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Taiwan Semiconductor | 6-K: Report of foreign private issuer [Rules 13a-16 and 15d-16]

Taiwan Semiconductor | 6-K: Report of foreign private issuer [Rules 13a-16 and 15d-16]

台積電 | 6-K：外國發行人報告
SEC announcement ·  03/25 18:18
牛牛AI助理已提取核心訊息
Taiwan Semiconductor Manufacturing Company Ltd. (TSMC), listed on the NYSE as TSM, filed a Form 6-K with the United States Securities and Exchange Commission for the month of March 2024, reporting several key financial activities for February 2024. The report, signed by Senior Vice President and Chief Financial Officer Wendell Huang on March 25, 2024, detailed changes in shareholdings by TSMC's board of directors, executive officers, and major shareholders, with minor adjustments in the number of shares held. Notably, Dr. Cliff Hou was appointed as Senior Vice President and Deputy Co-Chief Operating Officer effective March 1, 2024. The company also reported on its investment activities, with NT$23.1 billion in fixed-income acquisitions and NT$3.2 billion in equity dispositions. Additionally, TSMC's board of directors...Show More
Taiwan Semiconductor Manufacturing Company Ltd. (TSMC), listed on the NYSE as TSM, filed a Form 6-K with the United States Securities and Exchange Commission for the month of March 2024, reporting several key financial activities for February 2024. The report, signed by Senior Vice President and Chief Financial Officer Wendell Huang on March 25, 2024, detailed changes in shareholdings by TSMC's board of directors, executive officers, and major shareholders, with minor adjustments in the number of shares held. Notably, Dr. Cliff Hou was appointed as Senior Vice President and Deputy Co-Chief Operating Officer effective March 1, 2024. The company also reported on its investment activities, with NT$23.1 billion in fixed-income acquisitions and NT$3.2 billion in equity dispositions. Additionally, TSMC's board of directors approved significant capital appropriations, including US$6.3 billion for machinery equipment for advanced technology capacity, US$0.9 billion for advanced packaging, mature and/or specialty technology capacity, and US$2.2 billion for real estate and capitalized leased assets. No changes in the pledge of TSMC common shares or unsecured bonds issued were reported for the period.
在紐約證券交易所上市的名爲TSM的臺灣半導體制造股份有限公司（TSMC）向美國證券交易委員會提交了2024年3月的6-K表格，報告了2024年2月的幾項關鍵財務活動。該報告由高級副總裁兼首席財務官黃文德於2024年3月25日簽署，詳細介紹了台積電董事會、執行官和主要股東的股權變化，對持股數量進行了細微調整。值得注意的是，Cliff Hou博士被任命爲高級副總裁兼副聯席首席運營官，自2024年3月1日起生效。該公司還報告了其投資活動，固定收益收購爲新臺幣231億元，股權處置爲新臺幣32億美元。此外，台積電董事會批准了大量資本撥款，包括63億美元用於先進技術產能的機械設備，9億美元用於先進封裝、成熟和/或專業技術產能，22億美元用於房地產和資本化租賃資產。在此期間，台積電普通股或發行的無抵押債券的質押沒有變化。
在紐約證券交易所上市的名爲TSM的臺灣半導體制造股份有限公司（TSMC）向美國證券交易委員會提交了2024年3月的6-K表格，報告了2024年2月的幾項關鍵財務活動。該報告由高級副總裁兼首席財務官黃文德於2024年3月25日簽署，詳細介紹了台積電董事會、執行官和主要股東的股權變化，對持股數量進行了細微調整。值得注意的是，Cliff Hou博士被任命爲高級副總裁兼副聯席首席運營官，自2024年3月1日起生效。該公司還報告了其投資活動，固定收益收購爲新臺幣231億元，股權處置爲新臺幣32億美元。此外，台積電董事會批准了大量資本撥款，包括63億美元用於先進技術產能的機械設備，9億美元用於先進封裝、成熟和/或專業技術產能，22億美元用於房地產和資本化租賃資產。在此期間，台積電普通股或發行的無抵押債券的質押沒有變化。
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