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AMD Announces New Graphics and Gaming Products for Ultimate Gameplay Experience at CES

AMD Announces New Graphics and Gaming Products for Ultimate Gameplay Experience at CES

AMD在CES上宣佈新的顯卡和遊戲產品,以提供終極遊戲體驗
GlobeNewswire ·  01/07 03:46

AMD Ryzen 9950X3D and 9900X3D, AMD Ryzen Z2, and AMD Ryzen 9000 Mobile processors elevate gaming performance across desktop, handheld and mobile gaming systems

AMD Ryzen 9950X3D和9900X3D、AMD Ryzen Z2和AMD Ryzen 9000移動處理器提升了桌面、手持和移動遊戲平台的遊戲性能

Ryzen 9000 Series Chip Shot

Ryzen 9000系列芯片照片

Ryzen 9000 Series Chip Shot
Ryzen 9000系列芯片照片

LAS VEGAS, Jan. 06, 2025 (GLOBE NEWSWIRE) -- Ahead of CES 2025, AMD (NASDAQ: AMD) today announced new gaming products to expand its leadership in desktop, mobile and handheld gaming, and deliver incredible performance for the most demanding games. AMD unveiled new Ryzen 9900X3D and 9950X3D Series desktop processors, offering unprecedented performance for desktop gamers, as well as the second-generation handheld gaming PC processor – the Ryzen Z2, enabling top-tier performance for AAA titles on the go.

拉斯維加斯,2025年1月6日(環球新聞)——在CES 2025之前, AMD (納斯達克:AMD)今天宣佈了新的遊戲產品,以擴展其在桌面、移動和手持遊戲中的領導地位,併爲最苛刻的遊戲提供驚人的性能。AMD推出了新的Ryzen 9900X3D和9950X3D系列桌面處理器,爲桌面遊戲玩家提供前所未有的性能,同時還推出了第二代手持遊戲平台處理器——Ryzen Z2,使得在移動中也能獲得頂級AAA遊戲的性能。

"Gaming has become the one of the biggest forms of entertainment around the world, and with titles becoming more immersive and demanding, having the right hardware and software is critical for the best player experience," said Jack Huynh, senior vice president and general manager, Computing and Graphics Group, AMD. "Today's announcements underscore our commitment to providing gamers everywhere the freedom to choose their own gaming experiences without being held back by performance bottle necks."

傑克·胡因(Jack Huynh),AMD計算與圖形集團高級副總裁兼總經理表示:「遊戲已成爲全球最大的娛樂形式之一,隨着遊戲更具沉浸感和要求更高,擁有合適的硬件和軟體對最佳玩家體驗至關重要。今天的公告強調了我們承諾爲全球遊戲玩家提供選擇自己遊戲體驗的自由,而不會受到性能瓶頸的限制。」

Ryzen 9950X3D and 9900X3D Desktop Processors for Gamers and Content Creators
AMD is rounding out its portfolio of exceptional desktop processors with AMD Ryzen 9950X3D and 9900X3D. The Ryzen 9950X3D is world's best 16-core processor for gamers1 and content creators2 featuring 16 "Zen 5" CPU cores and AMD RDNA 2 graphics. Based on the utilizing 2nd Gen AMD 3D V-Cache technology, the new X3D processors push the boundaries of performance and innovation for desktop gamers.

Ryzen 9950X3D和9900X3D桌面處理器,專爲遊戲玩家和內容創作者設計
AMD正在完善其卓越的桌面處理器系列,推出AMD Ryzen 9950X3D和9900X3D。Ryzen 9950X3D是全球最佳的16核處理器,適合遊戲玩家1和內容創作者2,配備16個"Zen 5" CPU核心和AMD RDNA 2圖形。基於2代AMD 3D V-Cache技術,新款X3D處理器推動了桌面遊戲性能和創新的邊界。

The new generation of X3D processors relocates the cache memory below the core complex die (CCD), placing "Zen 5" cores closer to the cooling solution, to deliver higher clock speeds at lower temperatures and providing better performance compared to the previous generation3.

新一代X3D處理器將緩存內存放置在覈心複合芯片(CCD)下方,使"Zen 5"核心更靠近冷卻解決方案,從而在較低溫度下實現更高的時鐘速度,並且相比上一代3提供更好的性能。

New Ryzen X3D models are expected to be on-shelf in Q1 2025.

