Cadence and Intel Foundry Collaborate on Systems Foundry Enablement for the AI Era
Cadence and Intel Foundry Collaborate on Systems Foundry Enablement for the AI Era
SAN JOSE, Calif.— Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced the achievement of several key milestones in its ongoing strategic partnership with Intel Foundry. Furthering the companies' collaboration on 3D-IC enablement, EDA flows and IP development across multiple Intel process nodes, beginning with Intel 18A Cadence announced the availability of a complete Embedded Multi-die Interconnect Bridge (EMIB) 2.5D advanced packaging flow, enhancements to the Intel 18A digital and custom/analog flows, a wide-ranging IP portfolio and the corresponding process design kits (PDKs) across various process nodes.
加州聖何塞——鏗騰電子公司（納斯達克股票代碼：CDNS）今日宣佈，在與英特爾工廠的戰略伙伴關係中取得了幾個關鍵里程碑。在3D-IC啓用、EDA流程和IP開發方面，兩家公司在多個英特爾工藝節點上繼續合作，首先是英特爾18A。鏗騰宣佈可提供完整的嵌入式多芯片互連橋接（EMIB）2.5D高級封裝流程，增強了英特爾18A數字和定製/模擬流程、廣泛的IP資產組合，以及相應的各種過程設計工具包（PDK）在不同的處理節點上。
Key milestones of the ongoing Cadence-Intel Foundry collaboration include:
鏗騰電子與英特爾工廠持續合作的關鍵里程碑包括：
- EMIB Reference Flow: The complete AI-driven Cadence flow, with Integrity 3D-IC Platform integrating Allegro X Advanced Package Designer (APD), Sigrity technologies, Clarity 3D Solver, Pegasus Verification System, and Virtuoso Studio, constitutes Intel's advanced packaging reference flow that leverages its EMIB technology and is optimized to work seamlessly with Intel 18A technology. The advanced EMIB 2.5D reference flow enables customers to successfully complete full-flow heterogeneous designs, seamlessly transitioning from system-level planning, physical optimization and analysis to DRC-aware implementation and physical signoff, with unmatched productivity and time to market.
- Digital Full-Flow for Intel 18A: The complete AI-driven Cadence RTL-to-GDS flow has been certified and optimized for Intel 18A technology featuring RibbonFET gate-all-around transistors and PowerVia backside power delivery, enabling customers to meet their challenging PPA targets. The full flow includes the AI-driven Cadence Cerebrus Intelligent Chip Explorer, Genus Synthesis Solution, InnovusImplementation System, QuantusExtraction Solution, Quantus Field Solver, Tempus Timing Solution, Pegasus Verification System, Liberate Characterization, and Voltus IC Power Integrity Solution.
- Custom/Analog Flow for Intel 18A: Cadence's AI-based Virtuoso Studio, Spectre Simulation Platform, Voltus-XFi Custom Power Integrity Solution and EMX Planar 3D Solver have all been certified for Intel 18A. Virtuoso Studio is integrated with the Innovus Implementation System, enabling a complete implementation methodology for mixed-signal designs. Virtuoso Studio supports the features required to complete complex analog/mixed signal designs such as automatic device and standard cell place-and-route (P&R), assisted device editing capabilities, integrated EM-IR checks, integrated signoff-quality parasitic extraction and integrated signoff-quality physical verification, delivering efficient design and layout implementation on the Intel 18A process.
- Design IP for Intel 18A: Cadence's leading-edge implementations of trailblazing standards for advanced high-performance computing (HPC) and artificial intelligence and machine learning (AI/ML) applications enable joint customers to achieve scalable, high-performance designs that accelerate time to market in Intel Foundry's most advanced silicon technologies and 3D-IC packaging capabilities. Cadence Design IP for Intel 18A technology includes the enterprise-class PCI Express (PCIe) 6.0 and Compute Express Link (CXL), multi-standard PHY for LPDDR5X/5 8533Mbps to enable a diverse set of memory applications, Universal Chiplet Interconnect Express (UCIe) to boost multi-die system in package integration and 112G extended long-reach SerDes for superior bit error rate (BER) performance.
