Rapidus Establishes State-of-the-art Back-end Semiconductor Manufacturing Process Research-and-development Center
Rapidus Establishes State-of-the-art Back-end Semiconductor Manufacturing Process Research-and-development Center
Rapidus will begin installing manufacturing equipment in Rapidus Chiplet Solutions, a new R&D facility and clean room, will be located on Seiko Epson's Chitose campus
新的研發設施和潔淨室Rapidus Chiplet Solutions將位於精工愛普生的千歲園區
TOKYO and HOKKAIDO, Japan, Oct. 3, 2024 /PRNewswire/ -- Rapidus Corporation, a company involved in the research, development, design, manufacture and sales of advanced logic semiconductors, today announced that it will set up a clean room within Seiko Epson Corporation's facility in Chitose, Hokkaido, and open a research-and-development (R&D) center for semiconductor post-processing called Rapidus Chiplet Solutions (RCS).
日本東京和北海道，2024年10月3日 /PRNewswire/ — 參與先進邏輯半導體研究、開發、設計、製造和銷售的公司Rapidus Corporation今天宣佈，將在位於北海道千歲市的精工愛普生公司工廠內設立一個潔淨室，並開設一個名爲Rapidus Chiplet Solutions（RCS）的半導體後處理研發（R&D）中心。
The Seiko Epson Chitose Plant is adjacent to the Rapidus Innovative Integration for Manufacturing (IIM) foundry, the semiconductor manufacturing facility that Rapidus is currently building in Bibi, Chitose City. The new R&D space was unveiled at a groundbreaking ceremony held today, with the clean room amassing an area of approximately 9,000m2 (96,875 square feet). Leveraging the new R&D facility, Rapidus will develop mass production technologies for chiplet packages.
精工愛普生千歲工廠毗鄰Rapidus創新制造整合（IIM）鑄造廠，該鑄造廠是Rapidus目前正在千歲市畢比建造的半導體制造工廠。新的研發空間在今天舉行的奠基儀式上揭幕，潔淨室佔地面積約9,000平方米（96,875平方英尺）。利用新的研發設施，Rapidus將開發小芯片封裝的批量生產技術。
Rapidus will begin installing manufacturing equipment in April 2025, with R&D activities scheduled to begin in April 2026. RCS will have pilot lines for the FCBGA, Si interposer, RDL, and hybrid bonding processes, and will conduct additional R&D on mass production technologies, including equipment automation.
Rapidus將於2025年4月開始安裝製造設備，研發活動計劃於2026年4月開始。RCS將擁有FCBGA、硅介質層、RDL 和混合鍵合工藝的試點生產線，並將對包括設備自動化在內的批量生產技術進行額外的研發。
In terms of the development of back-end processes and chiplet integration technologies, the Ministry of Economy, Trade and Industry and New Energy and Industrial Technology Development Organization approved the project for the "Development of Chiplet Package Design and Manufacturing Technology for 2nm Generation Semiconductors" in April 2024, and development of core technologies such as chiplet integration and 2.5D/3D packaging is progressing.
在後端工藝和芯片集成技術的開發方面，經濟產業省和新能源與工業技術開發組織於2024年4月批准了 「開發2納米代半導體的芯片封裝設計和製造技術」 項目，芯片集成和2.5D/3D封裝等核心技術的開發正在進行中。
In June 2024, Rapidus signed a partnership with IBM not only for front-end processes but for chiplet technology. In addition, Rapidus is collaborating with organizations across four countries, including LSTC, AIST, the University of Tokyo, Fraunhofer in Germany and A*STAR IME in Singapore to further packaging advancements.
2024年6月，Rapidus與IBM簽署了合作伙伴關係，不僅涉及前端流程，還涉及小芯片技術。此外，Rapidus正在與四個國家的組織合作，包括LSTC、AiST、東京大學、德國弗勞恩霍夫和新加坡的A*STAR IME，以進一步推動包裝進步。
About Rapidus Corporation:
Rapidus Corporation aims to develop and manufacture the world's most advanced logic semiconductors. We will create new industries together with our customers through the development and provision of services to shorten cycle times in design, wafer processes, 3D packaging and more. We will continue to challenge ourselves in order to contribute to the fulfillment, prosperity, and happiness of people's lives using semiconductors.
關於Rapidus Corporation：
Rapidus 公司的目標是開發和製造世界上最先進的邏輯半導體。我們將通過開發和提供服務，與客戶一起創造新行業，以縮短設計、晶圓工藝、三維封裝等方面的週期。我們將繼續挑戰自我，以便使用半導體爲人們生活的充實、繁榮和幸福做出貢獻。
About Rapidus Corporation
關於Rapidus Corporation
Headquarters: 4-1 Kojimachi, Chiyoda-ku, Tokyo 102-0083, Japan
總部：日本東京 102-0083 千代田區小路町 4-1
Founded: August 10, 2022
成立時間：2022年8月10日
Management: Tetsuro Higashi, Chairman of the Board of Directors
管理層：董事會主席東哲郎
Atsuyoshi Koike, President and Representative Director
總裁兼代表董事小池厚義
Business Areas: Research, development, design, manufacture, and sales of semiconductor devices, integrated circuits and other electronic components
業務領域：半導體器件、集成電路和其他電子元件的研究、開發、設計、製造和銷售
Capital (as of November 2022): 7,346 million yen (includes capital reserves)
資本（截至2022年11月）：734600萬日元（包括資本儲備）
Media Contact:
Devan Gillick – Breakaway Communications for Rapidus
Email: [email protected]
Mobile: (530) 591-3194
媒體聯繫人：
Devan Gillick — Rapidus 的分離通訊
電子郵件：[電子郵件保護]
手機：(530) 591-3194
SOURCE Rapidus Corporation
來源 Rapidus Corporation
WANT YOUR COMPANY'S NEWS FEATURED ON PRNEWSWIRE.COM?
想在 PRNEWSWIRE.COM 上刊登貴公司的新聞嗎？
譯文內容由第三人軟體翻譯。