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Earnings Call Summary | ASMPT LTD(ASMVF.US) Q1 2024 Earnings Conference

Earnings Call Summary | ASMPT LTD(ASMVF.US) Q1 2024 Earnings Conference

業績電話會議摘要 | ASMPT LTD (ASMVF.US) 2024 年第一季度業績發佈會
富途資訊 ·  04/24 17:14  · 電話會議

The following is a summary of the ASMPT Limited (ASMVF) Q1 2024 Earnings Call Transcript:

以下是ASMPT有限公司(ASMVF)2024年第一季度業績電話會議記錄的摘要:

Financial Performance:

財務業績:

  • ASMPT reported Q1 revenue of US$401.4 million, down 7.8% quarter-on-quarter.

  • Gross margin declined slightly by 40 basis points quarter-on-quarter to 41.9%.

  • Adjusted Q1 net profit was HK$177.5 million, up 132.1% quarter-on-quarter, with adjusted earnings per share up 138.9% quarter-on-quarter.

  • ASMPT reported a robust balance sheet with HK$5.25 billion in cash and bank deposits.

  • ASMPT公佈的第一季度收入爲4.014億美元,同比下降7.8%。

  • 毛利率同比小幅下降40個點子至41.9%。

  • 調整後的第一季度淨利潤爲1.775億港元,同比增長132.1%,調整後的每股收益同比增長138.9%。

  • ASMPT報告了強勁的資產負債表,現金和銀行存款爲52.5億港元。

Business Progress:

業務進展:

  • Bookings grew by 17% in Q1, primarily driven by Advanced Packaging solutions across both SEMI and SMT divisions.

  • Progress noted in automotive applications, forming a large proportion of total Group revenue.

  • Plans revealed to capitalize on Advanced Packaging solutions, which have the highest growth potential.

  • Product development ongoing, with the recent delivery of a next-generation ultra-fine-pitched TCB tool for chip-to-wafer applications.

  • ASMPT has a robust Advance Packaging momentum, which improves the company's SMT margin mix.

  • Increase of interest noted in photonics application, providing a comprehensive range of tools for transceiver packaging applications.

  • The company plans to invest HK$250 million in R&D and infrastructure, with a focus on the AP side.

  • The total addressable market (TAM) for AP is projected to increase up to HK$3.3 billion in 2028, with a significant compound annual growth rate.

  • 第一季度預訂量增長了17%,這主要是由SEMI和SMT部門的先進封裝解決方案推動的。

  • 汽車應用取得進展,佔集團總收入的很大比例。

  • 公佈了利用具有最大增長潛力的先進封裝解決方案的計劃。

  • 產品開發仍在繼續,最近交付了用於芯片到晶圓應用的下一代超細間距 TCB 工具。

  • ASMPT擁有強勁的先進封裝勢頭,這改善了該公司的SMT利潤結構。

  • 人們對光子學應用的興趣與日俱增,爲收發器封裝應用提供了全面的工具。

  • 該公司計劃在研發和基礎設施上投資2.5億港元,重點放在亞太方面。

  • 預計到2028年,亞太地區的總潛在市場(TAM)將增加至33億港元,複合年增長率很高。

Tips: For more comprehensive details, please refer to the IR website. The article is only for investors' reference without any guidance or recommendation suggestions.

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譯文內容由第三人軟體翻譯。


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