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Reviewing GLOBALFOUNDRIES (NASDAQ:GFS) and Amkor Technology (NASDAQ:AMKR)
纳斯达克(GLOBALFONDRIES:GFS)和安高科技(纳斯达克:AMKR)

Defense World ·  {{timeTz}}

GLOBALFOUNDRIES (NASDAQ:GFS) and Amkor Technology (NASDAQ:AMKR) are both computer and technology companies, but which is the better business? We will compare the two businesses based on the strength of their risk, profitability, earnings, dividends, institutional ownership, analyst recommendations and valuation.

GlobalFoundries(纳斯达克:GFS)和安姆科科技(纳斯达克:AMKR)都是计算机和科技公司,但哪一家业务更好?我们将根据这两家公司的风险、盈利能力、收益、股息、机构所有权、分析师推荐和估值的强弱对它们进行比较。

Valuation and Earnings

估值和收益

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到达全球基础设施警报:

This table compares GLOBALFOUNDRIES and Amkor Technology's revenue, earnings per share (EPS) and valuation.

该表格比较了GLOBALFOundRIES和Amkor Technology的收入、每股收益(EPS)和估值。


Gross Revenue Price/Sales Ratio Net Income Earnings Per Share Price/Earnings Ratio
GLOBALFOUNDRIES $6.59 billion 3.13 -$250.31 million N/A N/A
Amkor Technology $6.14 billion 0.62 $642.99 million $2.82 5.48

总收入 价格/销售额比 净收入 每股收益 市盈率
全球基础设施 65.9亿美元 3.13 -2.5031亿美元 不适用 不适用
安科科技 61.4亿美元 0.62 6.4299亿美元 $2.82 5.48

Amkor Technology has lower revenue, but higher earnings than GLOBALFOUNDRIES.

Amkor Technology的收入低于GLOBALFONDRIES,但收益高于GLOBALFOUNDRIES。

Insider and Institutional Ownership

内部人与机构持股

12.1% of GLOBALFOUNDRIES shares are owned by institutional investors. Comparatively, 59.7% of Amkor Technology shares are owned by institutional investors. 56.5% of Amkor Technology shares are owned by company insiders. Strong institutional ownership is an indication that hedge funds, endowments and large money managers believe a stock will outperform the market over the long term.

GLOBALFOUNDRIES 12.1%的股份由机构投资者持有。相比之下,Amkor Technology 59.7%的股份由机构投资者持有。安科尔科技56.5%的股份由公司内部人士持有。强大的机构持股表明,对冲基金、捐赠基金和大型基金经理相信,从长期来看,一只股票的表现将好于大盘。

Profitability

盈利能力

This table compares GLOBALFOUNDRIES and Amkor Technology's net margins, return on equity and return on assets.

此表比较了GLOBALFOUNDRIES和Amkor Technology的净利润率、股本回报率和资产回报率。


Net Margins Return on Equity Return on Assets
GLOBALFOUNDRIES N/A 3.05% 1.62%
Amkor Technology 10.83% 24.26% 11.76%

净利润率 股本回报率 资产回报率
全球基础设施 不适用 3.05% 1.62%
安科科技 10.83% 24.26% 11.76%

Analyst Ratings

分析师评级

This is a breakdown of recent ratings for GLOBALFOUNDRIES and Amkor Technology, as provided by MarketBeat.

这是MarketBeat提供的GLOBALFOUNDRIES和Amkor Technology最近的评级细目。


Sell Ratings Hold Ratings Buy Ratings Strong Buy Ratings Rating Score
GLOBALFOUNDRIES 0 1 14 0 2.93
Amkor Technology 0 1 2 0 2.67

销售评级 保持评级 购买评级 强劲的买入评级 评级分数
全球基础设施 0 1 14 0 2.93
安科科技 0 1 2 0 2.67

GLOBALFOUNDRIES currently has a consensus price target of $77.93, suggesting a potential upside of 100.81%. Amkor Technology has a consensus price target of $28.33, suggesting a potential upside of 83.51%. Given GLOBALFOUNDRIES's stronger consensus rating and  higher possible upside, research analysts plainly believe GLOBALFOUNDRIES is more favorable than Amkor Technology.

GlobalFoundries目前的普遍目标价为77.93美元,暗示潜在上涨100.81%。Amkor Technology的共识目标价为28.33美元,暗示潜在上行空间为83.51%。鉴于GLOBALFOUNDRIES更强的共识评级和更高的可能上行空间,研究分析师显然认为GLOBALFOUNRIES比Amkor Technology更有利。

Summary

摘要

Amkor Technology beats GLOBALFOUNDRIES on 6 of the 11 factors compared between the two stocks.

