Synopsys Accelerates Chip Innovation With Production-Ready Multi-Die Reference Flow For Intel Foundry
Synopsys Accelerates Chip Innovation With Production-Ready Multi-Die Reference Flow For Intel Foundry
3DIC Compiler Co-Design and Analysis Solution Combined with Synopsys IP Accelerates Heterogeneous Integration for Intel Foundry's EMIB Technology
Synopsys的EDA軟件-半導體IP與3DIC Compiler共同開發的解決方案加速了英特爾Foundry的EMIB技術異構集成。
Highlights
亮點
- Synopsys AI-driven multi-die reference flow now extended for Intel Foundry's EMIB advanced packaging technology accelerates quality-of-results for heterogeneous integration
- Synopsys 3DIC Compiler, a unified exploration-to-signoff platform, supports multi-die co-design of Intel Foundry's EMIB technology
- Synopsys IP for multi-die design supports efficient die-to-die connectivity and high memory bandwidth requirements
- Synopsys基於人工智能的多芯片參考流程現已擴展到英特爾Foundry的EMIB高級封裝技術，加速異構集成的結果質量。
- Synopsys 3DIC編譯器是一個統一的探索到簽署平台，支持英特爾Foundry的EMIB技術的多芯片共同設計。
- Synopsys多芯片設計的IP支持高效的芯片對芯片連接和高內存帶寬要求。
SUNNYVALE, Calif., June 24, 2024 /PRNewswire/ -- Synopsys, Inc. (Nasdaq: SNPS) today announced the availability of its production-ready multi-die reference flow, powered by Synopsys.ai EDA suite, and Synopsys IP for Intel Foundry's embedded multi-die interconnect bridge (EMIB) advanced packaging technology. The optimized reference flow provides a unified co-design and analysis solution, enabled by Synopsys 3DIC Compiler to accelerate exploration and development of multi-die designs at all stages from silicon to systems. In addition, Synopsys 3DSO.ai is natively integrated with Synopsys 3DIC Compiler, enabling optimization for signal, power and thermal integrity with unparalleled productivity gains and maximum system performance.
2024年6月24日，加利福尼亞州旭陽市/PRNewswire——Synopsys（納斯達克代碼：SNPS）今天宣佈，其由Synopsys.ai EDA套件提供技術支持的生產就緒多芯片參考流程，以及用於英特爾Foundry的嵌入式多芯片互連橋（EMIB）高級封裝技術的Synopsys IP已經上市。優化的參考流程提供了一個統一的共同設計和分析解決方案，由Synopsys 3DIC Compiler提供支持，加速了從硅到系統的各個階段的多芯片設計的探索和開發。此外，Synopsys 3DSO.ai與Synopsys 3DIC Compiler進行了本地集成，可實現信號、功率和熱敏完整性的優化，具有無與倫比的生產力增益和最大的系統性能。
譯文內容由第三人軟體翻譯。