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Broadcom Delivers Industry's First 51.2-Tbps Co-Packaged Optics Ethernet Switch Platform for Scalable AI Systems

Broadcom Delivers Industry's First 51.2-Tbps Co-Packaged Optics Ethernet Switch Platform for Scalable AI Systems

博通爲可擴展 AI 系統提供業界首款 51.2 Tbps 聯合封裝光學以太網交換機平台
GlobeNewswire ·  03/14 21:00

Bailly 51.2T CPO switch delivers 70% improvement in optical interconnect power

Bailly 51.2T CPO 交換機使光互連功率提高了 70%

PALO ALTO, Calif., March 14, 2024 (GLOBE NEWSWIRE) -- Broadcom Inc. (NASDAQ: AVGO) announced today that it has delivered Bailly, the industry's first 51.2 terabits per sec (Tbps) co-packaged optics (CPO) Ethernet switch, to its customers. The product integrates eight silicon photonics based 6.4-Tbps optical engines with Broadcom's best-in-class StrataXGS Tomahawk5 switch chip. Bailly enables the optical interconnect to operate at 70% lower power consumption and delivers an 8x improvement in silicon area efficiency as compared to pluggable transceiver solutions.

加利福尼亞州帕洛阿爾託,2024年3月14日(GLOBE NEWSWIRE)——博通公司(納斯達克股票代碼:AVGO)今天宣佈,它已向其客戶交付了業界首款每秒51.2太比特(Tbps)的聯合封裝光學(CPO)以太網交換機Bailly。該產品將八個基於硅光子學的6.4 Tbps光學引擎與博通同類最佳的StrataXGS Tomahawk5開關芯片集成在一起。與可插拔收發器解決方案相比,Bailly 使光學互連的功耗降低 70%,硅面積效率提高了 8 倍。

The optical interconnect is critical for both front-end and back-end networks in large scale generative AI clusters. Today, pluggable optical transceivers consume approximately 50% of system power and constitute more than 50% of the cost of a traditional switch system. The growing bandwidth requirement for the newer generation of GPUs, coupled with the ever-increasing sizes of AI clusters, requires disruptively power-efficient and cost-efficient optical interconnects that extend beyond discrete solutions. Broadcom's CPO and silicon photonics technology platform, with its high degree of integration, provides the lowest latency, highest bandwidth density, lowest power, and lowest cost solution to meet this need and can help build large-scale, power-efficient AI clusters.

光學互連對於大規模生成式 AI 集群中的前端和後端網絡都至關重要。如今,可插拔光學收發器消耗約50%的系統功率,佔傳統交換機系統成本的50%以上。新一代 GPU 的帶寬需求不斷增長,加上人工智能集群規模的不斷擴大,需要超越分立解決方案的顛覆性節能且具有成本效益的光學互連。博通的CPO和硅光子學技術平台具有高度的集成度,可提供最低的延遲、最高的帶寬密度、最低的功耗和最低成本的解決方案來滿足這一需求,並可以幫助構建大規模、高能效的人工智能集群。

Bailly integrates hundreds of optical components and hundreds of millions of transistors in a single optical engine. The high degree of integration enables the placement of the optical engines on a common substrate with complex logic ASICs minimizing the need for signal conditioning circuitry. This allows the optical interconnect to operate at 70% lower power consumption as compared to pluggable transceivers. Bailly's high-volume production is made possible by Broadcom's innovative manufacturing approach that utilizes proven CMOS foundry processes, advanced packaging technologies and a highly automated high-density, edge-coupled fiber attach capability.

Bailly 將數百個光學元件和數億個晶體管集成到一個光學引擎中。高集成度允許將光學引擎放置在具有複雜邏輯 ASIC 的通用基板上,從而最大限度地減少了對信號調理電路的需求。與可插拔收發器相比,這使得光纖互連的功耗降低了70%。Bailly 的大批量生產得益於博通的創新制造方法,該方法利用了成熟的 CMOS 代工工藝、先進的封裝技術和高度自動化的高密度、邊緣耦合光纖連接能力。

Broadcom is co-designing platforms with cloud service providers (CSPs) and system integrators to accelerate adoption of CPO platforms. Broadcom will showcase the Bailly 51.2T CPO system at the Optical Fiber Communication (OFC) 2024 exhibition.

