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港股概念追踪 |工信部发布《2024年汽车标准化工作要点》 汽车芯片今年市场规模将超900亿元 (附概念股)

Hong Kong stock market concept tracking | The Ministry of Industry and Information Technology released the "2024 Automotive Standardization Work Focus", and the market size of auto chips will exceed 90 billion yuan this year. (Attached concept stocks)

Zhitong Finance ·  Jun 21 13:19

According to McKinsey's statistical analysis, the current market value of SiC devices is about $2 billion, and it is expected to reach $11 to $14 billion by 2030.

On June 21st, the Ministry of Industry and Information Technology issued the "2024 Automotive Standardization Work Focus."

Among them, the standardized supply of automotive chips will be strengthened. It is understood that in the field of automotive electronics, compared with traditional cars, new energy vehicles require more sensors and brake integrated circuits. The value of semiconductor chips for single new energy vehicles will be twice that of traditional cars, and the proportion of power semiconductor usage has increased from 20% to nearly 50%.

On January 8th, the Office of the Ministry of Industry and Information Technology issued a notice on the issuance of the National Automotive Chip Standard System Construction Guideline.

The goal is to develop more than 30 key standards for automotive chips by 2025. By 2030, more than 70 automotive chip-related standards will be developed, basically achieving full coverage of typical application scenarios and test methods for automotive chips, and meeting the needs of constructing a safe, open, and sustainable automotive chip industry ecology.

According to McKinsey's statistical analysis, the current market value of SiC devices is about $2 billion, and it is expected to reach $11 to $14 billion by 2030 with a compound annual growth rate of 26%. It is also expected that 70% of the demand for SiC will come from electric vehicles.

In the face of this huge market, global automotive chip giants including ST, Infineon, On Semiconductor, Rohm, and Renesas have rushed to lay out and launch fierce competition.

In recent years, the development of new energy vehicles has entered a new stage of intelligence from electrification, and automotive chips have entered a period of rapid development. Platformization, integration, and standardization of chips have become the development trend.

Automotive chip related companies:

Times Electric (03898): The main project of power semiconductor Yixing Phase III has been completed and is expected to have all equipment in place by mid-year. SiC is in a continuous verification stage. The company's IGBT modules have a significantly leading market share in the rail transit and power grid fields, ranking first in China, and the market share of centralized photovoltaic IGBT modules is rapidly increasing. In the field of new energy vehicles: According to NE Times data, the company's 23-year new energy passenger car power module installation volume ranks third, and its electric drive system ranks among the top six in the industry.

The translation is provided by third-party software.


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