牛牛AI助理已提取核心訊息
Taiwan Semiconductor Manufacturing Company Ltd. (TSMC), listed on both TWSE and NYSE under the ticker TSM, has reported a significant increase in its January 2024 consolidated net revenue. The revenue reached approximately NT$215.79 billion, marking a 22.4% rise from December 2023 and a 7.9% increase compared to January 2023. The report, filed with the United States Securities and Exchange Commission on February 7, 2024, also detailed the company's financial activities including loans to subsidiaries, endorsements, guarantees, and financial derivative transactions. TSMC's lending to its subsidiaries included an outstanding amount of NT$38.34 billion to TSMC China. Guarantees provided to various TSMC subsidiaries totaled NT$2.60 billion for TSMC Global, NT$234.60 billion for TSMC Arizona, and NT$251.25 billion for TSMC Design Technology Japan, among others. The company's financial derivatives, both those applying and not applying hedge accounting, were also disclosed, with outstanding notional amounts and unrealized profit/loss figures provided for each category.
Taiwan Semiconductor Manufacturing Company Ltd. (TSMC), listed on both TWSE and NYSE under the ticker TSM, has reported a significant increase in its January 2024 consolidated net revenue. The revenue reached approximately NT$215.79 billion, marking a 22.4% rise from December 2023 and a 7.9% increase compared to January 2023. The report, filed with the United States Securities and Exchange Commission on February 7, 2024, also detailed the company's financial activities including loans to subsidiaries, endorsements, guarantees, and financial derivative transactions. TSMC's lending to its subsidiaries included an outstanding amount of NT$38.34 billion to TSMC China. Guarantees provided to various TSMC subsidiaries totaled NT$2.60 billion for TSMC Global, NT$234.60 billion for TSMC Arizona, and NT$251.25 billion for TSMC Design Technology Japan, among others. The company's financial derivatives, both those applying and not applying hedge accounting, were also disclosed, with outstanding notional amounts and unrealized profit/loss figures provided for each category.
臺灣半導體制造股份有限公司（TSMC）在臺交所和紐約證券交易所上市，股票代碼爲TSM，該公司報告其2024年1月的合併淨收入大幅增長。收入達到約新臺幣2157.9億元，較2023年12月增長22.4％，與2023年1月相比增長7.9％。該報告於2024年2月7日向美國證券交易委員會提交，還詳細介紹了該公司的財務活動，包括對子公司的貸款、背書、擔保和金融衍生品交易。台積電向其子公司提供的貸款包括向台積電中國提供的383.4億新臺幣的未償貸款。向台積電各子公司提供的擔保總額爲台積電全球26億新臺幣，亞利桑那州台積電的擔保總額爲2346.0億新臺幣，日本臺積電設計技術公司等的擔保總額爲2,512.5億新臺幣。還披露了該公司的金融衍生品，包括適用和不適用套期保值會計的衍生品，並提供了每個類別的未清名義金額和未實現的損益數字。
臺灣半導體制造股份有限公司（TSMC）在臺交所和紐約證券交易所上市，股票代碼爲TSM，該公司報告其2024年1月的合併淨收入大幅增長。收入達到約新臺幣2157.9億元，較2023年12月增長22.4％，與2023年1月相比增長7.9％。該報告於2024年2月7日向美國證券交易委員會提交，還詳細介紹了該公司的財務活動，包括對子公司的貸款、背書、擔保和金融衍生品交易。台積電向其子公司提供的貸款包括向台積電中國提供的383.4億新臺幣的未償貸款。向台積電各子公司提供的擔保總額爲台積電全球26億新臺幣，亞利桑那州台積電的擔保總額爲2346.0億新臺幣，日本臺積電設計技術公司等的擔保總額爲2,512.5億新臺幣。還披露了該公司的金融衍生品，包括適用和不適用套期保值會計的衍生品，並提供了每個類別的未清名義金額和未實現的損益數字。
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