Honda and IBM Sign Memorandum of Understanding to Explore Long-term Joint Research and Development of Semiconductor Chip and Software Technologies for Future Software-Defined Vehicles
Honda and IBM Sign Memorandum of Understanding to Explore Long-term Joint Research and Development of Semiconductor Chip and Software Technologies for Future Software-Defined Vehicles
TOKYO, Japan, May 15, 2024/ARMONK, N.Y., U.S.A, May 14, 2024 – IBM (NYSE: IBM) and Honda Motor Co., Ltd. (Honda) today announced they have signed a Memorandum of Understanding (MOU) outlining their intent to collaborate on the long-term joint research and development of next-generation computing technologies*1 needed to overcome challenges related to processing capability, power consumption, and design complexity for the realization of the software-defined vehicles (SDV) of the future.
日本东京，2024 年 5 月 15 日/美国纽约州阿蒙克，2024 年 5 月 14 日 — IBM（纽约证券交易所： IBM) 和本田汽车有限公司（本田）今天宣布，他们已经签署了一份谅解备忘录（MOU），概述了他们打算长期合作研究和开发下一代计算技术*1 需要克服与处理能力、功耗和设计复杂性相关的挑战，以实现未来的软件定义车辆 (SDV)。
The application of intelligence/AI technologies is expected to accelerate widely in 2030 and beyond, creating new opportunities for the development of SDVs. Honda and IBM anticipate that SDVs will dramatically increase the design complexity, processing performance, and corresponding power consumption of semiconductors compared to conventional mobility products. In order to solve anticipated challenges and realize highly-competitive SDVs, it is critical to develop capabilities in the independent research and development of next-generation computing technologies. Based on this understanding, the two companies began considering long-term joint research and development opportunities.
智能/人工智能技术的应用预计将在2030年及以后大幅加速，为SDV的发展创造新的机会。本田和IBM预计，与传统的移动产品相比，SDV将显著提高半导体的设计复杂性、处理性能和相应的功耗。为了解决预期的挑战并实现极具竞争力的SDV，培养下一代计算技术的独立研发能力至关重要。基于这种理解，两家公司开始考虑长期的联合研发机会。
In particular, the MOU outlines areas of potential joint research of specialized semiconductor technologies such as brain-inspired computing*2 and chiplet technologies, with the aim to dramatically improve processing performance while, simultaneously, decreasing power consumption. Hardware and software co-optimization is important to ensure high performance and fast time to market. To achieve such benefits and manage design complexity for future SDVs, the two companies also plan to explore open and flexible software solutions.
特别是，谅解备忘录概述了诸如脑启发式计算等专业半导体技术的潜在联合研究领域*2 和小芯片技术，旨在显著提高处理性能，同时降低功耗。硬件和软件协同优化对于确保高性能和快速上市非常重要。为了实现这些优势并管理未来SDV的设计复杂性，两家公司还计划探索开放和灵活的软件解决方案。
Through this collaboration, the two companies would strive to realize SDVs that feature the world's top-level computing and power saving performance.
通过此次合作，两家公司将努力实现具有世界顶级计算和节能性能的SDV。
Media Contact:
Willa Hahn
willa.hahn@ibm.com
媒体联系人：
威拉·哈恩
willa.hahn@ibm.com
*1 Computing technology being developed with an aim to achieve both high processing performance and low power consumption in the 2030s and beyond.
*1 正在开发的计算技术旨在在 20 世纪 30 年代及以后实现高处理性能和低功耗。
*2 Computer architecture and algorithms that mimic the brain's structure and function while optimizing for silicon.
*2 在优化硅的同时模仿大脑结构和功能的计算机架构和算法。
译文内容由第三方软件翻译。