Synopsys And TSMC Collaborate To Advance Trillion-Transistor AI And Multi-Die Chip Design With Optimized EDA And IP Solutions For N2 And A16 Processes; Address Thermal, Power, And System Performance Challenges
Synopsys And TSMC Collaborate To Advance Trillion-Transistor AI And Multi-Die Chip Design With Optimized EDA And IP Solutions For N2 And A16 Processes; Address Thermal, Power, And System Performance Challenges
新思科技與台積電合作，推動擁有萬億晶體管的人工智能和多芯片設計，提供針對N2和A16工藝優化的eda軟件和IP解決方案；解決熱、功耗和系統性能挑戰
Synopsys And TSMC Collaborate To Advance Trillion-Transistor AI And Multi-Die Chip Design With Optimized EDA And IP Solutions For N2 And A16 Processes; Address Thermal, Power, And System Performance Challenges
新思科技與台積電合作，推動擁有萬億晶體管的人工智能和多芯片設計，提供針對N2和A16工藝優化的eda軟件和IP解決方案；解決熱、功耗和系統性能挑戰
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