GCT Semiconductor Signs MOU With Global Tier One Telecommunications Supplier To Collaborate On The Development Of Fixed Wireless Access Technology Using GCT's 5G Solutions Including Modem Chipset And RFIC
GCT Semiconductor Signs MOU With Global Tier One Telecommunications Supplier To Collaborate On The Development Of Fixed Wireless Access Technology Using GCT's 5G Solutions Including Modem Chipset And RFIC
The Agreement with Global Tier One Supplier Includes Development Collaboration on Fixed Wireless Access Devices Using GCT's 5G Chipsets
與全球一線供應商的協議包括使用GCT的5G芯片組開發固定無線接入設備的合作。
GCT Semiconductor Holding Inc. ("GCT" or the "Company") (NYSE:GCTS), a leading designer and supplier of advanced 5G and 4G semiconductor solutions, announced today the execution of a memorandum of understanding ("MOU") with a tier one worldwide infrastructure and terminal provider (the "Tier One Supplier") to collaborate on the development of Fixed Wireless Access ("FWA") technology using GCT's 5G solutions including modem chipset and RFIC. The Company expects to close a definitive agreement before the end of 2024.
GCt半導體控股有限公司（「GCT」或「公司」）（紐交所：GCTS）是一家領先的5G和4G半導體解決方案的設計和供應商，今天宣佈與一家全球基礎設施和終端供應商（「一線供應商」）簽署諒解備忘錄（「MOU」），合作開發使用GCT的5G解決方案，包括調制解調器芯片組和射頻集成電路的固定無線接入技術。公司預計將在2024年底前簽署一份最終協議。
譯文內容由第三人軟體翻譯。
