Micron Technology And The Biden-Harris Administration Have Signed A Non-binding Preliminary Memorandum Of Terms For $6.1B In Funding Under The CHIPS And Science Act To Support Planned Memory Manufacturing In Idaho And New York
Micron Technology And The Biden-Harris Administration Have Signed A Non-binding Preliminary Memorandum Of Terms For $6.1B In Funding Under The CHIPS And Science Act To Support Planned Memory Manufacturing In Idaho And New York
The CHIPS and Science Act grants of $6.1 billion will support Micron's plans to invest approximately $50 billion in gross capex for U.S. domestic leading-edge memory manufacturing through 2030. These grants and additional state and local incentives will support the construction of one leading-edge memory manufacturing fab to be co-located with the company's existing leading-edge R&D facility in Boise, Idaho and the construction of two leading-edge memory fabs in Clay, New York.
The CHIPS and Science Act grants of $6.1 billion will support Micron's plans to invest approximately $50 billion in gross capex for U.S. domestic leading-edge memory manufacturing through 2030. These grants and additional state and local incentives will support the construction of one leading-edge memory manufacturing fab to be co-located with the company's existing leading-edge R&D facility in Boise, Idaho and the construction of two leading-edge memory fabs in Clay, New York.
61億美元的CHIPS和科學法撥款將支持美光計劃在2030年之前投資約500億美元的總資本支出,用於美國國內領先的存儲器製造。這些補助金以及額外的州和地方激勵措施將支持建設一個領先的存儲器製造工廠,該工廠將與該公司位於愛達荷州博伊西的現有尖端研發設施同地辦公,以及在紐約克萊建造兩個領先的存儲器晶圓廠。
譯文內容由第三人軟體翻譯。
風險及免責聲明
- 分享到weixin
- 分享到qq
- 分享到facebook
- 分享到twitter
- 分享到微博
- 粘贴板
使用瀏覽器的分享功能,分享給你的好友吧