Onto Innovation Unveils Advanced Glass Substrate Solutions for AI and Cloud Computing
Onto Innovation Unveils Advanced Glass Substrate Solutions for AI and Cloud Computing
onto innovation推出用於人工智能和雲計算服務商的先進玻璃襯底解決方案
Onto Innovation Inc. (NYSE:ONTO) today announced Onto Innovation's glass substrate suite featuring the JetStep X500 panel-level packaging lithography system with hybrid substrate handling capabilities and the Firefly G3 sub-micron automatic metrology and inspection system for panel-level packaging and advanced IC substrates (AICS). The JetStep X500 and Firefly G3 systems offer customers a complete panel-level packaging solution supporting heterogeneous integration (HI) chiplet packages for AI, high performance compute and cloud computing. The AICS market is expected to increase at a compound annual growth rate of 10% from 2023 to 2028, according to Prismark.
Onto Innovation Inc.（NYSE:ONTO）今日宣佈 Onto Innovation 的玻璃基板套件，包括 JetStep X500 面板級封裝光刻系統（具有混合基板處理功能）和 Firefly G3 亞微米自動計量和檢測系統，用於面板級封裝和高級 IC 基板（AICS）。JetStep X500 和 Firefly G3 系統爲客戶提供了完整的面板級封裝解決方案，支持異構集成（HI）芯片組包裝，用於 AI、高性能計算和雲計算。根據 Prismark，AICS 市場預計從 2023 年到 2028 年以 10% 的複合年增長率增長。
The AICS HI roadmap is rapidly approaching several new...
AICS HI 路...
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