"Intel Has Placed Orders With Multiple Equipment And Material Suppliers For Its Next-Generation Advanced Packaging Based On Glass Substrate Technology, Which Is Expected To Be In Volume Production By 2030, According To Industry Sources" - DigiTimes Alerts
"Intel Has Placed Orders With Multiple Equipment And Material Suppliers For Its Next-Generation Advanced Packaging Based On Glass Substrate Technology, Which Is Expected To Be In Volume Production By 2030, According To Industry Sources" - DigiTimes Alerts
“業內消息人士稱，英特爾已向多家設備和材料供應商訂購其基於玻璃基板技術的下一代先進封裝，預計到2030年將實現批量生產”-DigiTimes Alerts
"Intel Has Placed Orders With Multiple Equipment And Material Suppliers For Its Next-Generation Advanced Packaging Based On Glass Substrate Technology, Which Is Expected To Be In Volume Production By 2030, According To Industry Sources" - DigiTimes Alerts
“業內消息人士稱，英特爾已向多家設備和材料供應商訂購其基於玻璃基板技術的下一代先進封裝，預計到2030年將實現批量生產”-DigiTimes Alerts
譯文內容由第三人軟體翻譯。
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