Earnings Call Summary | BE SEMICONDUCTOR INDUSTRIES NV ORD EUR0.91 (NY REG SHARES)(BESIY.US) Q1 2024 Earnings Conference
Earnings Call Summary | BE SEMICONDUCTOR INDUSTRIES NV ORD EUR0.91 (NY REG SHARES)(BESIY.US) Q1 2024 Earnings Conference
Net income, adjusted for share-based compensation, increased by 15.1% to €49.5 million compared to the same quarter last year.The following is a summary of the BE Semiconductor Industries N.V. (BESIY) Q1 2024 Earnings Call Transcript:
以下是BE半導體工業公司（BESIY）2024年第一季度業績電話會議記錄摘要：
Financial Performance:
財務業績：
BE Semiconductor reported Q1 revenue of €146.3 million, up 9.7% year-on-year.
Order trends decreased by 10.1% compared to Q1 the previous year and declined by 23.3% sequentially.
Net income, adjusted for share-based compensation, increased by 15.1% to €49.5 million compared to the same quarter last year.
Gross margins increased by 3.0 points to 67.2% due to a favorable product mix and net forex benefits.
Expenses were controlled with increased R&D spending to support next-generation product development.
Net cash increased by 60.1% from the year-end to reach €180.9 million.
BE Semiconductor公佈的第一季度收入爲1.463億歐元，同比增長9.7％。
與去年第一季度相比，訂單趨勢下降了10.1％，環比下降了23.3％。
經股份薪酬調整後的淨收入與去年同期相比增長了15.1％，達到4,950萬歐元。
由於良好的產品組合和淨外匯收益，毛利率增長了3.0個百分點至67.2％。
通過增加研發支出來控制開支，以支持下一代產品開發。
淨現金比年底增長了60.1％，達到1.809億歐元。
Business Progress:
業務進展：
BE Semiconductor is expanding its advanced packaging market share in 2.5D, 3D, and photonics applications to cater to expected strong growth for AI-related applications.
The company anticipates orders for 25 to 35 hybrid bonding systems in Q2.
BE Semiconductor is increasing R&D investment in assembly processes to capitalize on anticipated growth in the period 2024, 2025 and 2027.
The company's progress on its hybrid bonders has been positive and a second TC system has recently been shipped and is being installed.
BESIY plans to have the 50 nanometer system ready by the end of 2025 and is evaluating both TCB and hybrid bonding for smartphone applications.
BE Semiconductor正在擴大其在2.5D、3D和光子學應用中的先進封裝市場份額，以滿足人工智能相關應用的預期強勁增長。
該公司預計，第二季度將訂購25至35套混合粘合系統。
BE Semiconductor正在增加對裝配工藝的研發投資，以利用2024、2025年和2027年期間的預期增長。
該公司在混合粘合機方面的進展是積極的，第二套TC系統最近已出貨並正在安裝中。
BESIY計劃在2025年底之前準備好50納米系統，並正在評估智能手機應用的TCB和混合粘合。
Tips: For more comprehensive details, please refer to the IR website. The article is only for investors' reference without any guidance or recommendation suggestions.
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譯文內容由第三人軟體翻譯。
