Earnings Call Summary | Taiwan Semiconductor(TSM.US) Q1 2024 Earnings Conference
Earnings Call Summary | Taiwan Semiconductor(TSM.US) Q1 2024 Earnings Conference
The following is a summary of the Taiwan Semiconductor Manufacturing Co Ltd (TSM) Q1 2024 Earnings Call Transcript:
以下是臺灣半導體制造股份有限公司（TSM）2024年第一季度業績電話會議記錄摘要：
Financial Performance:
財務業績：
TSMC reported a decline in Q1 2024 revenue by 5.3% sequentially in NT dollars or 3.8% in U.S. dollars due to smartphone seasonality.
Gross margin increased 0.1 percentage point sequentially to 53.1%.
Operating margin increased 0.4 percentage points sequentially to 42%.
3-nanometer process technology contributed 9% of wafer revenue in the first quarter, while 5-nanometer and 7-nanometer accounted for 37% and 19%, respectively.
The company had cash and marketable securities of TWD1.9 trillion or USD 60 billion at the end of the quarter.
For Q2 2024, TSMC expects revenue to be between USD 19.6 billion and USD 20.4 billion, which represents a 6% sequential increase and 27.6% year-over-year increase at the midpoint.
Gross margin is expected to be between 51% and 53%, and operating margin between 40% and 42%.
TSMC is investing between USD 28 billion and USD 32 billion in 2024 capital budget for advanced process technologies, specialty technologies, and advanced packaging.
台積電報告稱，由於智能手機的季節性，2024年第一季度收入按新臺幣計算連續下降5.3％，按美元計算下降3.8％。
毛利率連續增長0.1個百分點至53.1％。
營業利潤率連續增長0.4個百分點至42％。
3納米工藝技術在第一季度貢獻了9％的晶圓收入，而5納米和7納米分別佔37％和19％。
截至本季度末，該公司的現金和有價證券爲1.9萬億新臺幣或600億美元。
台積電預計，2024年第二季度的收入將在196億美元至204億美元之間，這意味着連續增長6％，中點同比增長27.6％。
毛利率預計在51％至53％之間，營業利潤率在40％至42％之間。
台積電將在2024年的資本預算中投資280億至320億美元，用於先進的工藝技術、特種技術和先進封裝。
Business Progress:
業務進展：
TSMC managed to resume full operation within 3 days after a 7.2 magnitude earthquake with minimal disruptions.
TSMC is expanding its global manufacturing footprint, building three fabs in Arizona and continuing developments in Japan. They are on track to start volume production in 2025 in Arizona and by the Q4 of 2024 in Japan.
A new specialty technology fab in Dresden, Germany is set to begin construction in Q4 of this year.
TSMC's N2 technology, expected to go into volume production in 2025, is attracting high customer interest due to its advanced nature.
TSMC is focusing on AI-related growth opportunities and expects healthy growth in the AI-related data center sector.
Adoption of 3DIC packaging technology by customers is a hallmark of TSMC's advanced technology solutions. The capacity for AI accelerators is also set to increase, given demand.
TSMC is planning to convert some of its 5-nanometer (N5) capacity to 3-nanometer (N3), due to AI-related demand.
TSMC expects that the hastened replacement cycle for smartphones and PCs will lead to increased demand. In response, there are no current plans to convert N7 to N5. The 3DIC and SoIC packaging technologies are expected to achieve market growth from this year onwards.
台積電設法在7.2級地震後的3天內恢復了全面運營，干擾最小。
台積電正在擴大其全球製造足跡，在亞利桑那州建造了三個晶圓廠，並在日本繼續發展。它們有望在2025年在亞利桑那州開始批量生產，到2024年第四季度在日本開始批量生產。
德國德累斯頓的新特種技術工廠定於今年第四季度開始建設。
台積電的氮氣技術預計將於2025年投入批量生產，由於其先進性質吸引了客戶的極大興趣。
台積電專注於與人工智能相關的增長機會，並預計與人工智能相關的數據中心領域將實現健康增長。
客戶採用3DIC封裝技術是台積電先進技術解決方案的標誌。鑑於需求，人工智能加速器的容量也將增加。
由於與人工智能相關的需求，台積電計劃將其部分5納米（N5）容量轉換爲3納米（N3）。
台積電預計，加快的智能手機和個人電腦更換週期將導致需求增加。作爲回應，目前沒有計劃將N7轉換爲N5。預計從今年起，3DIC和SoIC封裝技術將實現市場增長。
More details: Taiwan Semiconductor IR
更多詳情： 臺灣半導體紅外
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