HeiTech Proposes Private Placement of 10m Shares
HeiTech Proposes Private Placement of 10m Shares
HeiTech Padu Bhd has proposed a private placement of up to 10.12 million new ordinary shares to external investors, constituting 10% of its total issued shares.
HeiTech Padu Bhd已提議向外部投資者私募多達1,012萬股新普通股，佔其已發行股份總額的10％。
If issued at an illustrative issue price of RM2.27, the proposed corporate move will allow the company to raise gross proceeds of RM22.98 million, majority of which will be deployed as working capital.
如果以2.27令吉的說明性發行價格發行，則擬議的公司舉措將使該公司能夠籌集2298萬令吉的總收益，其中大部分將用作營運資金。
These proceeds will mainly be utilised for staff salaries, employers' statutory contributions, payment to suppliers and creditor, office administrative expenses, utilities expenses and overhead expenses, according to its exchange filing today.
根據其今天的交易所文件，這些收益將主要用於員工工資、僱主的法定繳款、向供應商和債權人付款、辦公室管理費用、公用事業費用和管理費用。
HeiTech's share price closed 0.8% lower at RM2.37 bringing it a market capitalisation of RM240 million.
HeiTech的股價收盤下跌0.8％，至2.37令吉，市值爲 RM240 百萬令吉。
譯文內容由第三人軟體翻譯。