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Taiwan Semiconductor | 6-K: Arizona and U.S. Department of Commerce Announce up to US$6.6 Billion in Proposed CHIPS Act Direct Funding, the Company Plans Third Leading-Edge Fab in Phoenix

Taiwan Semiconductor | 6-K: Arizona and U.S. Department of Commerce Announce up to US$6.6 Billion in Proposed CHIPS Act Direct Funding, the Company Plans Third Leading-Edge Fab in Phoenix

台積電 | 6-K:亞利桑那州和美國商務部宣佈擬提供高達 66 億美元的 CHIPS 法案直接資助,公司計劃在鳳凰城建設第三座前沿晶圓廠
SEC announcement ·  04/08 18:37
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Taiwan Semiconductor Manufacturing Company Ltd. (TSMC) has announced a partnership with the U.S. Department of Commerce, securing up to $6.6 billion in direct funding under the CHIPS and Science Act. This funding will support the construction of a third semiconductor fabrication plant (fab) in Phoenix, Arizona, as part of TSMC Arizona's expansion. The new fab will utilize the most advanced semiconductor process technology in the U.S. With the addition of the third fab, TSMC's total investment in the Arizona site will exceed $65 billion, marking the largest foreign direct investment in Arizona and in a U.S. greenfield project. TSMC's Chairman, Dr. Mark Liu, emphasized the opportunity to provide advanced manufacturing technologies in the U.S., while...Show More
Taiwan Semiconductor Manufacturing Company Ltd. (TSMC) has announced a partnership with the U.S. Department of Commerce, securing up to $6.6 billion in direct funding under the CHIPS and Science Act. This funding will support the construction of a third semiconductor fabrication plant (fab) in Phoenix, Arizona, as part of TSMC Arizona's expansion. The new fab will utilize the most advanced semiconductor process technology in the U.S. With the addition of the third fab, TSMC's total investment in the Arizona site will exceed $65 billion, marking the largest foreign direct investment in Arizona and in a U.S. greenfield project. TSMC's Chairman, Dr. Mark Liu, emphasized the opportunity to provide advanced manufacturing technologies in the U.S., while CEO Dr. C.C. Wei highlighted the company's commitment to meeting customer demand for advanced silicon. The expansion is expected to create approximately 6,000 direct high-tech jobs and support a competitive global semiconductor ecosystem. The first Arizona fab is set to begin production in the first half of 2025 with 4nm technology, followed by the second fab with 2nm and 3nm technologies in 2028, and the third fab by the end of the decade. TSMC is also focused on green manufacturing, aiming for a 90% water recycling rate and designing an industrial water reclamation plant for near zero liquid discharge. Additionally, TSMC plans to apply for U.S. Treasury Department Investment Tax Credits and may receive up to $5 billion in loans. The company maintains its long-term financial goals, including a 15-20% revenue CAGR, a gross margin of 53% or higher, and an ROE of 25% or higher. Customer remarks from AMD, Apple, and NVIDIA expressed strong support for TSMC's U.S. expansion.
臺灣半導體制造有限公司(TSMC)宣佈與美國商務部建立合作伙伴關係,根據CHIPS和科學法案獲得高達66億美元的直接資金。作爲亞利桑那州台積電擴張的一部分,這筆資金將支持在亞利桑那州鳳凰城建造第三座半導體制造工廠(fab)。新晶圓廠將採用美國最先進的半導體工藝技術。隨着第三座晶圓廠的加入,台積電在亞利桑那州基地的總投資將超過650億美元,這是在亞利桑那州和美國新建項目中最大的外國直接投資。台積電董事長Mark Liu博士強調了在美國提供先進製造技術的機會,而首席執行官C.C. Wei博士則強調了該公司對滿足客戶對先進硅需求的承諾。此次擴張預計將創造約6,000個直接的高科技工作崗位,並支持競爭...展開全部
臺灣半導體制造有限公司(TSMC)宣佈與美國商務部建立合作伙伴關係,根據CHIPS和科學法案獲得高達66億美元的直接資金。作爲亞利桑那州台積電擴張的一部分,這筆資金將支持在亞利桑那州鳳凰城建造第三座半導體制造工廠(fab)。新晶圓廠將採用美國最先進的半導體工藝技術。隨着第三座晶圓廠的加入,台積電在亞利桑那州基地的總投資將超過650億美元,這是在亞利桑那州和美國新建項目中最大的外國直接投資。台積電董事長Mark Liu博士強調了在美國提供先進製造技術的機會,而首席執行官C.C. Wei博士則強調了該公司對滿足客戶對先進硅需求的承諾。此次擴張預計將創造約6,000個直接的高科技工作崗位,並支持競爭激烈的全球半導體生態系統。亞利桑那州的第一座晶圓廠定於2025年上半年開始生產,採用4納米技術,其次是2028年第二座採用2納米和3納米技術的晶圓廠,第三座晶圓廠將在本世紀末開始生產。台積電還專注於綠色製造,目標是將水回收率提高到90%,並設計了接近零的液體排放的工業用水回收廠。此外,台積電計劃申請美國財政部投資稅收抵免,並可能獲得高達50億美元的貸款。該公司維持其長期財務目標,包括收入複合年增長率爲15-20%,毛利率爲53%或以上,投資回報率爲25%或以上。AMD、蘋果和英偉達的客戶言論表示堅決支持台積電在美國的擴張。

譯文內容由第三人軟體翻譯。


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