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6-K: ESMC Breaks Ground on Dresden Fab

6-K: ESMC Breaks Ground on Dresden Fab

6-K:ESMC德累斯頓工廠破土動工
美股SEC公告 ·  2024/08/20 21:23

牛牛AI助理已提取核心訊息

On August 20, 2024, a groundbreaking ceremony was held in Dresden, Germany, for the first semiconductor fabrication plant of the European Semiconductor Manufacturing Company (ESMC), a joint venture between Taiwan Semiconductor Manufacturing Company Ltd. (TSMC), Robert Bosch GmbH, Infineon Technologies AG, and NXP Semiconductors N.V. The event was attended by high-profile European leaders, including European Commission President Ursula von der Leyen and German Chancellor Olaf Scholz. The EU Commission has approved a €5 billion German measure to support the construction and operation of the fab under EU State aid rules. The Dresden facility, which is expected to start construction later in the year, will focus on meeting the semiconductor needs of the European automotive and industrial sectors. It will have a...Show More
On August 20, 2024, a groundbreaking ceremony was held in Dresden, Germany, for the first semiconductor fabrication plant of the European Semiconductor Manufacturing Company (ESMC), a joint venture between Taiwan Semiconductor Manufacturing Company Ltd. (TSMC), Robert Bosch GmbH, Infineon Technologies AG, and NXP Semiconductors N.V. The event was attended by high-profile European leaders, including European Commission President Ursula von der Leyen and German Chancellor Olaf Scholz. The EU Commission has approved a €5 billion German measure to support the construction and operation of the fab under EU State aid rules. The Dresden facility, which is expected to start construction later in the year, will focus on meeting the semiconductor needs of the European automotive and industrial sectors. It will have a monthly production capacity of 40,000 300mm wafers using TSMC's 28/22nm and 16/12nm process technologies. The total investment will exceed 10 billion euros, with contributions from equity, debt, and support from the EU and German government. The fab is expected to create around 2,000 direct high-tech jobs and stimulate additional indirect jobs throughout the EU supply chain. ESMC is committed to sustainability and environmental protection, aiming for LEED certification and implementing energy-efficient construction and water reclamation. The establishment of ESMC is a testament to TSMC's Grand Alliance and its commitment to fostering innovation in Europe.
2024年8月20日,歐洲半導體制造公司(ESMC)在德國德累斯頓舉行了第一家半導體制造工廠的奠基儀式,該公司是台積電、羅伯特·博世有限公司、英飛凌科技公司和恩智浦半導體公司的聯合創業企業。此次活動吸引了歐洲高級領導人的參與,包括歐盟委員會主席烏爾蘇拉·馮·德萊恩和德國總理奧拉夫·肖爾茨。歐盟委員會已經批准了一項50億歐元的德國措施,根據歐盟國家援助規則支持該工廠的建設和運營。德累斯頓工廠預計將於今年晚些時候開始施工,專注於滿足歐洲汽車和工業部門的半導體需求。該工廠將使用台積電的28/22納米和16/12納米工藝技術,月產能爲40,000個300毫米晶圓。總投資將超過100億歐元,其中包括股權...展開全部
2024年8月20日,歐洲半導體制造公司(ESMC)在德國德累斯頓舉行了第一家半導體制造工廠的奠基儀式,該公司是台積電、羅伯特·博世有限公司、英飛凌科技公司和恩智浦半導體公司的聯合創業企業。此次活動吸引了歐洲高級領導人的參與,包括歐盟委員會主席烏爾蘇拉·馮·德萊恩和德國總理奧拉夫·肖爾茨。歐盟委員會已經批准了一項50億歐元的德國措施,根據歐盟國家援助規則支持該工廠的建設和運營。德累斯頓工廠預計將於今年晚些時候開始施工,專注於滿足歐洲汽車和工業部門的半導體需求。該工廠將使用台積電的28/22納米和16/12納米工藝技術,月產能爲40,000個300毫米晶圓。總投資將超過100億歐元,其中包括股權、債務和歐盟及德國政府的支持。該工廠預計將創造大約2,000個直接的高科技就業機會,並刺激歐盟供應鏈的額外間接就業機會。ESMC致力於可持續發展和環境保護,力爭獲得LEED認證,實施節能施工和水資源回收。ESMC的成立是台積電大同盟計劃和其在歐洲促進創新的承諾的證明。

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