"In Order To Meet The Substantial Demand For AI Servers In 2025, TSMC Will More Than Double Its Production Capacity For CoWoS Packaging. Nvidia Will Consume Up To 60% Of The Capacity, While AMD And ASIC Developers Are Catching Up, According To...
"In Order To Meet The Substantial Demand For AI Servers In 2025, TSMC Will More Than Double Its Production Capacity For CoWoS Packaging. Nvidia Will Consume Up To 60% Of The Capacity, While AMD And ASIC Developers Are Catching Up, According To...
“爲了迎合2025年對人工智能服務器的巨大需求，台積電將把CoWoS封裝的生產能力翻倍以上。根據... 英偉達將消耗多達60%的產能，而AMD和ASIC開發者正在趕超。
"In Order To Meet The Substantial Demand For AI Servers In 2025, TSMC Will More Than Double Its Production Capacity For CoWoS Packaging. Nvidia Will Consume Up To 60% Of The Capacity, While AMD And ASIC Developers Are Catching Up, According To Industry Sources" - DigiTimes Alert
"爲了滿足2025年對人工智能服務器的巨大需求，台積電將把CoWoS封裝的生產能力增加一倍以上。英偉達將消耗多達60%的產能，而AMD和ASIC開發者也在迎頭趕上，依據行業來源" - DigiTimes警報
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