新的Ryzen X3D型號預計將在2025年第一季度上架。

Model Cores/Threads Boost4 / Base Frequency Total Cache PCIe TDP
AMD Ryzen
9950X3D
16C/32T Up to 5.7 / 4.3 GHz 144 MB Gen 5 170W
AMD Ryzen
9900X3D
12C/24T Up to 5.5 / 4.4 GHz 140 MB Gen 5 120W
型號 核心/線程 Boost4 / 基礎頻率 總緩存 PCIe 熱設計功耗
AMD Ryzen
9950X3D
16核心/32線程 最高可達5.7 / 4.3 GHz 144 MB 第5代 170W
美國超微公司銳龍
9900X3D
12核心/24線程 最高可達5.5 / 4.4 GHz 140 MB 第5代 120W


Ryzen Z2 Series Handheld Gaming Processors
Designed to bring console-class gaming to the palm of customers' hands, AMD Ryzen Z2 Series processors deliver a unique blend of power and efficiency to enable world-class desktop gaming experiences in handheld form factors.


Ryzen Z2系列手持遊戲處理器
爲了將主機級遊戲體驗帶到用戶的掌心,AMD Ryzen Z2系列處理器提供了獨特的性能與效率的結合,使手持設備能夠實現世界級的桌面遊戲體驗。

Featuring up to 8 "Zen 5" CPU cores and RDNA 3.5 architecture-powered graphics, the new Ryzen Z2 processors offer ultra-responsive gaming and breathtaking graphics with low power optimizations for hours of uninterrupted play time.

新款Ryzen Z2處理器擁有多達8個「Zen 5」CPU核心和基於RDNA 3.5架構的圖形,提供超響應的遊戲體驗和驚豔的圖形效果,同時進行低功耗優化,確保數小時不間斷的遊戲時間。

Systems powered by Ryzen Z2 processors are expected to be available starting in Q1 2025.

搭載Ryzen Z2處理器的系統預計將於2025年第一季度開始上市。

Model Cores/Threads Boost5 / Base Frequency Total Cache Graphics Model AMD Graphics Cores cTDP
AMD Ryzen
Z2 Extreme
8C/16T Up to 5.0 / 2.0 GHz 24 MB AMD
RDNA 3.5
16 15-
35W
AMD Ryzen
Z2
4C/8T Up to 5.1 / 3.3 GHZ 24 MB AMD
RDNA 3
12 15-
30W
AMD Ryzen
Z2 Go
4C/8T Up to 4.3 / 3.0 GHz 10 MB AMD
RDNA 2
12 15-
30W
型號 核心/線程 提升5 / 基礎頻率 總緩存 圖形模型美國超微公司 圖形核心 cTDP
AMD Ryzen
Z2 Extreme
8核心/16線程 最高可達5.0 / 2.0 GHz 24 MB 美國超微公司
RDNA 3.5
16 15-
35W
AMD Ryzen
Z2
4C/8T 高達5.1 / 3.3 GHZ 24 MB 美國超微公司
RDNA 3
12 15-
30W
AMD Ryzen
Z2 Go
4C/8T 最高可達4.3 / 3.0 GHz 10 MB 美國超微公司
RDNA 2
12 15-
30W


Ryzen
9000HX Series for Mobile Notebooks
For the ultimate mobile gaming experience, new AMD Ryzen 9000HX Series processors deliver the most incredible performance a gaming laptop has ever seen. Re-engineered with 2nd generation 3D V-Cache technology, new Ryzen 9000HX Series have relocated the memory below the processor to deliver even higher performance benefits, lower temperatures and higher clock rates.


適用於移動筆記本的Ryzen 9000HX系列
爲了獲得終極移動遊戲體驗,全新的AMD Ryzen 9000HX系列處理器提供了遊戲筆記本前所未有的卓越性能。通過第二代3D V-Cache技術重新設計,全新的Ryzen 9000HX系列將內存重新放置在處理器下方,以提供更高的性能優勢、更低的溫度和更高的時鐘頻率。

At the top of the stack, the Ryzen 9955HX3D is projected to be one of the fastest mobile processors built for gamers and creators. Featuring up to 16 cores, capable of delivering 32 threads of processing performance, systems powered by Ryzen 9000HX processors are projected to offer the most performance cores you can get in a mobile PC processor. With advanced DDR5 memory support, Ryzen 9000HX processors deliver low-power high-bandwidth memory ideal for the most performant gaming laptops.