博通正在與雲服務提供商(CSP)和系統集成商共同設計平台,以加快CPO平台的採用。博通將在2024年光纖通信(OFC)展覽會上展示Bailly 51.2T CPO系統。

"As AI clusters demand higher bandwidth density, lower power consumption and lower latency, we are pleased to announce delivery of the industry's first 51.2-Tbps CPO switch," said Near Margalit, Ph. D., vice president and general manager of the Optical Systems Division at Broadcom. "Bailly will enable hyperscalers to deploy lower-power, cost-efficient, large-scale AI and compute clusters. Broadcom's technology leadership and manufacturing innovations help Bailly deliver 70% better power efficiency and ensure an optical I/O roadmap that can walk in tandem with the future bandwidth and power needs of AI infrastructure."

博通副總裁兼光學系統部總經理尼爾·瑪格利特博士表示:“由於人工智能集群需要更高的帶寬密度、更低的功耗和更低的延遲,我們很高興地宣佈業界首款51.2 Tbps CPO交換機交付。”“Bailly將使超大規模企業能夠部署功耗更低、更具成本效益的大規模人工智能和計算集群。博通的技術領先地位和製造創新幫助Bailly提高了70%的能效,並確保光學I/O路線圖能夠與人工智能基礎設施的未來帶寬和功率需求齊頭並進。”

"Pluggable optics are expected to account for an increasingly significant portion of power consumption at a system level, exceeding 50% of the switch system power at 51.2 Tbps and beyond. This issue will be further exacerbated as Cloud Service Providers build their next-generation AI networks and continue to push for higher speeds," said Sameh Boujelbene, vice president at Dell'Oro Group. "Substantial investments in AI infrastructure are accelerating the development of innovative optical connectivity solutions such as Broadcom's Bailly co-packaged optics platform, aiming to meet the demands of AI clusters while solving cost and power consumption hurdles."

“預計可插拔光學器件在系統層面的功耗中將佔越來越大的比例,在51.2 Tbps及以上的速度超過交換機系統功率的50%。隨着雲服務提供商建立下一代人工智能網絡並繼續推動更高的速度,這個問題將進一步加劇。” 戴爾奧羅集團副總裁Sameh Boujelbene說。“對人工智能基礎設施的大量投資正在加速創新的光連接解決方案的開發,例如博通的Bailly聯合封裝光學平台,旨在滿足人工智能集群的需求,同時解決成本和功耗障礙。”

"Innovation in the optical interconnect will be of great importance to future generations of AI networks," said Feng Luo, head of network systems at ByteDance. "Broadcom's continued progress in the development of co-packaged optics is exactly what the industry will require to overcome cost and power bottlenecks of current generation optical interconnects."

ByteDance網絡系統負責人羅峯說:“光學互連的創新對子孫後代的人工智能網絡非常重要。”“博通在共同封裝光學器件開發方面的持續進展正是該行業克服當代光互連的成本和功率瓶頸所需要的。”

"System design has become more challenging with each increase in SerDes speed, but only recently have we had to re-design our systems and optics to overcome the physical limitations of copper," said Richard Li, general manager of H3C's switch product line. "Our partnership with Broadcom to design systems with highly integrated co-packaged optics is a huge step forward to overcoming the design limitations of pluggable transceivers in high density systems."

H3C交換機產品線總經理理查德·李說:“隨着SerDes速度的提高,系統設計變得越來越具有挑戰性,但直到最近,我們才不得不重新設計我們的系統和光學器件,以克服銅的物理限制。”“我們與博通合作設計採用高度集成的共封光學器件的系統,這是朝着克服高密度系統中可插拔收發器的設計侷限性向前邁出的重要一步。”

"Artificial Intelligence (AI) has introduced a set of challenges that the networking must address," said Mansour Karam, global vice president (GVP) of data center products at Juniper Networks. "We are excited to partner with Broadcom to deliver co-packaged optics throughout the data center, thereby improving cost, power consumption and bandwidth efficiency of the optical interconnect."

瞻博網絡數據中心產品全球副總裁(GVP)曼蘇爾·卡拉姆說:“人工智能(AI)帶來了一系列網絡必須應對的挑戰。”“我們很高興與博通合作,在整個數據中心提供共同封裝的光學器件,從而提高光互連的成本、功耗和帶寬效率。”

"System design has become more challenging with the need to meet the requirement of AI/ML and high-performance large-scale datacenter networks," said Grant Lai, chief technology officer (CTO) of Micas Networks. "Our partnership with Broadcom to design systems with highly integrated co-packaged optics will enable a more power efficient future network. The 51.2 Tbps switch that Micas co-developed with Broadcom will reduce communication latency and power consumption in data centers and unleash more AI power."