- EMIB參考流程：完整的基於人工智能的鏗騰流程，與Integrity 3D-IC平台集成的Allegro X高級封裝設計師（APD），Sigrity技術，Clarity 3D求解器，Pegasus驗證系統，以及Virtuoso Studio，組成了英特爾高級封裝參考流程，利用其EMIB技術進行了優化，可無縫地與英特爾18A技術配合使用。高級EMIB 2.5D參考流程使客戶能夠成功完成全流程異構設計，從系統級規劃、物理優化和分析到DRC感知的實現和物理簽署，生產力和上市時間無與倫比。與 Integrity3D-IC平台集成Allegro X高級封裝設計師（APD） X愛文思控股封裝設計軟件Sigrity技術SigrityClarity 3D求解器, Pegasus驗證系統Virtuoso Studio, Pegasus驗證系統和Virtuoso Studio，構成英特爾先進封裝的參考流程
- 英特爾18A的數字全流程：完整的人工智能驅動的Cadence RTL-to-GDS流程已經通過認證並針對英特爾18A技術進行了優化，該技術採用了RibbonFET全環繞晶體管和PowerVia背面供電，從而使客戶能夠實現具有挑戰性的PPA目標。該完整的流程包括人工智能驅動的Cadence Cerebrus智能芯片探索器, Genus綜合解決方案, Innovus實施系統, Quantus提取方案，Quantus場求解器，Tempus定時方案，飛馬驗證系統，特性化，爲英特爾18A量身打造的定製/模擬流程：和VoltusIC功率完整性解決方案.
- Cadence基於人工智能的SpectreVirtuoso Studio, 仿真平台Voltus-XFi定製功率完整性方案, EMX Planar 3D 求解器和頁面。已全部通過18A認證。Virtuoso Studio已與Innovus實現系統集成，爲混合信號設計提供完整的實現方法論。Virtuoso Studio支持完成複雜的模擬/混合信號設計所需的功能，如自動器件和標準單元佈局佈線（P&R）、輔助器件編輯能力、集成的 EM-IR 檢查、集成的簽出質量寄生抽取和集成的簽出質量物理驗證，爲英特爾18A工藝的設計和佈局實現提供高效的支持。全部通過英特爾18A認證。Virtuoso Studio集成了Innovus實現系統，爲混合信號設計提供完整的實現方法。Virtuoso Studio支持完成複雜的模擬/混合信號設計所需的功能，例如自動器件和標準單元的佈局與佈線（P＆R）、輔助器件編輯能力、集成EM-IR檢查、集成簽署質量寄生抽取和集成簽署質量物理驗證，在Intel 18A過程中提供高效的設計和佈局實現。
- 用於英特爾18A的設計IP：Cadence針對先進的高性能計算（HPC）和人工智能（AI）和機器學習（ML）應用的創新標準的領先實現，使聯合客戶能夠在英特爾晶體管最先進的技術和3D-IC封裝能力中實現可擴展的高性能設計，加快推向市場的時間。Cadence Design IP針對英特爾的18A技術包括企業級的PCI Express（PCIe）6.0和計算表達式鏈路（CXL），支持多種標準LPDDR5X/5 8533Mbps的多標準PHY，以實現多樣化的內存應用Universal Chiplet Interconnect Express （UCIe）以提升多芯片系統封裝集成和112G擴展長達的SerDes優異誤碼率（BER）性能“我們與Intel Foundry在3D-IC實現、EDA流程和IP方面的密切合作爲共同開發複雜的AI芯片和電子系統的客戶帶來了顯著的成果，”Cadence的定製IC和PCB Group高級副總裁兼總經理Tom Beckley說。“完整EMIB 2.5D高級封裝流程和其他關鍵里程碑的可用性展示了我們夥伴關係的強大和我們交付下一代系統創新的承諾。”)“系統級探索和優化的挑戰需要從RTL到封裝、板和系統的協同設計和優化，”英特爾foundry的VP＆GM、生態技術辦公室Suk Lee說。“我們依賴Cadence作爲關鍵生態系統合作伙伴之一，在追求成爲AI時代的系統工廠的過程中提供最佳AI驅動的EDA解決方案和IP技術。”Cadence是電子系統設計中的關鍵領導者，憑藉30多年的計算軟件專業知識以建立起來。該公司應用其基礎智能系統設計策略，提供軟件、硬件和IP，並將設計理念變成現實。Cadence的客戶是全球最具創新性的公司，從芯片到電路板再到最具動態市場應用（包括超大規模計算、5G通信、汽車、移動、航空航天、消費、工業和醫療）的完整系統，交付了非凡的電子產品。《財富》雜誌連續10年將Cadence評爲100強公司之一。了解更多請訪問優異誤碼率（BER）性能的112G擴展長達SerDes
