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Aehr Test Systems Secures Initial $10 Million in Orders for Production Wafer-Level Burn-In of Advanced AI Processors

Aehr Test Systems Secures Initial $10 Million in Orders for Production Wafer-Level Burn-In of Advanced AI Processors

Aehr Test Systems獲得首批1000萬美元的訂單,用於先進人工智能處理器的生產晶圓級燒錄。
Aehr Test Systems ·  2024/12/16 13:00

Fremont, CA (December 16, 2024) – Aehr Test Systems (NASDAQ: AEHR), a worldwide supplier of semiconductor test and burn-in equipment, today announced a significant milestone with the receipt of its first artificial intelligence (AI) customer order for multiple high-power FOX-XP wafer level test and burn-in systems and multiple sets of Aehr Test proprietary WaferPakTM Contactors. These initial volume production orders are valued at over $10 million with the first system scheduled to ship immediately and completion of the shipments of the systems and initial product WaferPaks within 90 days.

加州弗裏蒙特(2024年12月16日)——Aehr Test Systems(納斯達克:AEHR),一家全球半導體測試和燒錄設備供應商,今天宣佈了一個重要里程碑,收到了首個人工智能(AI)客戶訂單,包含多個高功率FOX-XP晶圓級測試和燒錄系統,以及多套Aehr Test專有的WaferPakTm接觸器。這些初始的成交量生產訂單的價值超過1000萬美元,首個系統計劃立即發貨,系統和初始產品WaferPaks的發貨將在90天內完成。

Gayn Erickson, President and CEO of Aehr Test Systems, commented, "We are excited that after successfully proving the wafer level test performance and throughput on our systems at our headquarters in Silicon Valley California, this cutting-edge AI customer has chosen our new high-power FOX-XP solution for production wafer level test and burn-in of their AI processors. We were able to successfully demonstrate the FOX-XP production system to the customer and anticipated this order and first system shipment before the end of our fiscal quarter ended November 30, 2024. Instead, with the order received just now, the systems will all ship within this fiscal quarter ending February 28, 2025.

Aehr Test Systems的總裁兼首席執行官Gayn Erickson評論道:"我們很高興,經過在我們位於加州硅谷的總部成功驗證了我們的系統的晶圓級測試性能和吞吐量後,這家尖端AI客戶選擇了我們的新高功率FOX-XP解決方案進行其AI處理器的生產晶圓級測試和燒錄。在我們的客戶面前成功展示了FOX-XP生產系統並預計在2024年11月30日結束的財務季度之前會收到這筆訂單和首個系統發貨。然而,這筆訂單剛剛收到,系統將在2025年2月28日結束的本財政季度內全部發貨。"

"This marks a technology and commercial breakthrough for Aehr as it significantly expands the market opportunities for our FOX-XP wafer level test and burn-in systems. This new AI customer recognizes the substantial advantages of conducting production test and burn-in at wafer level, before integration into the final product. This approach offers greater cost efficiency, improved yields, and scales significantly better in the semiconductor manufacturing process compared to the required burn-in testing later in the product manufacturing cycle.

"這標誌着Aehr的技術和商業突破,因爲它顯著拓展了我們FOX-XP晶圓級測試和燒錄系統的市場機會。這個新的AI客戶認識到在最終產品集成之前在晶圓級進行生產測試和燒錄的顯著優勢。這種方法提供了更高的成本效率、改善的良率,並在半導體制造過程中相比於產品製造週期後期所需的燒錄測試,具有更好的擴展性。"

"This latest turnkey solution from Aehr using our FOX-XP multi-wafer test and burn-in system with our proprietary WaferPak full wafer Contactors provides thousands of watts of power delivery and thermal control per wafer. It enables a first ever ability to do a cost-effective production test and burn-in of high-power devices such as AI accelerators at the wafer level with temperatures reaching up to 150 degrees Celsius. This process enables a significant cost saving and yield improvement with the detection and elimination of early life failures during the production process while the devices are still in wafer form, before they are assembled into modules or systems. Our proprietary WaferPaks are designed for high-power applications, providing precise voltage and currents to each device under test. They can deliver thousands of amps of current and cool thousands of watts per wafer while also transmitting the digital signals needed to assess the functionality of both good and bad devices.

"Aehr最新的即插即用解決方案利用我們的FOX-XP多晶圓測試和燒錄系統,以及我們專有的WaferPak全晶圓特斯拉-接觸器,提供每個晶圓數千瓦的功率傳輸和熱控制。這使得在晶圓級以最高150攝氏度的溫度進行高功率設備(如AI加速器)的成本效益生產測試和燒錄成爲可能。這個過程在生產過程中檢測並消除早期失效,從而顯著節省成本並提高良率,同時設備仍處於晶圓狀態,而不是在組裝成模塊或系統後。我們的專有WaferPaks被設計用於高功率應用,爲每個測試設備提供精確的電壓和電流。它們可以提供數千安培的電流,併爲每個晶圓冷卻數千瓦,同時傳輸評估良好和不良設備功能所需的數字信號。"

"With this solution, we are now able to offer our customers the ability to do production wafer level burn-in of their AI processors and accelerators in addition to our offering of both reliability qualification and production burn-in at package part with our Sonoma ultra-high-power test and burn-in system that we are now shipping in volume to many manufacturers around the world. Aehr Test Systems is the only company in the world that can now offer both wafer level and package level turnkey test and burn-in solutions for these AI processors."

