Gelonghui, September 11 | Zhishang Technology (301486.SZ) said on the investor interactive platform that Xico Equipment Manufacturing (Hengyang) Co., Ltd., a wholly-owned subsidiary of Xike Industrial, focuses on the R&D and manufacture of semiconductor polishing equipment, and has successfully upgraded the size of traditional single-sided polishing equipment and developed and mass-produced a new series of double-sided grinding equipment. Xico Industrial's semiconductor polishing equipment is used in the field of grinding and polishing of high-brittle and hard special materials such as silicon carbide, silicon nitride crystals, diamond, and quartz glass.
致尚科技(301486.SZ)：西可实业的半导体抛光设备应用于碳化硅、氮化硅晶体、金刚石、石英玻璃等高脆硬特殊材料的研磨抛光领域
Zhi Shang Technology (301486.SZ): The semiconductor polishing equipment of Xi Ke Industrial is applied in the grinding and polishing field of high brittle and hard special materials such as silicon carbide, silicon nitride crystal, diamond, quartz glass,
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