在產品系列的頂端,Ryzen 9955HX3D被預計將成爲爲遊戲玩家和創作者而打造的最快移動處理器之一。它具有高達16個核心,能夠提供32線程的處理性能,搭載Ryzen 9000HX處理器的系統預計將提供移動PC處理器中可獲得的最強性能核心。憑藉先進的DDR5內存支持,Ryzen 9000HX處理器提供低功耗高帶寬內存,非常適合性能最強的遊戲筆記本。

Systems are expected to be on shelf starting the first half of 2025.

預計系統將在2025年上半年上市。

Model Cores / Threads Boost6 / Base Frequency Total Cache Graphics Model AMD Graphics Cores cTDP
AMD Ryzen
9 9955HX3D
16/32 Up to 5.4 / 2.5
GHz
144 MB AMD Radeon
610M graphics
2 55-
75W
AMD Ryzen
9 9955HX
16/32 Up to 5.4 / 2.5
GHz
80 MB AMD Radeon
610M graphics
2 55-
75W
AMD Ryzen
9 9850HX
12/24 Up to 5.2/ 3.0
GHz
76 MB AMD Radeon
610M graphics
2 45-
75W
型號 核心 / 線程 提升6 / 基礎頻率 總緩存 圖形模型 美國超微公司 圖形核心 cTDP
美國超微公司銳龍
9 9955HX3D
16/32 最高可達5.4 / 2.5
GHz
144 MB AMD Radeon
61000萬圖形
2 55-
75瓦特
美國超微公司銳龍
9 9955HX
16/32 最高可達5.4 / 2.5
千兆赫
80 MB 美國超微公司Radeon
61000萬圖形
2 55-
75W
美國超微公司Ryzen
9 9850HX
12/24 高達5.2/3.0
GHz
76 MB 美國超微公司 Radeon
61000萬 顯卡
2 45-
75W


AMD Strengthens Gaming Ecosystem with OEMs and Game Developers
OEMs across the board are introducing more high-performance gaming systems powered by AMD Ryzen processors. New OEM systems provide gamers with unmatched compute and graphics performance in a variety of form factors.


AMD加強與OEM廠商和遊戲開發者的合作以提升遊戲生態系統
各大OEM廠商正在推出更多由AMD Ryzen處理器驅動的高性能遊戲系統。新的OEM系統爲玩家提供了在多種外形因素下無與倫比的計算和圖形性能。

"We are excited to expand our lineup of AMD-powered high-performance gaming systems in both notebook and handheld form factors," said Jerry Kao, COO, Acer. "With the growing expectations to make AI-enhanced gaming more immersive and competitive, Acer is delivering next-level experiences for gamers and creators alike with our new devices powered by AMD processors."

"我們很高興能夠擴展我們的AMD驅動高性能遊戲系統產品線,包括筆記本和手持設備,"Acer首席運營官Jerry Kao表示。"隨着對人工智能增強遊戲的期望不斷提高,Acer正通過我們的新設備爲遊戲玩家和創作者提供更具沉浸感和競爭力的下一代體驗,這些設備均由AMD處理器驅動。"

"ASUS has always been at the forefront of innovation to help gamers reach their true potential," said Samson Hu, co-CEO, ASUS. "With the new ROG systems powered by the AMD Ryzen 9000HX Series processors, gamers can push their limits and experience extreme power and performance in top-of-the-line notebooks."

"華碩始終處於創新的前沿,幫助玩家發揮他們的真實潛力,"華碩聯合首席執行官Samson Hu表示。"通過新的由AMD Ryzen 9000HX系列處理器驅動的ROG系統,玩家能夠突破極限,在頂級筆記本電腦中體驗極致的力量和性能。"

"At Lenovo, we're shaping the future of gaming by delivering innovative solutions from powerful high-performance laptops and towers to handheld devices. With AMD's cutting-edge Ryzen Z series processors, we're pushing the boundaries of what handheld gaming devices can achieve," said Jun Ouyang, Senior Vice President and General Manager, Consumer Segment, Intelligent Devices Group, Lenovo. "Together with AMD, we have reimagined how gamers interact with their technology across every platform, and we are committed to driving the next generation of gaming innovation that adapts to the evolving needs of gamers everywhere."