"通過這個解決方案,我們現在能夠爲客戶提供在生產中對他們的AI處理器和加速器進行晶圓級燒錄的能力,此外我們的產品還包括利用Sonoma超高功率測試和燒錄系統對封裝部分進行可靠性資格和生產燒錄,這個系統目前已經在全球許多製造商中大規模交付。Aehr Test Systems是全球唯一能夠同時提供晶圓級和封裝級一站式測試和燒錄解決方案的公司,專門用於這些AI處理器。"

The FOX-XP and FOX-NP systems, available with multiple WaferPak Contactors (full wafer test) or multiple DiePakTM Carriers (singulated die/module test) configurations, are capable of functional test and burn-in/cycling of devices such as artificial intelligence processors and accelerators, silicon carbide and gallium nitride power semiconductors, silicon photonics as well as other optical devices, 2D and 3D sensors, flash memories, magnetic sensors, microcontrollers, and other leading-edge ICs in either wafer form factor before they are assembled into single or multi-die stacked packages, or in singulated die or module form factor.

FOX-XP和FOX-NP系統,提供多種WaferPak特斯拉-接觸器(全晶圓測試)或多種DiePakTm載體(單個芯片/模塊測試)配置,能夠對人工智能處理器和加速器、碳化硅和氮化鎵功率半導體、硅光子學以及其他光學設備、2D和3D傳感器、閃存、磁傳感器、微控制器和其他前沿集成電路進行功能測試和燒錄/循環處理,處理後將其組裝成單個或多個芯片堆疊封裝,或單個芯片或模塊形式。

About Aehr Test Systems
Headquartered in Fremont, California, Aehr Test Systems is a leading provider of test solutions for testing, burning-in, and stabilizing semiconductor devices in wafer level, singulated die, and package part form, and has installed thousands of systems worldwide. Increasing quality, reliability, safety, and security needs of semiconductors used across multiple applications, including electric vehicles, electric vehicle charging infrastructure, solar and wind power, computing, data and telecommunications infrastructure, and solid-state memory and storage, are driving additional test requirements, incremental capacity needs, and new opportunities for Aehr Test products and solutions. Aehr has developed and introduced several innovative products including the FOX-PTM families of test and burn-in systems and FOX WaferPakTM Aligner, FOX WaferPak Contactor, FOX DiePak Carrier and FOX DiePak Loader. The FOX-XP and FOX-NP systems are full wafer contact and singulated die/module test and burn-in systems that can test, burn-in, and stabilize a wide range of devices such as leading-edge artificial intelligence processors and accelerators, silicon carbide-based and other power semiconductors, 2D and 3D sensors used in mobile phones, tablets, and other computing devices, memory semiconductors, processors, microcontrollers, systems-on-a-chip, and photonics and integrated optical devices. The FOX-CP system is a low-cost single-wafer compact test solution for logic, memory and photonic devices and the newest addition to the FOX-P product family. The FOX WaferPak Contactor contains a unique full wafer contactor capable of testing wafers up to 300mm that enables IC manufacturers to perform test, burn-in, and stabilization of full wafers on the FOX-P systems. The FOX DiePak Carrier allows testing, burning in, and stabilization of singulated bare die and modules up to 1024 devices in parallel per DiePak on the FOX-NP and FOX-XP systems up to nine DiePaks at a time. Acquired through its acquisition of Incal Technology, Inc., Aehr's new line of high-power packaged part reliability/burn-in test solutions for Artificial Intelligence (AI) semiconductor manufacturers, including its ultra-high-power Sonoma family of test solutions for AI accelerators, GPUs, and high-performance computing (HPC) processors, position Aehr within the rapidly growing AI market as a turn-key provider of reliability and testing that span from engineering to high volume production. For more information, please visit Aehr Test Systems' website at .