Micas Networks首席技術官(CTO)Grant Lai表示:“由於需要滿足人工智能/機器學習和高性能大型數據中心網絡的要求,系統設計變得更具挑戰性。”“我們與博通合作設計採用高度集成的聯合封裝光學器件的系統,將爲未來更具能效的網絡提供支持。Micas與博通共同開發的51.2 Tbps交換機將減少數據中心的通信延遲和功耗,並釋放更多的人工智能能力。”

51.2-Tbps CPO Switch Product Highlights:

51.2 Tbps CPO 交換機產品亮點:

  • Broadcom 51.2-Tbps StrataXGS Tomahawk5 switch silicon
  • Broadcom 6.4T-FR4 Bailly SCIP optical engines with Broadcom Fiber Connector (BFC) for CPO systems
  • 4RU system design with high-efficiency air cooling to deliver 128 ports of 400G FR4 connectivity externally fiber-coupled with 128 duplex LC optical connectors
  • CPO engine to front-panel routing supports traditional single-mode fiber
  • System design compatible to support multiple remote laser modules (RLM) for field replaceability
  • More than 70% optical interconnect power consumption savings compared to standard pluggable optics solutions
  • 博通 51.2-Tbps StrataXGS Tomahawk5 交換機芯片
  • 博通 6.4T-FR4 Bailly SCIP 光學引擎,帶博通光纖連接器 (BFC),適用於 CPO 系統
  • 4RU 系統設計採用高效空氣冷卻技術,可提供 128 個 400G FR4 連接端口,外部光纖耦合 128 個雙工 LC 光纖連接器
  • CPO 引擎到前面板的路由支持傳統的單模光纖
  • 系統設計兼容,支持多個遠程激光模塊 (RLM),便於現場更換
  • 與標準的可插拔光學解決方案相比,光學互連的功耗節省了70%以上

Showcase at OFC 2024

在 OFC 2024 上展出

Broadcom will showcase the following CPO products and technologies:

博通將展示以下 CPO 產品和技術:

  • Bailly 51.2T CPO Ethernet switch system
  • 6.4T optical engine co-packaged with a multi-chip module that includes HBM, logic and PHY
  • Bailly 51.2T CPO 以太網交換機系統
  • 6.4T 光學引擎與包含 HBM、邏輯和 PHY 的多芯片模塊共同封裝

These products will be shown in the Broadcom Booth 5325 at OFC 2024 from March 26th to 28th.

這些產品將於3月26日至28日在OFC 2024的博通5325號展位上展出。

For more information on Broadcom CPO, please click here.

有關 Broadcom CPO 的更多信息,請點擊 這裏

About Broadcom
Broadcom Inc. (NASDAQ: AVGO) is a global technology leader that designs, develops, and supplies a broad range of semiconductor, enterprise software and security solutions. Broadcom's category-leading product portfolio serves critical markets including cloud, data center, networking, broadband, wireless, storage, industrial, and enterprise software. Our solutions include service provider and enterprise networking and storage, mobile device and broadband connectivity, mainframe, cybersecurity, and private and hybrid cloud infrastructure. Broadcom is a Delaware corporation headquartered in Palo Alto, CA. For more information, go to .

關於博通
博通公司(納斯達克股票代碼:AVGO)是設計、開發和提供廣泛的半導體、企業軟件和安全解決方案的全球技術領導者。Broadcom 的同類領先產品組合服務於關鍵市場,包括雲、數據中心、網絡、寬帶、無線、存儲、工業和企業軟件。我們的解決方案包括服務提供商和企業網絡和存儲、移動設備和寬帶連接、大型機、網絡安全以及私有云和混合雲基礎架構。博通是一家總部位於加利福尼亞州帕洛阿爾託的特拉華州公司。欲了解更多信息,請訪問 。

Broadcom, the pulse logo, and Connecting everything are among the trademarks of Broadcom. The term "Broadcom" refers to Broadcom Inc., and/or its subsidiaries. Other trademarks are the property of their respective owners.

博通、pulse徽標和Connecting everythings是博通的商標之一。“博通” 一詞是指博通公司和/或其子公司。其他商標是其各自所有者的財產。

Press Contact:
Khanh Lam

新聞聯繫人:
Khanh Lam

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Telephone: +1 408 433 8649

電話:+1 408 433 8649


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