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6-K: Report of foreign private issuer [Rules 13a-16 and 15d-16]

6-K: Report of foreign private issuer [Rules 13a-16 and 15d-16]

6-K:外國發行人報告
美股SEC公告 ·  11/12 22:36

牛牛AI助理已提取核心訊息

On November 12, 2024, Taiwan Semiconductor Manufacturing Company Ltd. (TSMC) conducted a Board of Directors meeting where several key resolutions were passed. The Board approved the 2024 third quarter Business Report and Financial Statements, which showed a consolidated revenue of NT$759.69 billion and a net income of NT$325.26 billion, resulting in diluted earnings per share of NT$12.54. Additionally, a cash dividend of NT$4.50 per share for the third quarter was approved, with a record date set for March 24, 2025, and payment to be made on April 10, 2025. The Board also sanctioned capital appropriations of approximately US$15.48 billion for various purposes including fab construction, advanced technology capacity, and R&D investments for 2025. Furthermore, the issuance of unsecured corporate bonds in the domestic market was approved, not to exceed NT$60 billion, to finance capacity expansion and pollution prevention expenditures. TSMC, a pioneer of the pure-play foundry business model, continues to lead the semiconductor industry with its extensive process technologies and product portfolio, serving a wide range of global customers and partners.
On November 12, 2024, Taiwan Semiconductor Manufacturing Company Ltd. (TSMC) conducted a Board of Directors meeting where several key resolutions were passed. The Board approved the 2024 third quarter Business Report and Financial Statements, which showed a consolidated revenue of NT$759.69 billion and a net income of NT$325.26 billion, resulting in diluted earnings per share of NT$12.54. Additionally, a cash dividend of NT$4.50 per share for the third quarter was approved, with a record date set for March 24, 2025, and payment to be made on April 10, 2025. The Board also sanctioned capital appropriations of approximately US$15.48 billion for various purposes including fab construction, advanced technology capacity, and R&D investments for 2025. Furthermore, the issuance of unsecured corporate bonds in the domestic market was approved, not to exceed NT$60 billion, to finance capacity expansion and pollution prevention expenditures. TSMC, a pioneer of the pure-play foundry business model, continues to lead the semiconductor industry with its extensive process technologies and product portfolio, serving a wide range of global customers and partners.
2024年11月12日,台積電進行了一次董事會會議,通過了幾項關鍵決議。董事會批准了2024年第三季度業務報告和基本報表,顯示綜合營業收入爲7596.9億新臺幣,淨利潤爲3252.6億新臺幣,導致每股攤薄收益爲12.54新臺幣。此外,第三季度每股4.50新臺幣的現金股利獲得批准,股權登記日設定爲2025年3月24日,支付日期爲2025年4月10日。董事會還批准了約154.8億美元資本撥款,用於多種目的,包括晶圓廠建設、先進技術能力和2025年的研發投資。此外,批准了在國內市場發行不超過600億新臺幣的無抵押企業債券,用於資金擴張和防治污染支出。作爲純代工業務模式的先驅,台積電繼續憑藉其廣泛的工藝技術和產品組合領導半導體行業,爲廣泛的全球客戶和合作夥伴提供服務。
2024年11月12日,台積電進行了一次董事會會議,通過了幾項關鍵決議。董事會批准了2024年第三季度業務報告和基本報表,顯示綜合營業收入爲7596.9億新臺幣,淨利潤爲3252.6億新臺幣,導致每股攤薄收益爲12.54新臺幣。此外,第三季度每股4.50新臺幣的現金股利獲得批准,股權登記日設定爲2025年3月24日,支付日期爲2025年4月10日。董事會還批准了約154.8億美元資本撥款,用於多種目的,包括晶圓廠建設、先進技術能力和2025年的研發投資。此外,批准了在國內市場發行不超過600億新臺幣的無抵押企業債券,用於資金擴張和防治污染支出。作爲純代工業務模式的先驅,台積電繼續憑藉其廣泛的工藝技術和產品組合領導半導體行業,爲廣泛的全球客戶和合作夥伴提供服務。

譯文內容由第三人軟體翻譯。


牛牛AI助手部分由第三方人工智慧模型基於資訊內容自動產生,只对除中国内地以外的地区提供。


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