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Applied Materials | 424B2: Prospectus

Applied Materials | 424B2: Prospectus

應用材料 | 424B2:募資說明書
美股sec公告 ·  06/06 20:46
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Applied Materials, Inc., a leading provider of manufacturing equipment, services, and software to the semiconductor industry, has announced the issuance of senior notes due 20XX. The notes, offered globally, will pay interest semi-annually beginning on a specified date in 2024. The company may redeem the notes at any time prior to maturity at specified redemption prices. The offering price, underwriting discount, and proceeds to Applied Materials before expenses are yet to be determined. The issuance is subject to completion and is dated June 6, 2024. The notes are expected to be delivered to investors in registered book-entry form through The Depository Trust Company and its participants, including Clearstream Banking S.A. and Euroclear Bank, on a date around 2024, following the T+3 settlement cycle. The joint book-running managers for the offering include BofA Securities, J.P. Morgan, Citigroup, Mizuho, MUFG, and Wells Fargo Securities.
Applied Materials, Inc., a leading provider of manufacturing equipment, services, and software to the semiconductor industry, has announced the issuance of senior notes due 20XX. The notes, offered globally, will pay interest semi-annually beginning on a specified date in 2024. The company may redeem the notes at any time prior to maturity at specified redemption prices. The offering price, underwriting discount, and proceeds to Applied Materials before expenses are yet to be determined. The issuance is subject to completion and is dated June 6, 2024. The notes are expected to be delivered to investors in registered book-entry form through The Depository Trust Company and its participants, including Clearstream Banking S.A. and Euroclear Bank, on a date around 2024, following the T+3 settlement cycle. The joint book-running managers for the offering include BofA Securities, J.P. Morgan, Citigroup, Mizuho, MUFG, and Wells Fargo Securities.
應用材料公司是一家領先的提供半導體制造設備、服務和軟件的供應商,宣佈發行截止於20XX年到期的高級票據。這些票據全球公開發行,從2024年的特定日期起半年付息一次。該公司可在到期日前任何時間按指定的贖回價格贖回票據。發行價格、承銷折扣以及在扣除費用之前爲應用材料所得的收益尚待確定。該發行需完成並於2024年6月6日註銷。預計這些票據將通過託管公司及其參與方——包括清算銀行SA和歐洲清算銀行——以註冊簿記形式交付給投資者,日期爲2024年之後的一個日期,在T+3結算週期後。這次發行的主承銷商包括美銀證券、摩根大通、花旗集團、瑞穗銀行、日聯金融控股和富國證券。
應用材料公司是一家領先的提供半導體制造設備、服務和軟件的供應商,宣佈發行截止於20XX年到期的高級票據。這些票據全球公開發行,從2024年的特定日期起半年付息一次。該公司可在到期日前任何時間按指定的贖回價格贖回票據。發行價格、承銷折扣以及在扣除費用之前爲應用材料所得的收益尚待確定。該發行需完成並於2024年6月6日註銷。預計這些票據將通過託管公司及其參與方——包括清算銀行SA和歐洲清算銀行——以註冊簿記形式交付給投資者,日期爲2024年之後的一個日期,在T+3結算週期後。這次發行的主承銷商包括美銀證券、摩根大通、花旗集團、瑞穗銀行、日聯金融控股和富國證券。

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