Nano Dimension's Additive Electronics Product Line - Essemtec - Received a Global Technology Award
Nano Dimension's Additive Electronics Product Line - Essemtec - Received a Global Technology Award
The Tarantula Underfill System Recognized at SMTA International 2024 Show in Chicago
Tarantula 下填系統在2024年芝加哥SMTA國際展會中獲獎
Waltham, Mass., Dec. 11, 2024 (GLOBE NEWSWIRE) -- Nano Dimension Ltd. (Nasdaq: NNDM) ("Nano Dimension" or the "Company"), a leading supplier of Additively Manufactured Electronics ("AME") and multi-dimensional polymer, metal & ceramic Additive Manufacturing ("AM") 3D printing solutions, today announced that its Tarantula Underfill system from its Essemtec product lines received the Global Technology Award for Innovation at the SMTA International 2024 Show (the "SMTA Show") in Chicago, Illinois.
馬薩諸塞州沃爾瑟姆,2024年12月11日(環球新聞)-- Nano Dimension Ltd.(納斯達克:NNDM)("Nano Dimension"或"公司"),一家領先的增材製造電子("AME")和多維聚合物、金屬和陶瓷增材製造("AM")3D打印解決方案供應商,今天宣佈其Essemtec產品線中的Tarantula下填系統在伊利諾伊州芝加哥的SMTA國際2024展會("SMTA展會")上獲得了全球技術創新獎。
Essemtec's Tarantula Underfill system is critical in the additive electronics value chain for assembly of complex devices. It involves dispensing an epoxy-based composite along the edge of a chip, which fills the gap between the chip and the substrate, or printed circuit boards, through capillary action.
Essemtec的Tarantula下填系統在增材電子價值鏈中對複雜設備的組裝至關重要。它涉及在芯片邊緣施加一種基於環氧樹脂的複合材料,通過毛細行動填充芯片與基板或印刷電路板之間的間隙。
This innovation enhances mechanical strength by reducing stresses caused by thermal expansion and vibration, while also improving durability, reliability, thermal cycling, and moisture ingress. This process is critical and in growing demand for industries like aerospace, defense, and heavy-duty sectors, where electronics must withstand harsh conditions and require high durability and robust performance.
這一創新通過減少熱膨脹和振動造成的應力,提高機械強度,同時改善耐用性、可靠性、熱循環和防潮能力。這一過程至關重要,並在航空航天、軍工股和重型部門等行業中日益受到需求,電子設備必須能夠承受惡劣條件並要求高耐用性和強健性能。
The heart of Tarantula Underfill's innovation is in its non-contact heating solution that enables the underfill process on two-side populated printed circuit boards ("PCBs") and its precise dispensing control of medium.
Tarantula Underfill創新的核心在於其非接觸式加熱解決方案,使得在雙面組裝的印刷電路板("PCBs")上進行填充處理成爲可能,並能夠精確控制中等的分配。
Olivier Carnal, General Manager for Additive Electronics, shared, "We are proud to be recognized by the SMTA Show for our innovation. Our Tarantula Underfill product is unique yet flexible. In addition to its primary function as an underfill solution, the Tarantula Underfill offers the full range of Essemtec dispensing machine operations. With five different valve options - time-pressure, volume dispensing, micro screw, solder paste jetting, and glue jetting - it allows us to develop customized solutions to meet almost any customer need."
增材電子的總經理Olivier Carnal分享道:"我們爲在SMTA展會上獲得創新獎而感到自豪。我們的Tarantula Underfill產品獨特而靈活。除了作爲填充解決方案的主要功能外,Tarantula Underfill還提供Essemtec分配機操作的全方位功能。憑藉五種不同的閥門選項——定時-壓力、成交量分配、微型螺絲焊膏噴射和膠水噴射——它使我們能夠開發定製化的解決方案,以滿足幾乎所有客戶的需求。"
Yoav Stern, Nano Dimension's Chief Executive Officer, added, "I am extremely pleased to be able to announce that we have yet again launched another innovative product, which was designed and produced by our Nano Dimension team in Switzerland. This innovation uniquely meets our customers' needs. Our ability to deliver this technology for production for large printed circuit boards will allow us to address a wide range of industries immediately."
Nano Dimension首席執行官Yoav Stern補充道:"我非常高興宣佈,我們又推出了一款創新產品,該產品由我們位於瑞士的Nano Dimension團隊設計和生產。這項創新獨特地滿足了客戶的需求。我們能夠爲大型印刷電路板提供此技術的生產將使我們能夠立即覆蓋廣泛的行業。"
About Nano Dimension
關於Nano Dimension
Nano Dimension's (Nasdaq: NNDM) vision is to transform existing electronics and mechanical manufacturing into Industry 4.0 environmentally friendly & economically efficient precision additive electronics and manufacturing – by delivering solutions that convert digital designs to electronic or mechanical devices - on demand, anytime, anywhere.