"在LENOVO B2401,我們通過提供從強大的高性能筆記本和塔式電腦到手持設備的創新解決方案,塑造遊戲的未來。憑藉美國超微公司的頂尖Ryzen Z系列處理器,我們正在推送手持遊戲設備的極限," LENOVO B2401消費部門高級副總裁兼總經理JJun Ouyang說。"與美國超微公司合作,我們重新構想了遊戲玩家如何在每個平台上與他們的技術互動,我們致力於推動下一代遊戲創新,以適應全球遊戲玩家不斷變化的需求。"

Supporting Resources

支持資源

  • Visit the AMD CES 2025 page for more information
  • Learn more about Ryzen handheld processors
  • Learn more about Ryzen desktop processors
  • Learn more about Ryzen mobile processors
  • Become a fan of AMD on Facebook
  • Follow AMD on X
  • 請訪問該 AMD 2025年CES 頁面以獲取更多信息
  • 了解更多關於 Ryzen手持處理器
  • 了解更多關於 Ryzen桌面處理器
  • 了解更多關於 Ryzen移動處理器
  • 在上成爲AMD的粉絲 臉書
  • 關注美國超微公司 X

About AMD
For more than 50 years AMD has driven innovation in high-performance computing, graphics and visualization technologies. Billions of people, leading Fortune 500 businesses and cutting-edge scientific research institutions around the world rely on AMD technology daily to improve how they live, work and play. AMD employees are focused on building leadership high-performance and adaptive products that push the boundaries of what is possible. For more information about how AMD is enabling today and inspiring tomorrow, visit the AMD (NASDAQ: AMD) website, blog, LinkedIn and X pages.

關於美國超微公司
在過去的50多年裏,美國超微公司推動了高性能計算、圖形和可視化技術的創新。數十億人、全球領先的財富500強企業和前沿的科學研究機構每天都依賴美國超微公司的技術來改善他們的生活、工作和娛樂。美國超微公司的員工專注於構建領導性的高性能和自適應產品,推動可能性的邊界。有關美國超微公司如何促進今天並激勵明天的更多信息,請訪問美國超微公司(納斯達克:AMD) 網站, 博客, LinkedInX 頁。

Cautionary Statement
This press release contains forward-looking statements concerning Advanced Micro Devices, Inc. (AMD) such as the features, functionality, performance, availability, timing and expected benefits of AMD products including the AMD Ryzen AI PRO 300 Series mobile processors, which are made pursuant to the Safe Harbor provisions of the Private Securities Litigation Reform Act of 1995. Forward-looking statements are commonly identified by words such as "would," "may," "expects," "believes," "plans," "intends," "projects" and other terms with similar meaning. Investors are cautioned that the forward-looking statements in this press release are based on current beliefs, assumptions and expectations, speak only as of the date of this press release and involve risks and uncertainties that could cause actual results to differ materially from current expectations. Such statements are subject to certain known and unknown risks and uncertainties, many of which are difficult to predict and generally beyond AMD's control, that could cause actual results and other future events to differ materially from those expressed in, or implied or projected by, the forward-looking information and statements. Material factors that could cause actual results to differ materially from current expectations include, without limitation, the following: Intel Corporation's dominance of the microprocessor market and its aggressive business practices; Nvidia's dominance in the graphics processing unit market and its aggressive business practices; competitive markets in which AMD's products are sold; the cyclical nature of the semiconductor industry; market conditions of the industries in which AMD products are sold; AMD's ability to introduce products on a timely basis with expected features and performance levels; loss of a significant customer; economic and market uncertainty; quarterly and seasonal sales patterns; AMD's ability to adequately protect its technology or other intellectual property; unfavorable currency exchange rate fluctuations; ability of third party manufacturers to manufacture AMD's products on a timely basis in sufficient quantities and using competitive technologies; availability of essential equipment, materials, substrates or manufacturing processes; ability to achieve expected manufacturing yields for AMD's products; AMD's ability to generate revenue from its semi-custom SoC products; potential security vulnerabilities; potential security incidents including IT outages, data loss, data breaches and cyberattacks; uncertainties involving the ordering and shipment of AMD's products; AMD's reliance on third-party intellectual property to design and introduce new products; AMD's reliance on third-party companies for design, manufacture and supply of motherboards, software, memory and other computer platform components; AMD's reliance on Microsoft and other software vendors' support to design and develop software to run on AMD's products; AMD's reliance on third-party distributors and add-in-board partners; impact of modification or interruption of AMD's internal business processes and information systems; compatibility of AMD's products with some or all industry-standard software and hardware; costs related to defective products; efficiency of AMD's supply chain; AMD's ability to rely on third party supply-chain logistics functions; AMD's ability to effectively control sales of its products on the gray market; long-term impact of climate change on AMD's business; impact of government actions and regulations such as export regulations, tariffs and trade protection measures; AMD's ability to realize its deferred tax assets; potential tax liabilities; current and future claims and litigation; impact of environmental laws, conflict minerals related provisions and other laws or regulations; evolving expectations from governments, investors, customers and other stakeholders regarding corporate responsibility matters; issues related to the responsible use of AI; restrictions imposed by agreements governing AMD's notes, the guarantees of Xilinx's notes and the revolving credit agreement; impact of acquisitions, joint ventures and/or investments on AMD's business and AMD's ability to integrate acquired businesses; our ability to complete the acquisition of ZT Systems; impact of any impairment of the combined company's assets; political, legal and economic risks and natural disasters; future impairments of technology license purchases; AMD's ability to attract and retain qualified personnel; and AMD's stock price volatility. Investors are urged to review in detail the risks and uncertainties in AMD's Securities and Exchange Commission filings, including but not limited to AMD's most recent reports on Forms 10-K and 10-Q.

