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Explore the Power of Connectivity With STMicroelectronics at MWC Shanghai 2024

Explore the Power of Connectivity With STMicroelectronics at MWC Shanghai 2024

2024年,在MWC上探索意法半導體的連接力量
意法半導體 ·  06/25 12:00

STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, will exhibit at MWC Shanghai 2024 (Booth N1.D85) on 26-28 June.

爲各種電子應用客戶提供服務的全球半導體領導者意法半導體(紐約證券交易所代碼:STM)將參展 2024 年上海世界移動通信大會 (展位 N1.D85)將於 6 月 26 日至 28 日舉行。

ST is at the forefront of innovation, developing unique technologies and products that empower our customers to overcome challenges and capitalize on opportunities. At MWC Shanghai 2024, ST will collaborate with its ecosystem partners to present industry-leading solutions. Visitors will be immersed in the transformative power of connectivity with over 30 demonstrations, all designed to showcase our commitment to technological excellence and especially the future of connected experiences. These will be featured across 9 major application zones:

意法半導體處於創新的最前沿,開發獨特的技術和產品,使我們的客戶能夠克服挑戰並抓住機遇。在2024年上海世界移動大會上,意法半導體將與其生態系統合作伙伴合作,提供行業領先的解決方案。參觀者將通過30多場演示沉浸在連接的變革力量中,所有這些演示都旨在展示我們對卓越技術,尤其是互聯體驗未來的承諾。這些將涵蓋9個主要應用區域:

· Smart Charging
· Secure & Connectivity
· IMU Attitude Detection
· Smart Personal Electronics
· Time-of-Flight & Smart Cameras
· Air Quality Monitoring based on FlightSense
· Bluetooth Connectivity & Low Power MCU
· Edge AI & GUI
· ST60 mmW Contactless Connector

· 智能充電
· 安全與連接
· IMU 姿態檢測
· 智能個人電子產品
· 飛行時間和智能相機
· 基於 FlightSense 的空氣質量監測
· 藍牙連接和低功耗微控制器
· 邊緣 AI 和 GUI
· ST60 mmW 非接觸式連接器

Secure & Connectivity: According to the International Telecommunication Union (ITU), a staggering 2.6 billion people are still unconnected, 1.4 billion of whom are unbanked, mainly in emerging countries. This disconnect not only excludes them from the digital revolution, but also hinders economic development. To enable a seamless "tap and go" experience, KaiOS has collaborated with STMicroelectronics to develop game-changing solutions designed for underserved transportation drivers. At MWC Shanghai, STMicroelectronics and KaiOS will showcase a solution designed for informal transportation drivers. Utilizing the ST54L chip, this innovative solution combines an NFC controller with an integrated secure element (SE) IC to transform a simple "KaiOS-equipped smart feature phone" into a powerful tool for informal drivers, enabling the KaiOS "smart feature phone" to provide secure contactless ticketing, replacing cash transactions with contactless ones.

安全與連接:根據國際電信聯盟(ITU)的數據,仍有驚人的26億人未上網,其中14億人沒有銀行帳户,主要集中在新興國家。這種脫節不僅將他們排除在數字革命之外,還阻礙了經濟發展。爲了實現無縫的 “輕觸即走” 體驗,KaiOS與意法半導體合作開發了專爲服務不足的交通司機設計的改變遊戲規則的解決方案。在上海世界移動大會上,意法半導體和KaiOS將展示專爲非正規交通司機設計的解決方案。該創新解決方案利用 ST54L 芯片,將 NFC 控制器和集成的安全元件 (SE) IC 相結合,將簡單的 “配備 KaioS 的智能功能手機” 轉變爲非正規駕駛員的強大工具,使 KaiOS “智能功能手機” 能夠提供安全的非接觸式票務,用非接觸式現金交易取代現金交易。