Nano Dimension(納斯達克:NNDM)的願景是將現有的電子和機械製造轉變爲環保母基和經濟高效的精準增材電子和製造業——通過提供解決方案,將數字設計轉化爲電子或機械設備——按需,隨時隨地。
Nano Dimension's strategy is driven by the application of deep learning-based AI to drive improvements in manufacturing capabilities by using self-learning & self-improving systems, along with the management of a distributed manufacturing network via the cloud.
Nano Dimension的策略推動了基於深度學習的人工智能的應用,以通過使用自學習和自我改進的系統來推動製造能力的改善,同時通過雲管理分佈式製造網絡。
Nano Dimension has served over 2,000 customers across vertical target markets such as aerospace and defense, advanced automotive, high-tech industrial, specialty medical technology, R&D, and academia. The Company designs and makes Additive Electronics and AM 3D printing machines and consumable materials. Additive Electronics are manufacturing machines that enable the design and development of High-Performance-Electronic-Devices (Hi-PEDs). AM includes manufacturing solutions for the production of metal, ceramic, and specialty polymers-based applications - from millimeters to several centimeters in size with micron precision.
Nano Dimension已爲超過2000個客戶提供服務,涵蓋航空航天與國防、高級汽車、高科技工業、專業醫療技術、研發和學術等垂直目標市場。該公司設計並製造增材電子和增材3D打印機及耗材。增材電子是能夠設計和開發高性能電子設備(Hi-PEDs)的製造機器。增材包括用於生產金屬、陶瓷和特種聚合物基礎應用的製造解決方案——從毫米到幾厘米大小,具備微米級精度。
Through the integration of its portfolio of products, Nano Dimension is offering the advantages of rapid prototyping, high-mix-low-volume production, IP security, minimal environmental footprint, and design-for-manufacturing capabilities, which are all unleashed with the limitless possibilities of AM.
通過整合其產品組合,Nano Dimension提供了快速原型、高混合低產量生產、知識產權安全、最小環境足跡和製造設計能力的優勢,所有這些都與增材的無限可能性相結合。
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Forward Looking Statements
前瞻性聲明
This press release contains forward-looking statements within the meaning of the "safe harbor" provisions of the Private Securities Litigation Reform Act of 1995 and other Federal securities laws. Words such as "expects," "anticipates," "intends," "plans," "believes," "seeks," "estimates" and similar expressions or variations of such words are intended to identify forward-looking statements. For example, Nano is using forward-looking statements in this press release when it discusses the potential benefits and advantages of Tarantula Underfill, market demand and the potential to customize solutions, and all other statements other than statements of historical fact that address activities, events or developments that Nano intends, expects, projects, believes or anticipates will or may occur in the future. Such statements are based on management's beliefs and assumptions made based on information currently available to management. Because such statements deal with future events and are based on Nano Dimension's current expectations, they are subject to various risks and uncertainties, and actual results, performance or achievements of Nano Dimension could differ materially from those described in or implied by the statements in this press release. The forward-looking statements contained or implied in this press release are subject to other risks and uncertainties, including those discussed under the heading "Risk Factors" in Nano Dimension's Annual Report on Form 20-F filed with the Securities and Exchange Commission ("SEC") on March 21, 2024, and in any subsequent filings with the SEC. Except as otherwise required by law, Nano Dimension undertakes no obligation to publicly release any revisions to these forward-looking statements to reflect events or circumstances after the date hereof or to reflect the occurrence of unanticipated events. References and links to websites have been provided as a convenience, and the information contained on such websites is not incorporated by reference into this communication. Nano Dimension is not responsible for the contents of third-party websites.
本新聞稿包含根據1995年私人證券訴訟改革法案和其他聯邦證券法的「安全港」條款的前瞻性陳述。"期望"、"預期"、"打算"、"計劃"、"相信"、"尋求"、"估計"及類似表達或這些詞的變體意在識別前瞻性陳述。例如,當Nano討論Tarantula Underfill的潛在利益和優勢、市場需求及定製解決方案的潛力,以及所有其他除歷史事實陳述之外的陳述時,均使用了前瞻性陳述。前瞻性陳述涉及Nano打算、期望、預測、相信或預期在未來發生的活動、事件或發展。這些陳述基於管理層的信念和根據當前可得信息作出的假設。由於這些陳述涉及未來事件,並基於Nano Dimension當前的期望,因此受多種風險和不確定性的影響,Nano Dimension的實際結果、業績或成就可能與本新聞稿中描述或暗示的情況大相徑庭。本新聞稿中包含或暗示的前瞻性陳述還受其他風險和不確定性的影響,包括在Nano Dimension向證券交易委員會("SEC")提交的2024年3月21日的20-F表格年報《風險因素》章節中討論的風險,以及在隨後的任何提交文件中。除非法律另有要求,Nano Dimension不承擔向公衆發佈任何這些前瞻性陳述的修正以反映此日期後的事件或情況,或反映無法預見事件發生的義務。提供網址的引用和鏈接僅作爲便利,包含在這些網站上的信息並未被併入此通信中。Nano Dimension不對第三方網站的內容負責。
NANO DIMENSION INVESTOR RELATIONS CONTACT
Investor Relations | ir@nano-di.com
納米維度投資者關係聯繫方式
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