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ACM Research Announced A Major Performance Breakthrough For Its Flagship Ultra C Tahoe Cleaning Tool, To Meet Technical Requirements Of Advanced Nodes For Foundry, Logic And Memory Applications For Front-end Semiconductor Manufacturing

ACM Research Announced A Major Performance Breakthrough For Its Flagship Ultra C Tahoe Cleaning Tool, To Meet Technical Requirements Of Advanced Nodes For Foundry, Logic And Memory Applications For Front-end Semiconductor Manufacturing

ACm Research宣佈其旗艦Ultra C Tahoe清潔工具取得重大性能突破,以滿足半導體前端製造環節對於晶圓廠、邏輯和存儲應用的高級節點的技術要求
Benzinga ·  11/07 18:02

The Ultra C Tahoe now achieves the performance of standalone single-wafer cleaning tools on low-to-medium temperature sulfuric peroxide mix (SPM) processes. Tahoe's patented hybrid architecture is among the first in the industry to combine batch wafer processing and single wafer cleaning chambers into the same SPM tool. The hybrid architecture delivers enhanced cleaning performance, high throughput, and process flexibility, with up to 75% reduction in chemical consumption. ACM estimates cost savings of up to $500,000 per year from sulfuric acid alone, with additional environmental and cost benefits from reduced sulfuric acid treatment and disposal.

Ultra C Tahoe現在在低至中溫硫酸過氧化氫混合物(SPM)工藝上實現了獨立單晶圓清洗工具的性能。Tahoe的專利混合架構是行業中首批將批處理晶圓加工和單片清洗室結合到同一個SPm工具中的架構。混合架構提供了增強的清潔性能、高送轉和工藝靈活性,化學消耗可減少高達75%。ACm估計僅從硫酸中每年可節省高達50萬美元,同時還可從減少硫酸處理和處置中獲得額外的環保和成本優勢。

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