"Our close collaboration with Intel Foundry on 3D-IC enablement, EDA flows and IP is yielding significant results for mutual customers developing complex AI-enabling semiconductors and electronic systems," said Tom Beckley, senior vice president and general manager, Custom IC & PCB Group at Cadence. "The availability of the complete EMIB 2.5D advanced packaging flow and other key milestones demonstrate the strength of our partnership and our commitment to delivering next-generation system innovations."
“我們與Intel Foundry在3D-IC實現、EDA流程和IP方面的密切合作爲共同開發複雜的AI芯片和電子系統的客戶帶來了顯著的成果，”Cadence的定製IC和PCB Group高級副總裁兼總經理Tom Beckley說。“完整EMIB 2.5D高級封裝流程和其他關鍵里程碑的可用性展示了我們夥伴關係的強大和我們交付下一代系統創新的承諾。”
"The challenges of system-level exploration and optimization require co-design and co-optimization from RTL through package, board and system," said Suk Lee, VP & GM, Ecosystem Technology Office, Intel Foundry. "We rely on Cadence as one of the key ecosystem partners to deliver best-in-class AI-powered EDA solutions and IP technology in pursuit of our goal to be a systems foundry for the AI era."
“系統級探索和優化的挑戰需要從RTL到封裝、板和系統的協同設計和優化，”英特爾foundry的VP＆GM、生態技術辦公室Suk Lee說。“我們依賴Cadence作爲關鍵生態系統合作伙伴之一，在追求成爲AI時代的系統工廠的過程中提供最佳AI驅動的EDA解決方案和IP技術。”
About Cadence
關於鏗騰：
Cadence is a pivotal leader in electronic systems design, building upon more than 30 years of computational software expertise. The company applies its underlying Intelligent System Design strategy to deliver software, hardware and IP that turn design concepts into reality. Cadence customers are the world's most innovative companies, delivering extraordinary electronic products from chips to boards to complete systems for the most dynamic market applications, including hyperscale computing, 5G communications, automotive, mobile, aerospace, consumer, industrial and healthcare. For 10 years in a row, Fortune magazine has named Cadence one of the 100 Best Companies to Work For. Learn more at cadence.com.
Cadence是電子系統設計中的關鍵領導者，憑藉30多年的計算軟件專業知識以建立起來。該公司應用其基礎智能系統設計策略，提供軟件、硬件和IP，並將設計理念變成現實。Cadence的客戶是全球最具創新性的公司，從芯片到電路板再到最具動態市場應用（包括超大規模計算、5g概念通信、汽車、移動、航空航天、消費、工業和醫療）的完整系統，交付了非凡的電子產品。《財富》雜誌連續10年將Cadence評爲100強公司之一。了解更多請訪問cadence.com.
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