On June 18th, Gelonhui reported that Ningbo Boway Alloy Material (601137.SH) stated on the investor interaction platform that the company's dedicated lead frame material will be used for integrated circuit packaging before the third generation; Socket base materials are mainly used for the connection of advanced packaging integrated circuits and substrates. The development of AI has led to a focus on AI computing power integrated circuits in the market, and advanced packaging is an important packaging method for AI computing power integrated circuits. Socket base connection method can be applied to integrated circuits produced by more advanced packaging methods. The company's independently developed new alloy, Ningbo Boway Alloy Material 70318, will be used for the next generation of Socket bases and will become the flagship product.