Atomera Enables Breakthrough RF Substrates for 5G Advanced and 6G Products
Atomera Enables Breakthrough RF Substrates for 5G Advanced and 6G Products
Ultra-Thin MST-Enabled RF-SOI Substrates Critical for High-Performance RF Switches, Low-Noise Amplifiers, and More
超薄MST啓用 RF-SOI 基板是高性能RF開關、低噪聲放大器等物品的關鍵。
LOS GATOS, CA / ACCESSWIRE / July 2, 2024 / Atomera Incorporated (NASDAQ:ATOM), a semiconductor materials and technology licensing company, today announced the availability of an MST solution to dramatically enhance performance of RFSOI wafer substrates for leading-edge cellular communication products. The company will demonstrate the effectiveness of this solution on experimental 300mm RF-SOI wafers with an ultra-thin active layer utilizing a new formulation of Atomera's MST technology. For many years, it has been understood that thinner RF-SOI substrates would enable higher performance, but trade-offs between speed and power handling made implementation impractical until this solution was introduced by Atomera. These wafers, paired with MST should enable higher-performance antenna switches, higher-fidelity low-noise amplifiers (LNAs), and other enhanced RF components for 5G Advanced and 6G applications. The company is working with multiple RF IC product manufacturers to evaluate and demonstrate the wide range of benefits of this MST-enabled technology solution.
洛斯加託斯，加利福尼亞/ACCESSWIRE/2024年7月2日/納斯達克: 愛文思控股(ATOM)推出MST解決方案，以極大地增強5G主流通訊產品中的RFSOI晶片基板性能。該公司將在實驗室內300mm射頻-SOI晶片基板上展示這種新的措施的有效性，使用了全新配方的Atomera MST技術的超薄活性層。多年來，人們一直認爲更薄的射頻-SOI晶片基板能夠帶來更高的性能，但是速度和功率處理之間的權衡使得實施變得不切實際，直到愛文思控股推出了這個解決方案。這些配有MST技術的晶片基板應該能夠帶來更高性能的天線開關，更高保真度的低噪聲放大器(LNA)，以及其他增強型的5g概念和6g應用的射頻元件。該公司正在與多個射頻IC產品製造商合作，以評估和展示MST技術解決方案的廣泛效益。
"RF-SOI wafers originally developed by Soitec have become instrumental in the design and manufacture of high-quality cellular RF products," said Pierre Cemeli, GM Connect SOI BU at Soitec. "We are pleased to supply our advanced experimental products for Atomera to combine with their own technology, with the ambition to progress the state of the art."
“Soitec最初開發的射頻-SOI晶片基板在高質量的蜂窩射頻產品的設計和製造中發揮了重要作用，”Soitec GM Connect SOI BU Pierre Cemeli說。 “我們很高興爲Atomera提供我們的先進實驗產品，以與其自己的技術相結合，有望推動現代化水平。”
RF-SOI substrates have become the standard platform for many RF devices, particularly front-end modules (FEMs) and are used in 100% of 5G smartphones today. RF-SOI substrates offer significantly better linearity and lower noise than conventional silicon substrates, and they are fully compatible with existing CMOS process flows. RF-SOI products and manufacturing processes are widely available from numerous IC suppliers and foundries.
射頻-SOI基板已成爲許多射頻設備的標準平台，特別是前端模塊(FEM)，現在100%的5G智能手機中都使用。與傳統的硅襯底相比，射頻-SOI基板提供了顯着更好的線性度和更低的噪聲，並且它們與現有的CMOS工藝流程完全兼容。衆多IC供應商和晶圓廠都廣泛提供射頻-SOI產品和製造流程。
"We have worked for several years to optimize RF-SOI application performance with MST," said Scott Bibaud, CEO of Atomera. "Our current results are showing improvements in the critical RF switch characteristics of Ron∙Coff figure-of-merit, power handling capability, and leakage. We look forward to leveraging the experimental ultra-thin RFSOI substrates from Soitec to advance the capabilities of cellular RF and enable the next generation of mobile communications."
“我們已經多年來與MST一起優化射頻-SOI應用性能，”Atomera首席執行官Scott Bibaud說。 “目前的測試結果展示了R、C關鍵射頻開關特徵、功率處理能力和泄漏方面的改善。我們期待利用Soitec的實驗性超薄RFSOI基板推動蜂窩射頻的能力，並啓用下一代移動通信。”聲明∙C關德表現指標、功率處理能力和泄漏。我們期待利用Soitec的實驗性超薄RFSOI基板推動蜂窩射頻的能力，並啓用下一代移動通信。”
Atomera will both contribute to the development of these advanced substrates, and will work with the entire RF ecosystem including IDMs and foundry manufacturers as well as fabless RF IC companies. Atomera will epitaxially deposit its RF-optimized MST film recipe on Soitec's ultra-thin 300mm RF-SOI substrates and ship them to development partners for fabrication. Atomera is working with select RF-SOI chip designers and foundries by providing its MSTcad software so they can optimize their switches and other circuit devices to take full advantage of these substrates.
愛文思控股將同時爲這些先進的基板開發做出貢獻，並與整個射頻生態系統以及IDMs和晶圓廠製造商以及無晶圓廠射頻IC公司合作。愛文思控股將在Soitec的超薄300mm射頻-SOI基板上外延堆積其射頻優化的MST膜處方，並將其運送到開發合作伙伴進行製造。研發人員使用愛文思控股的MSTcad軟件與其合作，以充分利用這些射頻基板來優化開關和其他電路器件。
Advanced RF-SOI substrates are available for evaluation today by contacting Atomera.
可以通過聯繫愛文思控股進行評估射頻-SOI基板。
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Atomera Incorporated, one of America's Top 100 Best Small Companies in 2022, ranked by Forbes, is a semiconductor materials and technology licensing company focused on deploying its proprietary, silicon-proven technology into the semiconductor industry. Atomera has developed Mears Silicon Technology (MST), which increases performance and power efficiency in semiconductor transistors. MST can be implemented using equipment already deployed in semiconductor manufacturing facilities and is complementary to other nano-scaling technologies in the semiconductor industry roadmap. More information can be found at
被《福布斯》評爲2022美國前100家最佳小企業之一的愛文思控股是一家半導體材料和技術許可公司，專注於在半導體行業中部署其專有的硅材料技術，以提高半導體晶體管的性能和功率效率。MST技術可使用已經部署在半導體制造設備中的設備實施，並與半導體工業路線圖中的其他納米尺度技術相輔相成。更多信息請訪問:
Media Contacts:
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The Hoffman Agency
(925) 719-1097
jgillespie@hoffman.com
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賈斯汀吉列斯皮
霍夫曼代理公司
(925) 719-1097
jgillespie@hoffman.com
Investor Contact:
Bishop IR
Mike Bishop
(415) 894-9633
investor@atomera.com
投資者聯繫人：
Bishop IR
Mike Bishop
(415)894-9633
investor@atomera.com
SOURCE: Atomera, Inc
來源：Atomera，Inc
譯文內容由第三人軟體翻譯。