L&P Expands Leadership With Lee Soon Swee's Appointment
L&P Expands Leadership With Lee Soon Swee's Appointment
Lee holds a Bachelor of Science in Aerospace Engineering and a Master of Science in Mechanical Engineering from Wichita State University, USA.
L&P Global Bhd, a provider of integrated industrial packaging solutions, has appointed Lee Soon Swee as its Executive Director, effective Nov 13 2024.
綜合工業包裝解決方案供應商L&P Global Bhd已任命李順瑞爲執行董事，自2024年11月13日起生效。
With over 30 years of experience in engineering, Lee has specialised in applied science and R&D across the aerospace, semiconductor, and life science industries. He has held key roles with organisations such as the National Institute of Aviation Research (USA), MEMC Electronic Materials Inc (USA), and Pall Corporation in Malaysia and Singapore.
Lee 擁有 30 多年的工程經驗，專門從事航空航天、半導體和生命科學行業的應用科學和研發。他曾在國家航空研究所（美國）、MEMC電子材料公司（美國）以及馬來西亞和新加坡的Pall公司等組織擔任過關鍵職務。
Executive Director and CEO of L&P Ooi Lay Pheng expressed confidence in Lee's appointment, stating, "With Lee's proven track record in R&D and material science, we are well-positioned to explore innovative packaging solutions and expand into new market segments." She added that his leadership would help optimise operations and support L&P's sustainable long-term growth.
L&P 執行董事兼首席執行官 Ooi Lay Pheng 對李的任命表示了信心，他說：「憑藉李在研發和材料科學領域的良好往績，我們完全有能力探索創新包裝解決方案並擴展到新的細分市場。」她補充說，他的領導將有助於優化運營並支持L＆P的可持續長期增長。
Lee holds a Bachelor of Science in Aerospace Engineering and a Master of Science in Mechanical Engineering from Wichita State University, USA.
Lee 擁有美國威奇托州立大學的航空航天工程理學學士學位和機械工程理學碩士學位。
譯文內容由第三人軟體翻譯。
