Amkor Technology, TSMC Sign MoU To Collaborate And Bring Advanced Packaging And Test Capabilities To Arizona
Amkor Technology, TSMC Sign MoU To Collaborate And Bring Advanced Packaging And Test Capabilities To Arizona
艾馬克技術與台積電簽署諒解備忘錄，合作將先進封裝和測試能力引入亞利桑那州。
Under the agreement, TSMC will contract turnkey advanced packaging and test services from Amkor in their planned facility in Peoria, Arizona.
根據協議，TSMC將從亞光公司在其計劃中的亞利桑那州皮奧里亞設施承包一攬子先進封裝和測試服務。
TSMC will leverage these services to support its customers, particularly those using TSMC's advanced wafer fabrication facilities in Phoenix.
TSMC將利用這些服務來支持其客戶，特別是那些使用TSMC在鳳凰城的先進硅片製造設施的客戶。
The close collaboration and proximity of TSMC's front-end fab and Amkor's back-end facility will accelerate overall product cycle times.
TSMC前端晶圓廠和亞光後端設施的緊密協作和接近將加快整體產品週期時間。
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