Air Quality Monitoring based on FlightSense: Measuring air quality has become crucial due to its direct impact on human health and the environment. A growing body of scientific evidence indicates that the air within homes and other buildings can be more seriously polluted than outdoor air. Most existing AQI stations are designed for outdoor and professional use; however, environmental analysis is now possible in consumer devices. At MWC Shanghai, visitors will have the exclusive opportunity to see the innovative personal mobile environmental monitor in action. ST and Mobile Physics will present a solution for air quality and smoke detection with ST's VL53L8 direct Time-of-Flight sensor. The comprehensive system includes the VL53L8 hardware, along with tailored firmware and software, plus pioneering air quality algorithms developed by Mobile Physics. The VL53L8 is capable of measuring PM2.5 concentrations within 10% or 10μg/m3 of the reference sensor. Designed for seamless integration, this system is ideal for mobile phones, personal electronics, and a wide array of IoT products.

基於FlightSense的空氣質量監測:由於其對人類健康和環境的直接影響,測量空氣質量已變得至關重要。越來越多的科學證據表明,房屋和其他建築物內的空氣可能比室外空氣受到更嚴重的污染。大多數現有的空氣質量監測站都是爲戶外和專業用途而設計的;但是,現在可以在消費類設備中進行環境分析。在上海世界移動大會上,參觀者將有獨一無二的機會看到創新的個人移動環境監測器的實際運行情況。意法半導體和Mobile Physics將使用意法半導體的 VL53L8 直接飛行時間傳感器提供空氣質量和煙霧探測解決方案。綜合系統包括 VL53L8 硬件、量身定製的固件和軟件,以及由 Mobile Physics 開發的開創性空氣質量算法。VL53L8 能夠測量距離參考傳感器的 10% 或 10μg/m3 以內的 PM2.5 濃度。該系統專爲無縫集成而設計,非常適合手機、個人電子產品和各種物聯網產品。

Bluetooth Connectivity & Low Power MCU: ST will demonstrate two Bluetooth LE Audio solutions based on the recently announced STM32WBA55 microcontroller. Visitors are invited to put on headphones to personally experience the listening effects in unicast and broadcast scenarios. Harnessing the cutting-edge wireless STM32WBA5 series, ST has now integrated support for the newly finalized Bluetooth LE Audio specifications, achieving certification that unlocks the potential for groundbreaking products. These innovations promise to enrich audio experiences with superior listening, hearing, and sharing capabilities. Among these, the innovative Bluetooth LE Audio Auracast feature stands out, offering a transformative approach to audio broadcasting and sharing, and heralding a new era of auditory communication.

藍牙連接和低功耗微控制器:意法半導體將演示基於最近發佈的 STM32WBA55 微控制器的兩款低功耗藍牙音頻解決方案。邀請參觀者戴上耳機,親自體驗單播和廣播場景中的聆聽效果。藉助尖端的無線 STM32WBA5 系列,意法半導體現已整合了對最新定稿的藍牙 LE Audio 規範的支持,從而獲得認證,釋放了開發突破性產品的潛力。這些創新有望通過卓越的聆聽、聽力和共享功能豐富音頻體驗。其中,創新的藍牙 LE Audio Auracast 功能脫穎而出,爲音頻廣播和共享提供了一種變革性的方法,預示着聽覺通信的新時代。

To display its expansive portfolio of solutions across different sectors at MWC Shanghai, ST will also showcase its advanced wireless-charging and wireless power-transfer solutions. Highlights include the high-efficiency, compact 100W laptop wireless charger, boasting WPC Qi 1.3 compliance with a security profile, capable of supporting up to a 100W output using ST's proprietary protocol (STSC). Additionally, ST offers an up to 300W wireless power transfer discrete solution designed for industrial applications with fast load transient response, wider spatial freedom, better thermal dissipation, and a user experience comparable to that of a wired power supply.

