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SD: Specialized disclosure report

SD: Specialized disclosure report

SD:專項披露公告
美股sec公告 ·  05/29 18:03
牛牛AI助理已提取核心訊息
Taiwan Semiconductor Manufacturing Company Limited (TSMC) has filed its annual Specialized Disclosure Report (Form SD) with the United States Securities and Exchange Commission. The report, which covers the period from January 1, 2023, to December 31, 2023, details TSMC's compliance with Rule 13p-1 under the Securities Exchange Act concerning conflict minerals. The Conflict Minerals Report, which is attached as Exhibit 1.01 and also available on TSMC's website and the SEC's website, includes the company's due diligence framework and conflict minerals disclosure. The report was signed by Cliff Hou, Senior Vice President and Deputy Co-COO, and Sylvia Fang, Senior Vice President and General Counsel, on May 28, 2024.
Taiwan Semiconductor Manufacturing Company Limited (TSMC) has filed its annual Specialized Disclosure Report (Form SD) with the United States Securities and Exchange Commission. The report, which covers the period from January 1, 2023, to December 31, 2023, details TSMC's compliance with Rule 13p-1 under the Securities Exchange Act concerning conflict minerals. The Conflict Minerals Report, which is attached as Exhibit 1.01 and also available on TSMC's website and the SEC's website, includes the company's due diligence framework and conflict minerals disclosure. The report was signed by Cliff Hou, Senior Vice President and Deputy Co-COO, and Sylvia Fang, Senior Vice President and General Counsel, on May 28, 2024.
臺灣半導體制造股份有限公司(TSMC)已向美國證券交易委員會提交了其年度專業披露報告(表格SD)。該報告涵蓋2023年1月1日至2023年12月31日期間,詳細介紹了台積電對《證券交易法》中有關衝突礦產的第13p-1條的遵守情況。《衝突礦產報告》作爲附錄1.01附後,也可在臺積電的網站和美國證券交易委員會的網站上查閱,其中包括該公司的盡職調查框架和衝突礦產披露。該報告由高級副總裁兼副聯合首席運營官Cliff Hou和高級副總裁兼總法律顧問Sylvia Fang於2024年5月28日簽署。
臺灣半導體制造股份有限公司(TSMC)已向美國證券交易委員會提交了其年度專業披露報告(表格SD)。該報告涵蓋2023年1月1日至2023年12月31日期間,詳細介紹了台積電對《證券交易法》中有關衝突礦產的第13p-1條的遵守情況。《衝突礦產報告》作爲附錄1.01附後,也可在臺積電的網站和美國證券交易委員會的網站上查閱,其中包括該公司的盡職調查框架和衝突礦產披露。該報告由高級副總裁兼副聯合首席運營官Cliff Hou和高級副總裁兼總法律顧問Sylvia Fang於2024年5月28日簽署。

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