REVASUM (ASX:RVS) Announces the Release of a 200mm Conversion Kit for Their Flagship 6EZ Silicon Carbide (SiC) Chemical Mechanical Polishing (CMP) Platform
REVASUM (ASX:RVS) Announces the Release of a 200mm Conversion Kit for Their Flagship 6EZ Silicon Carbide (SiC) Chemical Mechanical Polishing (CMP) Platform
SAN LUIS OBISPO, Calif., July 6, 2023 /PRNewswire/ -- Revasum today announced the availability of 200mm SiC wafer polishing capability on the 6EZ platform. The 6EZ has already proven its value in high-volume manufacturing of 150mm SiC substrates and a 200mm conversion kit has now been fully tested and released, giving customers the option of upgrading 6EZ systems in the field.
加利福尼亞州聖路易斯奧比斯波，2023年7月6日/美通社/--Revasum今天宣佈在6EZ平臺上提供200 mm碳化矽晶片拋光能力。6EZ已經在150 mm碳化矽基板的大批量製造中證明瞭其價值，200 mm轉換套件現已經過全面測試和發佈，為客戶提供了在現場升級6EZ系統的選擇。
Dr. Fred Sun, Vice President of R&D and Process Technologies at Revasum said, "While the 6EZ was designed from the start to polish 200mm substrates, due to scarcity of these larger substrates in the market, we had not been able to fully characterize polishing performance on 200mm substrates until recently. The tool performed incredibly well on the 200mm wafers - we achieved the same PV (Pressure x Velocity) operating range that we had seen previously on 150mm SiC wafers, even with a doubling of the surface area under polish."
Dr。弗雷德·孫Revasum研發與工藝技術副總裁總裁說：“雖然6EZ從一開始就是為拋光200 mm基板而設計的，但由於市場上這些較大基板的稀缺性，我們直到最近才能夠完全表徵200 mm基板上的拋光性能。該工具在200 mm晶片上表現得令人難以置信地好--我們在150 mm碳化矽晶片上實現了相同的PV(壓力x速度)工作範圍，即使拋光下的表面積翻了一番。”
The 6EZ is the first single wafer CMP tool designed from the ground up for SiC wafer polishing. The 6EZ's architecture coupled with patented cooling technology allows for the higher downforce and table speeds preferred for CMP of hard materials like SiC. The proprietary ViPRR carrier design secures the wafer while minimizing polishing friction on the pad to allow for reduced pad conditioning, better wafer-to-wafer consistency and extended consumables life.
6EZ是第一個為碳化矽晶片拋光而設計的單晶片化學機械拋光工具。6EZ的結構與專利冷卻技術相結合，可以提供更高的下壓力和工作臺速度，這是碳化矽等硬質材料化學機械拋光的首選。專有的ViPRR托架設計確保了晶片的安全，同時最大限度地減少了襯墊上的拋光莫耳擦，從而減少了襯墊的調節，改善了晶片到晶片的一致性，並延長了耗材的使用壽命。
Scott Jewler, CEO of Revasum said, "We believe that polishing prime SiC wafers requires a different approach to head design than the conventional membrane-based heads. The polishing head should hold the wafer in position while applying controlled pressure to the backside of the wafer to produce a uniform high removal rate with good thermal management. We are very pleased with the 200mm SiC wafer results achieved on the 6EZ and I believe our customers will also appreciate how easy the tool is to maintain in a high-volume production environment at this larger wafer size."
斯科特·朱勒Revasum首席執行官表示：“我們認為，拋光優質碳化矽晶片需要一種不同於傳統薄膜基頭的頭部設計方法。拋光頭應該將晶片保持在適當的位置，同時對晶片背面施加受控壓力，以產生均勻的高去除率和良好的熱管理。我們對6EZ上取得的200 mm碳化矽晶片的結果感到非常滿意，我相信我們的客戶也會意識到，在這種更大的晶片尺寸的大批量生產環境中，該工具是多麼容易保持。”
About Revasum, Inc.:
Revasum specializes in the design and manufacturing of capital equipment used in the semiconductor substrate and device manufacturing process. Our current product portfolio includes the 7AF-HMG grinder and 6EZ CMP platform used to manufacture silicon carbide substrates up to 200mm and the packaging of SiC-based devices for the global semiconductor industry.
Revasum公司簡介：
Revasum專門從事半導體基板和器件製造過程中使用的資本設備的設計和製造。我們目前的產品組合包括用於製造200 mm以下碳化矽襯底的7AF-HMG磨床和6EZ化學機械拋光平臺，以及用於全球半導體行業的碳化矽基器件的封裝。
CONTACT: Bruce Ray, [email protected]
聯繫方式：布魯斯·雷，[受電子郵件保護]
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