Amkor Technology在两只股票比较的11个因素中有6个击败了GLOBALFONDRIES。

GLOBALFOUNDRIES Company Profile

Global Foundries公司简介

GLOBALFOUNDRIES Inc. operates as a semiconductor foundry worldwide. It manufactures integrated circuits, which enable various electronic devices that are pervasive. The company manufactures a range of semiconductor devices, including microprocessors, mobile application processors, baseband processors, network processors, radio frequency modems, microcontrollers, power management units, and microelectromechanical systems, as well as offers mainstream wafer fabrication services and technologies. The company was founded in 2009 and is based in Malta, New York.

GlobalFoundries Inc.作为一家半导体代工厂在全球范围内运营。它制造集成电路,使各种电子设备变得无处不在。该公司制造一系列半导体设备,包括微处理器、移动应用处理器、基带处理器、网络处理器、射频调制解调器、微控制器、电源管理单元和微电子机械系统,并提供主流晶片制造服务和技术。该公司成立于2009年,总部设在纽约的马耳他。

Amkor Technology Company Profile

Amkor科技公司简介

Amkor Technology, Inc. provides outsourced semiconductor packaging and test services in the United States, Japan, Europe, the Middle East, Africa, and the rest of the Asia Pacific. It offers turnkey packaging and test services, including semiconductor wafer bump, wafer probe, wafer back-grind, package design, packaging, and test and drop shipment services. The company also provides flip chip-scale package products for use in smartphones, tablets, and other mobile consumer electronic devices; flip-chip stacked chip-scale packages that are used to stack memory on top of digital baseband, and as applications processors in mobile devices; and flip-chip ball grid array packages for various networking, storage, computing, and consumer applications. In addition, it offers wafer-level CSP packages that are used in power management, transceivers, sensors, wireless charging, codecs, radar, and specialty silicon; wafer-level fan-out packages for use in ICs; and silicon wafer integrated fan-out technology, which replaces a laminate substrate with a thinner structure. Further, the company provides lead frame packages that are used in electronic devices for low to medium pin count analog and mixed-signal applications; substrate-based wirebond packages, which are used to connect a die to a substrate; micro-electro-mechanical systems (MEMS) packages that are miniaturized mechanical and electromechanical devices; and advanced system-in-package modules, which are used in radio frequency and front end modules, basebands, connectivity, fingerprint sensors, display and touch screen drivers, sensors and MEMS, and NAND memory and solid-state drives. It primarily serves integrated device manufacturers, fabless semiconductor companies, original equipment manufacturers, and contract foundries. Amkor Technology, Inc. was founded in 1968 and is headquartered in Tempe, Arizona.

Amkor Technology,Inc.在美国、日本、欧洲、中东、非洲和亚太地区其他地区提供外包半导体封装和测试服务。它提供全包式封装和测试服务,包括半导体晶片凸点、晶片探头、晶片背面研磨、封装设计、包装以及测试和直接发货服务。该公司还提供用于智能手机、平板电脑和其他移动消费电子设备的倒装芯片规模封装产品;用于在数字基带上堆叠存储器并用作移动设备中的应用处理器的倒装芯片堆叠芯片规模封装;以及用于各种网络、存储、计算和消费应用的倒装芯片球栅阵列封装。此外,该公司还提供用于电源管理、收发器、传感器、无线充电、编解码器、雷达和专用硅的晶圆级CSP封装;用于IC的晶圆级扇出封装;以及硅片集成扇出技术,它用更薄的结构取代了层压基板。此外,该公司还提供用于中低引脚数模拟和混合信号应用的电子设备的引线框架封装;用于将芯片连接到基板的基板引线键合封装;作为微型化机械和机电设备的微电子机械系统(MEMS)封装;以及用于射频和前端模块、基带、连接、指纹传感器、显示和触摸屏驱动器、传感器和MEMS,以及NAND存储器和固态驱动器的高级系统级封装模块。它主要服务于集成器件制造商、无厂房半导体公司、原始设备制造商和代工厂。Amkor Technology,Inc.成立于1968年,总部位于亚利桑那州坦佩。

本页的译文内容由软件翻译。富途将竭力但却不能保证翻译内容之准确和可靠,亦不会承担因任何不准确或遗漏而引起的任何损失或损害。

风险提示:以上内容仅作为作者或者嘉宾的观点,不代表富途的任何立场,不构成与富途相关的任何投资建议。在作出任何投资决定前,投资者应根据自身情况考虑投资产品相关的风险因素,并于需要时咨询专业投资顾问意见。富途竭力但不能证实上述内容的真实性、准确性和原创性,对此富途不做任何保证和承诺。

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