Revasum (ASX: RVS) Announces a 20%+ Increase in the Productivity of Their Flagship CMP Product for Silicon Carbide Wafer Manufacturing, the 6EZ, Achieved by Implementing Improvements to the Wafer Handling Control Software
Revasum (ASX: RVS) Announces a 20%+ Increase in the Productivity of Their Flagship CMP Product for Silicon Carbide Wafer Manufacturing, the 6EZ, Achieved by Implementing Improvements to the Wafer Handling Control Software
SAN LUIS OBISPO, Calif., July 12, 2023 /PRNewswire/ -- Revasum today announced the release of improvements to the system control software for their flagship silicon carbide CMP tool, 6EZ, which increase the throughput of the system by up to 20%+. The throughput improvements are included in our latest SW release 3.1 and include a number of improvements in the 6EZ wafer handling control software. The upgrade has been successfully deployed on existing 6EZ production systems at the factories of multiple Tier 1 customers. This software significantly reduces the 6EZ's cost of ownership per wafer for our customers.
加利福尼亞州聖路易斯奧比斯波， 2023年7月12日 /PRNewswire/ — Revasum今天宣佈發佈其旗艦碳化硅CMP工具6EZ的系統控制軟件改進版，該工具可將系統的吞吐量提高多達20％以上。吞吐量改進包含在我們最新的軟件版本 3.1 中，還包括 6EZ 晶圓處理控制軟件的多項改進。該升級已成功部署在多個一級客戶工廠的現有 6EZ 生產系統上。該軟件爲我們的客戶顯著降低了6EZ的每塊晶圓的擁有成本。
'The wafer handling control software in previous 6EZ software releases included wafer handling moves that were optimized for some early SiC polishing recipes but were imposing unnecessary constraints for the production recipes that are currently implemented by our customers. By removing these constraints, and implementing other wafer handling improvements, we were able to significantly increase the throughput of the tool without any detrimental impact on tool reliability. We have also ensured that these improvements would not change the excellent process results from the production recipes currently being used by our customers.' Said Bill Kalenian, Vice President of Engineering at Revasum.
“之前發佈的6EZ軟件版本中的晶圓處理控制軟件包括晶圓處理動作，這些動作針對一些早期的碳化硅拋光配方進行了優化，但對我們的客戶目前實施的生產配方施加了不必要的限制。通過消除這些限制並實施其他晶圓處理改進，我們得以顯著提高工具的吞吐量，而不會對工具的可靠性產生任何不利影響。我們還確保這些改進不會改變客戶目前使用的生產配方的出色工藝結果。”說過 比爾·卡萊尼安，Revasum 的工程副總裁。
Revasum (ASX:RVS) Announces a 20%+ increase in productivity of their flagship CMP product for #SiC wafer manufacturing
Revasum (ASX: RVS) 宣佈其用於 #SiC 晶圓製造的旗艦 CMP 產品的生產率提高了 20% 以上
'Since achieving our initial goals of demonstrating reliable high-volume operations and repeatable, high-quality polishing results on hard SiC substrates, it was right time for Revasum to enable higher productivity for our customers as they ramp to higher wafer volumes. SW 3.1 enables a significant increase in productivity, and has a number of other new features that will improve the flexibility and reliability of the 6EZ in high volume production,' said Scott Jewler, Revasum CEO. 'Software version 3.1 has been installed and released to production at multiple leading SiC substrate customers and will ship installed on future orders.'
“自從實現了我們在硬質碳化硅基板上展示可靠的大批量操作和可重複的高質量拋光效果的最初目標以來，現在是Revasum在客戶增加晶圓產量時提高生產率的好時機。SW 3.1可以顯著提高生產率，並具有許多其他新功能，這些功能將提高6EZ在大批量生產中的靈活性和可靠性，” Scott Jewler，Revasum 首席執行官。“軟件版本3.1已在多個領先的碳化硅基板客戶安裝並投入生產，並將根據未來的訂單發貨。”
About Revasum, Inc.:
Revasum specializes in the design and manufacturing of grinding and polishing equipment for semiconductor manufacturing. Revasum has leveraged its significant intellectual property portfolio to develop two flagship products designed from the ground up for silicon carbide. The new products are configurable for SiC wafer sizes up to 200mm.
關於 Revasum, Inc.：
Revasum 專門設計和製造用於半導體制造的研磨和拋光設備。Revasum利用其重要的知識產權組合開發了兩款從頭開始爲碳化硅設計的旗艦產品。新產品可針對最大尺寸爲 200 毫米的 SiC 晶圓進行配置。
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