警示聲明
本新聞稿包含關於美國超微公司(AMD)的前瞻性聲明,涉及AMD產品的特性、功能、性能、可用性、時機和預期好處,包括根據1995年《私人證券訴訟改革法》安全港條款製作的AMD Ryzen AI PRO 300系列移動處理器。前瞻性聲明通常通過「將」、「可能」、「期望」、「相信」、「計劃」、「打算」、「項目」等詞語及其他類似含義的術語來識別。投資者應注意,本新聞稿中的前瞻性聲明基於當前的信念、假設和期望,截止到本新聞稿發佈之日,僅表述至該日期,並涉及可能導致實際結果與當前預期有實質性差異的風險和不確定性。這些聲明受到某些已知和未知的風險和不確定性影響,其中許多難以預測並且一般超出AMD的控制範圍,可能導致實際結果和其他未來事件與前瞻性信息和聲明中所表達、暗示或預測的內容有實質性差異。可能導致實際結果與當前預期存在實質性差異的重大因素包括但不限於以下內容:英特爾-T在微處理器市場上的主導地位及其激進的商業行爲;英偉達在圖形處理單元市場上的主導地位及其激進的商業行爲;AMD產品銷售的競爭市場;半導體行業的週期性特徵;AMD產品銷售行業的市場條件;AMD按時推出具有預期特性和性能水平的產品的能力;失去一位重要客戶;經濟和市場不確定性;季度和季節性銷售模式;AMD充分保護其技術或其他知識產權的能力;不利的貨幣兌換率波動;第三方製造商按時按需製作AMD產品的能力及使用競爭性技術的能力;至關重要的設備、材料、基材或製造過程的可用性;實現AMD產品預期製造良率的能力;AMD從其半定製SoC產品中產生營業收入的能力;潛在的安全漏洞;潛在的安全事件,包括IT停機、數據丟失、數據泄露和網絡攻擊;涉及AMD產品訂購和發貨的不確定性;AMD對第三方知識產權的依賴,以設計和推出新產品;AMD對第三方公司在主板、軟體、內存及其他計算機平台元件方面的設計、製造和供應的依賴;AMD對微軟及其他軟體供應商的支持以設計和開發在AMD產品上運行的軟體的依賴;AMD對第三方分銷商和增值板合作伙伴的依賴;對AMD內部業務流程和信息系統的修改或中斷的影響;AMD產品與某些或全部行業標準軟體和硬件的兼容性;與缺陷產品相關的成本;AMD供應鏈的效率;AMD對第三方供應鏈物流功能的依賴;AMD有效控制其產品在灰色市場銷售的能力;氣候變化對AMD業務的長期影響;政府行爲和法規的影響,如出口監管、關稅和貿易保護措施;AMD實現其遞延所得稅資產的能力;潛在的稅務責任;當前和未來的索賠及訴訟;環保法、衝突礦產相關條款及其他法律或法規的影響;來自政府、投資者、客戶和其他利益相關者對企業責任事項的期望的演變;與人工智能的負責任使用有關的問題;由控制AMD票據的協議、Xilinx票據的擔保和循環信貸協議施加的限制;收購、合資和/或投資對AMD業務的影響以及AMD整合收購業務的能力;我們完成收購Zt Systems的能力;合併公司資產減值的影響;政治、法律和經濟風險及自然災害;未來技術許可購買的減值;AMD吸引和留住合格人員的能力;以及AMD股價波動性。投資者應詳細審查AMD在證券交易委員會的文件中所述的風險和不確定性,包括但不限於AMD最近在10-K和10-Q表格上的報告。

