On August 14th, GeLongHui reported that Shanghai Tongji Science & Technology Industrial (600846.SH) plans to register bonds of no more than RMB 1.5 billion (inclusive). The final registered amount is subject to the amount stated in the registration approval document approved by the bond issuer. The specific issuance size will be determined within the above range based on the company's capital needs and market conditions.

The raised funds from this bond issuance, after deducting the issuance costs, will be used for repaying interest-bearing debts, private equity investments, fund contributions, and the historical self-raised capital funds for the above purposes, as well as supplementary working capital, in compliance with relevant laws, regulations, and provisions.