share_log

Earnings Call Summary | Kulicke & Soffa Industries(KLIC.US) Q3 2024 Earnings Conference

Earnings Call Summary | Kulicke & Soffa Industries(KLIC.US) Q3 2024 Earnings Conference

業績會總結 | 庫利克與索法工業(KLIC.US)2024年Q3業績會
富途資訊 ·  08/08 11:46  · 電話會議

The following is a summary of the Kulicke and Soffa Industries, Inc. (KLIC) Q3 2024 Earnings Call Transcript:

以下是歷嘉科技(Kulicke and Soffa Industries, Inc.)2024Q3業績發佈會的摘要:

Financial Performance:

金融業績:

  • Kulicke and Soffa Industries generated $181.7 million in revenue during Q3 2024.

  • Gross margin stood at 46.6%, influenced by product and customer mix.

  • Non-GAAP EPS exceeded expectations, although specific figures were not disclosed.

  • The company anticipates Q4 revenue to be approximately $180 million with a gross margin of 47%.

  • For Q4, projected GAAP EPS is $0.22 per share and non-GAAP EPS is $0.35 per share.

  • 2024Q3歷嘉科技實現了1.817億美元的營業收入。

  • 毛利率達到46.6%,受產品和客戶組合的影響。

  • 儘管沒有披露具體數字,但Non-GAAP每股收益超出預期。

  • 公司預計2024Q4營收約爲1.8億美元,毛利率爲47%。

  • 2024Q4預計GAAP每股收益爲0.22美元,Non-GAAP每股收益爲0.35美元。

Business Progress:

業務進展:

  • Strategic advancements in thermocompression and fluxless bonding technologies, including successful deployment in diverse semiconductor fabrication processes.

  • Key victories in thermocompression bonding within the past four years reflected a 10x business growth.

  • Continued dominance in ball bonding with improvements, and capitalizing on robust demand in power semiconductor assembly for automotive and industrial applications.

  • 熱壓焊和無焊點連接技術的戰略性進展,成功應用於不同的半導體制造流程中。

  • 在過去四年內,熱壓焊連接的重要進展體現了10倍的業務增長。

  • 在提高球焊連接技術上仍然佔據主導地位,並利用汽車和工業應用中強勁的需求實現了增長。

Opportunities:

機會:

  • Strong positioning in new markets such as AI, HPC, and mobility, traditionally not part of Kulicke and Soffa's core market.

  • Advanced packaging technologies and low-barrier, cost-effective solutions for mass-market chiplet adoption show substantial growth prospects.

  • Expected industry-wide semiconductor revenue growth of 17% through calendar year 2025, promises enhanced demand for the company's high-volume solutions.

  • 在人工智能,高性能計算和移動性等新市場上具有強大的地位,這些市場通常不屬於歷嘉科技的核心市場。

  • 固體芯片封裝技術和低阻,成本效益高的解決方案,爲大衆芯片採用提供了可觀的增長前景。

  • 預計行業範圍內的半導體收入增長將在2025年的日曆年度內達到17%,這將增強對該公司高量級方案的需求。

Risks:

風險:

  • Economic fluctuations may influence overall utilization rates which though improving, must maintain consistent above-average percentages to ensure sustained recovery and growth, particularly past the 75% utilization rate needed to drive high-volume customer demands.

  • 經濟波動可能會影響整體利用率,儘管有所改善,也必須保持持續的高於平均水平的百分比,以確保持續恢復和增長,特別是過去需要推動高量級客戶需求的75%利用率。

More details: Kulicke & Soffa Industries IR

更多詳情請參見歷嘉科技公司IR頁面。

Tips: For more comprehensive details, please refer to the IR website. The article is only for investors' reference without any guidance or recommendation suggestions.

提示:如需更全面的詳情,請參閱投資人關係網站。本文僅供投資者參考,不作任何指引或建議。

譯文內容由第三人軟體翻譯。


以上內容僅用作資訊或教育之目的,不構成與富途相關的任何投資建議。富途竭力但無法保證上述全部內容的真實性、準確性和原創性。
    搶先評論