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Taiwan Semiconductor | 6-K: Submission Period for 2024 Annual Shareholders`Meeting

Taiwan Semiconductor | 6-K: Submission Period for 2024 Annual Shareholders`Meeting

台積電 | 6-K：2024年年度股東大會提交期間
SEC announcement ·  03/18 18:13
牛牛AI助理已提取核心訊息
Taiwan Semiconductor Manufacturing Company Ltd. (TSM), also known as Taiwan Semiconductor, has filed a Form 6-K with the United States Securities and Exchange Commission (SEC) for the month of March 2024. The report, dated March 18, 2024, and signed by Senior Vice President and Chief Financial Officer Wendell Huang, indicates that the company will file annual reports under Form 20-F. Additionally, Taiwan Semiconductor has announced the submission period for proposed resolutions and director nominations for its 2024 Annual Shareholders' Meeting. The submission period for shareholders to propose resolutions and nominate director candidates, including seven independent directors out of ten to be elected, will commence on April 2, 2024, and conclude on April 9, 2024. Shareholders are instructed to contact Citibank Shareholder Services for any enquiries regarding the submission process.
Taiwan Semiconductor Manufacturing Company Ltd. (TSM), also known as Taiwan Semiconductor, has filed a Form 6-K with the United States Securities and Exchange Commission (SEC) for the month of March 2024. The report, dated March 18, 2024, and signed by Senior Vice President and Chief Financial Officer Wendell Huang, indicates that the company will file annual reports under Form 20-F. Additionally, Taiwan Semiconductor has announced the submission period for proposed resolutions and director nominations for its 2024 Annual Shareholders' Meeting. The submission period for shareholders to propose resolutions and nominate director candidates, including seven independent directors out of ten to be elected, will commence on April 2, 2024, and conclude on April 9, 2024. Shareholders are instructed to contact Citibank Shareholder Services for any enquiries regarding the submission process.
臺灣半導體制造股份有限公司（TSM），也稱爲臺灣半導體，已向美國證券交易委員會（SEC）提交了2024年3月的6-K表格。該報告日期爲2024年3月18日，由高級副總裁兼首席財務官黃文德簽署，表明該公司將根據20-F表格提交年度報告。此外，臺灣半導體還宣佈了其2024年年度股東大會的擬議決議和董事提名的提交期限。股東提出決議和提名候選董事的提交期限將從2024年4月2日開始，並於2024年4月9日結束，包括十名獨立董事中的七名候選人。如果對提交流程有任何疑問，請股東聯繫花旗銀行股東服務部。
臺灣半導體制造股份有限公司（TSM），也稱爲臺灣半導體，已向美國證券交易委員會（SEC）提交了2024年3月的6-K表格。該報告日期爲2024年3月18日，由高級副總裁兼首席財務官黃文德簽署，表明該公司將根據20-F表格提交年度報告。此外，臺灣半導體還宣佈了其2024年年度股東大會的擬議決議和董事提名的提交期限。股東提出決議和提名候選董事的提交期限將從2024年4月2日開始，並於2024年4月9日結束，包括十名獨立董事中的七名候選人。如果對提交流程有任何疑問，請股東聯繫花旗銀行股東服務部。
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