On August 9th, a focus for investors of Beijing Bayi Space LCD Technology Co.,Ltd. is 'how is the progress of photoresist?'.

On the evening of August 7th, Beijing Bayi Space LCD Technology Co.,Ltd. publicly stated that the R&D of photosensitive polyimide photoresist (PSPI) and fluorine-free photosensitive polyimide is progressing smoothly and is currently in a small-scale verification phase.

Market analysts generally believe that photosensitive polyimide photoresist (PSPI), as a new type of photoresist material, has enormous application potential in the field of semiconductor and microelectronic packaging, due to its excellent photosensitivity and thermal stability.

Regarding the R&D and latest development for photosensitive polyimide photoresist (PSPI) products for semiconductor packaging, a spokesperson for Beijing Bayi Space LCD Technology Co.,Ltd. told the reporter of 'Star Daily' that the company's project for photosensitive polyimide photoresist (PSPI) for semiconductor packaging was proposed as a new project in 2023, focusing on R&D and production of i-line photoresist. The downstream market is mainly oriented towards display panels, semiconductor chips and other fields.

Regarding subsequent production, the aforementioned spokesperson for Beijing Bayi Space LCD Technology Co.,Ltd. stated that currently, photosensitive polyimide photoresist (PSPI) products for semiconductor packaging are being validated with downstream clients. Specific effects depend on the compatibility with related products and the stability of batches.

"The certification cycle for semiconductor materials is relatively long, usually around one to three years. If progress goes smoothly, the subsequent production speed will be faster," added the spokesperson for Beijing Bayi Space LCD Technology Co.,Ltd.

Industry insiders in the photoresist field analyze that, relative to achieving mass production in the short term and increasing performance, Beijing Bayi Space LCD Technology Co.,Ltd.'s layout in the field of photosensitive polyimide photoresist (PSPI) for semiconductor packaging is of greater significance in that the company proposes new products and technologies, constantly expands its product category layout, and drives its subsequent performance improvement.

The 'Star Daily' reporter noted that photosensitive polyimide photoresist (PSPI) for semiconductor packaging is an important polymer material and has a significant role in advanced packaging. Other domestic listed companies, such as Anhui Guofeng New Materials and Changzhou Tronly New Electronic Materials, also have layout in this field.

However, based on the progress of relevant suppliers' products, the photosensitive polyimide photoresist (PSPI) products for semiconductor packaging of Anhui Guofeng New Materials and Changzhou Tronly New Electronic Materials are still in the R&D and verification stage and have not yet been mass-produced.

On August 8th, a spokesperson for Anhui Guofeng New Materials stated in response to a question from the 'Star Daily' reporter that the company's related product for photosensitive polyimide photoresist (PSPI) for semiconductor packaging, which is jointly developed with the University of Science and Technology of China, is still in the R&D stage and is advancing as planned. It has not yet been mass-produced.

Prior to this, on June 21st, Changzhou Tronly New Electronic Materials stated on the investor interactive platform that their advanced packaging material, photosensitive polyimide and others, are currently undergoing customer certification.

It needs to be pointed out that compared to the field of semiconductor packaging, domestic photosensitive polyimide photoresist (PSPI) has already achieved mass production in the field of display panels.

On July 16th, Hubei Dinglong publicly stated during an institutional investor research call that the PSPI business for semiconductor displays has already been sold in mass quantities to domestic mainstream panel manufacturers, among which PSPI products have become the top supplier for domestic mainstream panel clients, establishing its leading position in related product domestic supply.

Regarding the reason why domestic photosensitive polyimide photoresist (PSPI) has not been mass-produced in the semiconductor packaging field, professionals in the photoresist industry interviewed by reporters from the Star Daily noted that the mainstream photoresists used in China are still ArF photoresists, which can be used in the chip manufacturing field with different levels of maturity and performance requirements. PSPI is a research direction that anticipates the future and still has a way to go before entering the industrialization production stage.

Moreover, from a technical perspective, the key technical difficulty of PSPI in the industrialization process of photolithography lies in its clarity in edge lithography and whether it can meet market requirements, according to professionals in the photoresist industry.

Currently, the market prospects of PSPI are still uncertain. However, as the "new nobility" of new materials, from early-stage research and development to industrialization and localization substitution, it has become a consensus among industry performance, according to the aforementioned market analysts.