2025 Advanced Micro Devices, Inc. All rights reserved. AMD, the AMD Arrow logo, Radeon, RDNA, Ryzen, XDNA and combinations thereof are trademarks of Advanced Micro Devices, Inc. Certain AMD technologies may require third-party enablement or activation. Supported features may vary by operating system. Please confirm with the system manufacturer for specific features. No technology or product can be completely secure.

2025 美國超微公司。保留所有權利。AMD、AMD箭頭標誌、Radeon、RDNA、Ryzen、XDNA及其組合是美國超微公司的商標。某些AMD技術可能需要第三方啓用或激活。支持的功能可能因操作系統而異。請與系統製造商確認具體功能。沒有任何技術或產品可以完全安全。

The information contained herein is for informational purposes only and is subject to change without notice. Timelines, roadmaps, and/or product release dates shown in this Press Release are plans only and subject to change.

此處包含的信息僅供參考,隨時可能更改,恕不另行通知。此新聞稿中所示的時間表、路線圖和/或產品發佈日期僅爲計劃,可能會發生變化。

Contact:
Stacy MacDiarmid
AMD Communications
+1 (512) 658-2265
Stacy.MacDiarmid@amd.com

聯繫:
斯泰西·麥克迪爾米德
通信
+1 (512) 658-2265
Stacy.MacDiarmid@amd.com

____________________________________

____________________________________

1 Testing as of Nov 2024 by AMD Performance Labs using the following game titles tested at 1080p high settings: Black Myth: Wukong, Avatar: Frontiers of Pandora, Hogwarts Legacy, Call of Duty: Black Ops, Starfield, CyberPunk 2077, Counter Strike 2, Finaly Fantasy XIV, Hitman 3, Warhammer 20,000: Space Marine 2, Watch Dogs: Legion, Far Cry 6, Ashes of the Singularity. Both AMD Ryzen 9 9950X3D and Ryzen 7 7950X3D systems configured as follows: GIGABYTE X870E AORUS MASTER, 32GB DDR5-6000, Nvidia RTX 4090, KRAKEN X63, Win 11 Pro 26100, VBS ON, SAM/REBAR ON. System manufacturers may vary configurations, yielding different results. GNR-27.
2 Testing as of Nov 2024 by AMD Performance Labs using the following benchmarks: PugetBench Premiere Pro 24.5, PugetBench Photoshop 25.11, PugetBench Davinci Resolve 19.0.1. Geekbench 6.3, Blender 4.2.3 Monster and Classroom, Corona Benchmark, Cinebench 2024. Both AMD Ryzen 9 9950X3D and Ryzen 7 7950X3D systems configured as follows: GIGABYTE X870E AORUS MASTER, 32GB DDR5-6000, Nvidia RTX 4090, KRAKEN X63, Win 11 Pro 26100, VBS ON, SAM/REBAR ON. System manufacturers may vary configurations, yielding different results. GNR-29.
3 Testing as of Nov 2024 by AMD Performance Labs using the following benchmarks: PugetBench Premiere Pro 24.5, PugetBench Photoshop 25.11, PugetBench Davinci Resolve 19.0.1. Geekbench 6.3, Blender 4.2.3 Monster and Classroom, Corona Benchmark, Cinebench 2024. AMD Ryzen 9 9950X3D system configuration: GIGABYTE X870E AORUS MASTER, 32GB DDR5-6000, Nvidia RTX 4090, KRAKEN X63, Win 11 Pro 26100, VBS ON, SAM/REBAR ON. Intel Core Ultra 9 285K system configuration: ASUS ROG STRIX Z890-E GAMING WIFI, 32GB DDR5-6400, Nvidia RTX 4090, KRAKEN X63, Win 11 Pro 26100, VBS ON, SAM/REBAR ON. System manufacturers may vary configurations, yielding different results. GNR-30.
4 Boost Clock Frequency is the maximum frequency achievable on the CPU running a bursty workload. Boost clock achievability, frequency, and sustainability will vary based on several factors, including but not limited to: thermal conditions and variation in applications and workloads. GD-150.
5 Boost Clock Frequency is the maximum frequency achievable on the CPU running a bursty workload. Boost clock achievability, frequency, and sustainability will vary based on several factors, including but not limited to: thermal conditions and variation in applications and workloads. GD-150.
6 Boost Clock Frequency is the maximum frequency achievable on the CPU running a bursty workload. Boost clock achievability, frequency, and sustainability will vary based on several factors, including but not limited to: thermal conditions and variation in applications and workloads. GD-150.