aehr@mkr-group.com
Aehr Test Systems總部位於加利福尼亞州弗裏蒙特,是一家領先的測試解決方案提供商,專門針對晶圓級、單芯片和封裝部件形式的半導體設備進行測試、燒錄和穩定,並在全球安裝了數千個系統。半導體在多個應用中對質量、可靠性、安全性和安防-半導體需求的增加,包括新能源汽車、電動車充電基礎設施、太陽能和可再生能源、計算、數據和電信基礎設施,以及固態內存和存儲,正在推動額外的測試需求、增量能力需求和Aehr Test產品與解決方案的新機會。Aehr開發並推出了幾款創新產品,包括FOX-PTm系列測試和燒錄系統,以及FOX WaferPakTm對準器、FOX WaferPak特斯拉-接觸器、FOX DiePak載體和FOX DiePak裝載器。FOX-XP和FOX-NP系統是全晶圓接觸和單芯片/模塊測試和燒錄系統,能夠測試、燒錄和穩定各種設備,如前沿的人工智能處理器和加速器、基於碳化硅和其他功率半導體、在手機、平板電腦和其他計算設備中使用的2D和3D傳感器、內存半導體、處理器、微控制器、系統級芯片以及光子學和集成光學設備。FOX-CP系統是針對邏輯、內存和光子設備的低成本單晶圓緊湊型測試解決方案,是FOX-P產品系列的新成員。FOX WaferPak特斯拉-接觸器具有獨特的全晶圓接觸器,能夠測試高達300mm的晶圓,使IC製造商能夠在FOX-P系統上進行全晶圓的測試、燒錄和穩定。FOX DiePak載體允許在FOX-NP和FOX-XP系統上,最多九個DiePak同時進行單個裸芯片和模塊的測試、燒錄和穩定,每個DiePak可處理高達1024個設備。通過收購Incal Technology, Inc.,Aehr的新系列高功率封裝部件可靠性/燒錄測試解決方案專爲人工智能(AI)半導體制造商設計,包括其超高功率Sonoma系列AI加速器、GPU和高性能計算(HPC)處理器的測試解決方案,使Aehr在快速增長的AI市場中成爲可靠性和測試的一站式提供商,涵蓋從工程到高產量生產的各個環節。有關更多信息,請訪問Aehr Test Systems的網站。

Safe Harbor Statement
This press release contains certain forward-looking statements within the meaning of Section 27A of the Securities Act of 1933 and Section 21E of the Securities Exchange Act of 1934. Forward-looking statements generally relate to future events or Aehr's future financial or operating performance. In some cases, you can identify forward-looking statements because they contain words such as "may," "will," "should," "expects," "plans," "anticipates," "going to," "could," "intends," "target," "projects," "contemplates," "believes," "estimates," "predicts," "potential," or "continue," or the negative of these words or other similar terms or expressions that concern Aehr's expectations, strategy, priorities, plans, or intentions. Forward-looking statements in this press release include, but are not limited to, future requirements and orders of Aehr's new and existing customers; Aehr's ability to receive orders and generate revenue in the future, as well as Aehr's beliefs regarding the factors impacting the foregoing, including the growth of the markets referred to herein; Aehr's ability to integrate Incal efficiently; the timing and extent to which the acquisition is accretive; the closing of the acquisition; and the growth of the markets referred to herein. The forward-looking statements contained in this press release are also subject to other risks and uncertainties, including those more fully described in Aehr's recent Form 10-K, 10-Q and other reports filed from time to time with the Securities and Exchange Commission. Aehr disclaims any obligation to update information contained in any forward-looking statement to reflect events or circumstances occurring after the date of this press release.

安全港聲明
本新聞稿包含某些前瞻性聲明,符合1933年證券法第27A條和1934年證券交易法第21E條的定義。前瞻性聲明通常與未來事件或Aehr未來的財務或運營表現相關。在某些情況下,您可以通過這些聲明中包含的詞彙來識別前瞻性聲明,比如「可能」、「將」、「應該」、「預期」、「計劃」、「預計」、「即將」、「可以」、「打算」、「目標」、「項目」、「考慮」、「相信」、「估計」、「預測」、「潛在」或「繼續」,或這些詞的否定形式,或其他類似的術語或表達,涉及Aehr的預期、策略、優先事項、計劃或意圖。本新聞稿中的前瞻性聲明包括但不限於,Aehr的新客戶和現有客戶的未來需求和訂單;Aehr未來接收訂單和產生營業收入的能力,以及Aehr對影響上述因素的看法,包括此處提到的市場的增長;Aehr有效整合Incal的能力;收購的時間和程度;收購的完成;以及此處提到的市場的增長。本新聞稿中包含的前瞻性聲明還受其他風險和不確定性的影響,包括在Aehr最近的10-K、10-Q表格和其他不時向證券交易委員會提交的報告中更全面描述的風險。Aehr不承擔更新任何前瞻性聲明中所含信息的義務,以反映在本新聞稿日期之後發生的事件或情況。

Contacts:
Aehr Test Systems
Vernon Rogers
EVP Sales and Marketing
(510) 623-9400 x215
vrogers@aehr.com
MKR Investor Relations Inc.
Todd Kehrli or Jim Byers
Analyst/Investor Contact
(323) 468-2300
aehr@mkr-group.com
聯繫方式:
www.aehr.com
弗農·羅傑斯
銷售和市場副總裁
(510) 623-9400 x215
vrogers@aehr.com
MKR投資者關係公司。
託德·凱爾利或吉姆·拜爾斯。
分析師/投資者聯繫方式
(323) 468-2300
aehr@mkr-group.com

譯文內容由第三人軟體翻譯。


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