,適用於多種應用,包括新能源車、新能源車充電基礎設施、太陽能和風力發電、計算、數據和電信基礎設施,以及固態存儲器和存儲器,這些驅動了額外的測試需求、增量容量需求,併爲Aehr Test產品和解決方案帶來新機會。 Aehr已經開發並推出了幾款創新產品,包括FOX-PT系列測試和老化系統,FOX WaferPak對準器,FOX WaferPak接觸器,FOX DiePak載體和FOX DiePak裝載機。FOX-XP和FOX-NP系統是全硅片接觸和獨立芯片/模塊測試和老化系統,可測試、老化和穩定一系列設備,如最尖端的基於碳化硅和其他功率半導體,用於手機、平板電腦和其他計算設備的2D和3D傳感器,存儲器半導體,處理器,微控制器,片上系統和光子器件和集成光學器件。 FOX-CP系統是邏輯、存儲器和光子器件的低成本單硅片緊湊測試解決方案,是FOX-P產品系列的最新成員。FOX WaferPak接觸器包含一種獨特的全硅片接觸器,可測試高達300mm的硅片,使IC製造商能夠在FOX-P系統上對整個硅片進行測試、老化和穩定。FOX DiePak載體允許在FOX-NP和FOX-XP系統上測試、燒入和穩定單獨的裸片和模塊,每個DiePak最多可並行測試1024個設備,最多可同時使用九個DiePak。通過收購Incal Technology,Aehr獲得了新的高功率封裝部件可靠性/老化測試解決方案系列,用於人工智能(AI)半導體制造商,包括用於AI加速器、GPU和高性能計算(HPC)處理器的超高功率Sonoma系列測試解決方案,將Aehr定位在AI市場快速增長的位置,成爲可直接提供從工程到大規模生產的可靠性和測試的提供商。詳情請訪問Aehr Test Systems的網站。

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Contacts:

聯繫人:

Aehr Test Systems
Chris Siu
Chief Financial Officer
csiu@aehr.com

www.aehr.com
Chris Siu
致富金融(臨時代碼)官
csiu@aehr.com

MKR Investor Relations Inc.
Todd Kehrli or Jim Byers
Analyst/Investor Contact
(323) 468-2300
aehr@mkr-group.com

MKR Investor Relations公司
Todd Kehrli或Jim Byers
分析師/投資者聯繫方式
(323)468-2300
aehr@mkr-group.com

譯文內容由第三人軟體翻譯。


以上內容僅用作資訊或教育之目的,不構成與富途相關的任何投資建議。富途竭力但無法保證上述全部內容的真實性、準確性和原創性。
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