截至2024年11月,AMD性能實驗室使用以下游戲標題在1080p高設置下進行測試:黑神話:悟空,阿凡達:潘多拉的邊界,霍格沃茨遺產,使命召喚:黑色行動,星空,賽博朋克2077,反恐精英2,最終幻想14,刺客信條3,戰錘20,000:太空海軍陸戰隊2, watchdogs:軍團,孤島危機6,火星餘燼。AMD Ryzen 9 9950X3D和Ryzen 7 7950X3D系統配置如下:GIGABYTE X870E AORUS MASTER,32Gb DDR5-6000,Nvidia RTX 4090,KRAKEN X63,Win 11 Pro 26100,VBS開啓,SAM/REBAR開啓。系統製造商可能會更改配置,從而得出不同的結果。GNR-27。
截至2024年11月,AMD性能實驗室使用以下基準測試進行測試:PugetBench Premiere Pro 24.5,PugetBench Photoshop 25.11,PugetBench Davinci Resolve 19.0.1。Geekbench 6.3,Blender 4.2.3 Monster和Classroom,Corona基準測試,Cinebench 2024。AMD Ryzen 9 9950X3D和Ryzen 7 7950X3D系統配置如下:GIGABYTE X870E AORUS MASTER,32Gb DDR5-6000,Nvidia RTX 4090,KRAKEN X63,Win 11 Pro 26100,VBS開啓,SAM/REBAR開啓。系統製造商可能會更改配置,從而得出不同的結果。GNR-29。
截至2024年11月,AMD性能實驗室使用以下基準測試進行測試:PugetBench Premiere Pro 24.5,PugetBench Photoshop 25.11,PugetBench Davinci Resolve 19.0.1。Geekbench 6.3,Blender 4.2.3 Monster和Classroom,Corona基準測試,Cinebench 2024。AMD Ryzen 9 9950X3D系統配置:GIGABYTE X870E AORUS MASTER,32Gb DDR5-6000,Nvidia RTX 4090,KRAKEN X63,Win 11 Pro 26100,VBS開啓,SAM/REBAR開啓。英特爾Core Ultra 9 28.5萬系統配置:ASUS ROG STRIX Z890-E GAMING WIFI,32Gb DDR5-6400,Nvidia RTX 4090,KRAKEN X63,Win 11 Pro 26100,VBS開啓,SAM/REBAR開啓。系統製造商可能會更改配置,從而得出不同的結果。GNR-30。
4 Boost時鐘頻率是CPU在突發工作負載下可達到的最大頻率。Boost時鐘的可實現性、頻率和持續性將根據多個因素有所不同,包括但不限於:熱條件以及應用和工作負載的變化。GD-150。
增強時鐘頻率是CPU在運行突發工作負載時能夠實現的最大頻率。增強時鐘的可達性、頻率和可持續性將根據多種因素而有所不同,包括但不限於:熱條件和應用程序及工作負載的變化。GD-150。
6 Boost Clock Frequency是CPU在運行突發工作負載時可以達到的最大頻率。提升時鐘的可實現性、頻率和持續性將根據多種因素而變化,包括但不限於:熱態條件和應用程序以及工作負載的變化。GD-150。

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譯文內容由第三人軟體翻譯。


以上內容僅用作資訊或教育之目的,不構成與富途相關的任何投資建議。富途竭力但無法保證上述全部內容的真實性、準確性和原創性。
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