On April 22, Huabang Technology (03638.HK) announced that on April 22, 2024, Winbond Finance Limited (as lender) entered into a loan agreement with the borrower (as the borrower) and the guarantor (as the guarantor). Based on this, Winbond Finance Limited agreed to grant a loan of HK$9.5 million for a period of 10 months.
华邦科技(03638.HK)授出950万港元贷款
Huabang Technology (03638.HK) grants HK$9.5 million loan
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