爲了在上海世界移動通信大會上展示其涵蓋不同領域的廣泛解決方案組合,意法半導體還將展示其先進的無線充電和無線能量傳輸解決方案。亮點包括高效、緊湊的100W筆記本電腦無線充電器,該充電器符合WPC Qi 1.3的安全規範,能夠使用意法半導體的專有協議 (STSC) 支持高達100瓦的輸出。此外,意法半導體還提供高達300W的無線功率傳輸分立式解決方案,專爲工業應用而設計,具有快速的負載瞬態響應、更寬的空間自由度、更好的散熱性能以及與有線電源相當的用戶體驗。

ST is proud to present the ST4SIM-300, its first eSIM compliant with the GSMA's eSIM specification for IoT. The ST4SIM-300 unlocks new possibilities, including over-the-air profile swaps, and is supported by a streamlined ecosystem. This design is well-suited for compact devices without a user interface. By integrating the ST4SIM-300 into their designs, IoT developers can now ensure the best connectivity anywhere, at any time.

意法半導體榮幸地推出 ST4SIM-300,這是其首款符合GSMA物聯網eSIM規範的eSIM。ST4SIM-300 開啓了新的可能性,包括無線配置文件交換,並由簡化的生態系統提供支持。這種設計非常適合沒有用戶界面的緊湊型設備。通過將 ST4SIM-300 集成到他們的設計中,物聯網開發人員現在可以隨時隨地確保最佳連接。

At MWC Shanghai, ST will also showcase a solution that propels consumer products into the realm of high-end applications. With 6-axis architecture, the LSM6DSV32X Inertial Measurement Unit (IMU) is capable of superior edge processing, making it ideal for applications such as advanced 3D mapping on phones, contextual awareness in laptops and tablets, precise gesture recognition in AR and VR headsets, and always-on tracking in wearables.

在上海世界移動通信大會上,意法半導體還將展示推動消費品進入高端應用領域的解決方案。LSM6DSV32X 慣性測量單元 (IMU) 採用 6 軸架構,能夠進行卓越的邊緣處理,使其成爲諸如手機上的高級 3D 測繪、筆記本電腦和平板電腦中的情境感知、AR 和 VR 頭戴式耳機中的精確手勢識別以及可穿戴設備中的不間斷跟蹤等應用的理想之選。

Learn more about ST at MWC Shanghai 2024 and explore the power of connectivity together with us: https://www.st.com/content/st_com/en/events/mwc-shanghai-2024.html

在2024年上海世界移動大會上了解有關意法半導體的更多信息,並與我們一起探索互聯的力量: https://www.st.com/content/st_com/en/events/mwc-shanghai-2024.html

About STMicroelectronics

關於意法半導體

At ST, we are over 50,000 creators and makers of semiconductor technologies mastering the semiconductor supply chain with state-of-the-art manufacturing facilities. An integrated device manufacturer, we work with more than 200,000 customers and thousands of partners to design and build products, solutions, and ecosystems that address their challenges and opportunities, and the need to support a more sustainable world. Our technologies enable smarter mobility, more efficient power and energy management, and the wide-scale deployment of cloud-connected autonomous things. We are committed to achieving our goal to become carbon neutral on scope 1 and 2 and partially scope 3 by 2027. Further information can be found at www.st.com.

在意法半導體,我們有超過50,000名半導體技術的創造者和製造商,通過最先進的製造設施掌握半導體供應鏈。作爲集成設備製造商,我們與超過20萬名客戶和數千名合作伙伴合作,設計和構建產品、解決方案和生態系統,以應對他們的挑戰和機遇,以及支持更可持續世界的需求。我們的技術可實現更智能的出行方式、更高效的電力和能源管理,以及雲連接的自主設備的大規模部署。我們致力於實現我們的目標,即到2027年在範圍1和範圍2上實現碳中和,部分範圍3的碳中和。更多信息可以在以下網址找到 www.st.com

譯文內容由第三人軟體翻譯。


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